IP Library Granted Patent US 12707864
Granted Patent B2
US 12707864 · App. 18/472,115 · Granted Aug 11, 2026

Display device and method of manufacturing the same

Inventors: Hwi Seong Kim (Yongin-si, KR); Dong Hoo Kim (Yongin-si, KR); Ji Hun Park (Yongin-si, KR); Maeng Ha Lee (Yongin-si, KR); Jae Man Lee (Yongin-si, KR)
Assignee: Samsung Display Co., Ltd.
H10K59/873H10K59/1201
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Quick Facts
Patent No.
US 12707864
App. No.
18/472,115
Granted
Aug 11, 2026
Kind
B2
Abstract

A display device includes: a display panel including a semiconductor wafer substrate and an OLED on the semiconductor wafer substrate; an encapsulation substrate on the display panel; a sealing member between the display panel and the encapsulation substrate to couple the display panel with the encapsulation substrate; and a filler surrounded by the sealing member between the display panel and the encapsulation substrate, wherein the sealing member includes: an organic spacer corresponding to at least a portion of a non-display area of the display panel; and a first sealing compensation layer below the organic spacer, wherein a lower surface of the organic spacer directly contacts the first sealing compensation layer.

Claims (45)

1 . A display device comprising:

a display panel including a semiconductor wafer substrate and an OLED on the semiconductor wafer substrate;

an encapsulation substrate on the display panel;

a sealing member between the display panel and the encapsulation substrate to couple the display panel with the encapsulation substrate; and

a filler surrounded by the sealing member between the display panel and the encapsulation substrate,

wherein the sealing member includes:

an organic spacer corresponding to at least a portion of a non-display area of the display panel; and

a first sealing compensation layer below the organic spacer,

wherein a lower surface of the organic spacer directly contacts the first sealing compensation layer.

2 . The display device of claim 1 , wherein the display panel includes:

an encapsulation layer on the OLED;

a color filter on the encapsulation layer; and

a refractive film on the color filter.

3 . The display device of claim 2 , wherein the first sealing compensation layer includes:

a first compensation layer on a same layer as the color filter; and

a second compensation layer on the first compensation layer and on a same layer as the refractive film.

4 . The display device of claim 3 , wherein the lower surface of the organic spacer directly contacts an upper surface of the second compensation layer.

5 . The display device of claim 3 , further comprising a second sealing compensation layer below the first sealing compensation layer.

6 . The display device of claim 5 , wherein the second sealing compensation layer includes at least a third compensation layer on a same layer as at least a portion of a plurality of electrodes included in a transistor below the OLED.

7 . The display device of claim 6 , wherein the plurality of electrodes included in the transistor include a gate electrode, a source electrode and a drain electrode, and

the third compensation layer is on a same layer as at least one of the gate electrode, the source electrode, or the drain electrode.

8 . The display device of claim 6 , wherein the second sealing compensation layer further includes at least a fourth compensation layer between the third compensation layer and the second compensation layer and on a same layer as a connection electrode electrically connecting the transistor with the OLED.

9 . The display device of claim 8 , wherein a lower surface of the first compensation layer directly contacts an upper surface of the fourth compensation layer.

10 . The display device of claim 8 , wherein a plurality of metals in the second sealing compensation layer are floating electrodes that are not electrically connected to a plurality of metals in a display area of the display panel.

11 . A method of manufacturing a display device, the method comprising:

preparing a display panel including a semiconductor wafer substrate and an OLED on the semiconductor wafer substrate;

preparing an encapsulation substrate on which an organic spacer corresponds to at least a portion of a non-display area of the display panel;

coating a filler on one surface of the encapsulation substrate to correspond to a display area of the display panel; and

bonding the encapsulation substrate coated with the filler to the display panel,

wherein a first sealing compensation layer directly contacts the organic spacer in a non-display area of the display panel.

12 . The method of claim 11 , wherein the display panel includes

an encapsulation layer on the OLED;

a color filter on the encapsulation layer; and

a refractive film on the color filter.

13 . The method of claim 12 , wherein preparing the display panel includes, as part of forming the first sealing compensation layer,

forming a first compensation layer on a same layer as the color filter; and

forming a second compensation layer on the first compensation layer and forming the second compensation layer on a same layer as the refractive film.

14 . The method of claim 13 , wherein a lower surface of the organic spacer directly contacts an upper surface of the second compensation layer.

15 . The method of claim 13 , wherein the display panel further includes a second sealing compensation layer below the first sealing compensation layer.

16 . The method of claim 15 , wherein the second sealing compensation layer includes at least a third compensation layer formed on the same layer as at least a portion of a plurality of electrodes included in a transistor below the OLED.

17 . The method of claim 16 , wherein the plurality of electrodes in the transistor include a gate electrode, a source electrode, and a drain electrode, and

preparing the display panel includes forming a third compensation layer on a same layer as at least one of the gate electrode, the source electrode, or the drain electrode as part of forming the second sealing compensation layer.

18 . The method of claim 16 , wherein the forming the second sealing compensation layer further includes forming at least a fourth compensation layer between the third compensation layer and the second compensation layer on the same layer as a connection electrode electrically connecting the transistor with the OLED.

19 . The method of claim 18 , wherein a lower surface of the first compensation layer directly contacts an upper surface of the fourth compensation layer.

20 . The method of claim 18 , wherein a plurality of metals included in the second sealing compensation layer are floating electrodes that are not electrically connected to a plurality of metals in a display area of the display panel.