Method of manufacturing display device
A method of manufacturing a display device includes: forming an encapsulation layer on a display panel, forming an uncured resin layer on the encapsulation layer, applying beads on a surface of the uncured resin layer and forming a protective layer by curing the uncured resin layer.
1 . A method of manufacturing a display device, the method comprising:
forming an encapsulation layer on a display panel;
forming an uncured resin layer on the encapsulation layer;
applying beads on a surface of the uncured resin layer; and
forming a protective layer by curing the uncured resin layer,
wherein the uncured resin layer includes a central portion and an edge portion surrounding the central portion, and the beads are applied on the edge portion and not applied on the central portion.
2 . The method of claim 1 , wherein a total surface area formed by exposed portions of the beads and the surface of the uncured resin layer is increased due to the beads.
3 . The method of claim 1 , wherein at least a portion of each of the beads is exposed on the surface of the uncured resin layer.
4 . The method of claim 2 , wherein the beads form concavo-convex shapes on the surface of the uncured resin layer to increase the total surface area.
5 . The method of claim 1 , wherein each of the beads includes at least one of silicon (Si), alumina (AlOx), rubber, and metal.
6 . The method of claim 1 , wherein each of the beads has a spherical or polygonal structure.
7 . The method of claim 1 , wherein a diameter of each of the beads is in a range of about 5 micrometers to about 80 micrometers.
8 . The method of claim 1 , further comprising:
peeling off the protective layer using a peeling tape.
9 . The method of claim 8 , wherein the peeling tape is attached to a surface of the protective layer on which the beads are applied.
10 . The method of claim 8 , wherein the peeling tape is attached to the edge portion of the protective layer.
11 . The method of claim 8 , wherein a peeling force between the peeling tape and the protective layer is controlled according to a total number of the beads.
12 . The method of claim 11 , wherein the peeling force between the peeling tape and the protective layer increases as the total number of the beads increases.
13 . The method of claim 8 , wherein a peeling force between the peeling tape and the protective layer is controlled according to a diameter of each of the beads.
14 . The method of claim 13 , wherein the peeling force between the peeling tape and the protective layer increases as the diameter of each of the beads increases.
15 . The method of claim 1 , wherein the protective layer includes the surface exposed to an outside and a bottom surface contacting a surface of the encapsulation layer, and
an end of the surface exposed to the outside and an end of the bottom surface are connected to each other.
16 . The method of claim 15 , wherein a length between the surface exposed to the outside and the bottom surface in a thickness direction decreases toward an end of the protective layer.
17 . The method of claim 1 , wherein the forming of the uncured resin layer is performed by an inkjet method.
18 . The method of claim 1 , wherein the applying of the beads includes,
injecting air;
injecting the beads;
mixing the air with the beads; and
discharging the air and the beads.
19 . The method of claim 1 , wherein the display panel is formed on a carrier substrate, and
an angle between a major surface of the carrier substrate and a direction in which the beads are discharged is in a range of about 45 degrees to about 135 degrees.