Brush assembly and wafer cleaning device including the same

1 . A brush assembly configured to clean a wafer, comprising

a first brush comprising:

a first body that is cylindrical; and

a first vertical gear connected to a surface of the cylindrical first body that faces a third body, the first vertical gear being configured to rotate in a first vertical direction;

a second brush comprising:

a first horizontal gear configured to rotate in a first horizontal direction; and

a second body connected to a lower portion of the first horizontal gear and rotatably connected to the first body; and

a third brush comprising a second vertical gear connected to a surface of the third body that faces the first body, the second vertical gear being configured to rotate in a second vertical direction that is opposite to the first vertical direction,

wherein the first horizontal gear is engaged with a lower portion of the first vertical gear and a lower portion of the second vertical gear at right angles.

2 . The brush assembly of claim 1 , wherein the second brush further comprises a first vertical axel passing through a center of the first horizontal gear; and

wherein the first vertical axel is provided on a central surface of the second body.

3 . The brush assembly of claim 1 , wherein a diameter of the first vertical gear is substantially the same as a diameter of the second vertical gear, and

wherein a diameter of the first horizontal gear is substantially the same as the diameter of the first vertical gear or the diameter of the second vertical gear.

4 . The brush assembly of claim 1 , wherein the second brush further comprises:

a second horizontal gear engaged with an upper portion of the first vertical gear and an upper portion of the second vertical gear, and at right angles, such that the second horizontal gear is configured to rotate in a second horizontal direction that is opposite to the first horizontal direction; and

a first support body connected to an upper portion of the second horizontal gear.

5 . The brush assembly of claim 4 , wherein the second brush further comprises a second vertical axel passing through centers of the first support body, the second horizontal gear, and the first horizontal gear, the second vertical axel being provided on a central surface of the second body.

6 . The brush assembly of claim 4 , wherein a diameter of the first vertical gear is substantially the same as a diameter of the second vertical gear,

wherein a diameter of the first horizontal gear is substantially the same as a diameter of the second horizontal gear, and

wherein the diameter of the first vertical gear or the diameter of the second vertical gear is substantially the same as the diameter of the first horizontal gear or the diameter of the second horizontal gear.

7 . A wafer cleaning device, comprising:

a first brush assembly provided on an upper surface of a wafer; and

a second brush assembly provided on a lower surface of the wafer and facing the first brush assembly,

wherein the first brush assembly comprises:

a first brush comprising:

a first body that is cylindrical; and

a first vertical gear that is connected to a surface of the first body that faces a third body, the first vertical gear being configured to rotate in a first vertical direction;

a second brush comprising:

a first horizontal gear configured to rotate in a first horizontal direction; and

a second body connected to a lower portion of the first horizontal gear and rotatably connected to the first body; and

a third brush comprising a second vertical gear connected to a surface of the third body that faces the first body, the second vertical gear being configured to rotate in a second vertical direction that is opposite to the first vertical direction,

wherein the first horizontal gear is engaged with a lower portion of the first vertical gear and a lower portion of the second vertical gear at right angles, and

wherein the second brush assembly further comprises a fourth brush comprising a cylindrical body configured to rotate in the second vertical direction.

8 . The wafer cleaning device of claim 7 , wherein the second brush further includes a first vertical axel passing through a center of the first horizontal gear and provided on a center of the second body.

9 . The wafer cleaning device of claim 7 , wherein a diameter of the first vertical gear is substantially the same as a diameter of the second vertical gear, and

wherein a diameter of the first horizontal gear is substantially the same as the diameter of the first vertical gear or the diameter of the second vertical gear.

10 . The wafer cleaning device of claim 7 , wherein the second brush further comprises:

a second horizontal gear engaged with an upper portion of the first vertical gear and an upper portion of the second vertical gear at right angles, the second horizontal gear being configured to rotate in a second horizontal direction that is opposite to the first horizontal direction; and

a first support body connected to an upper portion of the second horizontal gear.

11 . The wafer cleaning device of claim 10 , wherein the second brush further comprises a first vertical axel passing through centers of the first support body, the second horizontal gear, and the first horizontal gear, and

wherein the first vertical axel is provided on a central surface of the second body.

12 . The wafer cleaning device of claim 10 , wherein a diameter of the first vertical gear is substantially the same as a diameter of the second vertical gear,

wherein a diameter of the first horizontal gear is substantially the same as a diameter of the second horizontal gear, and

wherein the diameter of the first vertical gear or the second vertical gear is substantially the same as the diameter of the first horizontal gear or the second horizontal gear.

13 . A wafer cleaning device, comprising:

a first brush assembly provided on an upper surface of a wafer; and

a second brush assembly provided on a lower surface of the wafer and facing the first brush assembly,

wherein the first brush assembly comprises:

a first brush comprising:

a first body that is cylindrical; and

a first vertical gear connected to a surface of the first body that faces a third body, the first vertical gear being configured to rotate in a first vertical direction;

a second brush comprising:

a first horizontal gear configured to rotate in a first horizontal direction, and

a second body connected to a lower portion of the first horizontal gear and rotatably connected to the first body; and

a third brush comprising a second vertical gear connected to a surface of the third body that faces the first body, the third brush being configured to rotate in a second vertical direction that is opposite to the first vertical direction,

wherein the first horizontal gear is engaged with a lower portion of the first vertical gear and a lower portion of the second vertical gear at right angles,

wherein the second brush assembly comprises:

a fourth brush comprising:

a fourth body that is cylindrical; and

a third vertical gear connected to a surface of the fourth body that faces a sixth body, the third vertical gear being configured to rotate in the second vertical direction;

a fifth brush comprising:

a third horizontal gear configured to rotate in a second horizontal direction that is opposite to the first horizontal direction, and

a fifth body connected to an upper portion of the third horizontal gear and rotatably connected to the fourth body; and

a sixth brush comprising a fourth vertical gear connected to a surface of the sixth body that faces the fourth body, the fourth vertical gear being configured to rotate in the first vertical direction, and

wherein the third horizontal gear is engaged with an upper portion of the third vertical gear and an upper portion of the fourth vertical gear at right angles.

14 . The wafer cleaning device of claim 13 , wherein the second brush further comprises a first vertical axel passing through a center of the first horizontal gear and provided on a central surface of the second body, and

wherein the fifth brush further comprises a second vertical axel passing through a center of the third horizontal gear and provided on a central surface of the fifth body.

15 . The wafer cleaning device of claim 13 , wherein a diameter of the first vertical gear is substantially the same as a diameter of the second vertical gear,

wherein a diameter of the first horizontal gear is substantially the same as the diameter of the first vertical gear or the diameter of the second vertical gear,

wherein a diameter of the third vertical gear is substantially the same as a diameter of the fourth vertical gear, and

wherein a diameter of the third horizontal gear is substantially the same as the diameter of the third vertical gear or the diameter of the fourth vertical gear.

16 . The wafer cleaning device of claim 13 , wherein the second brush further comprises:

a second horizontal gear engaged with an upper portion of the first vertical gear and an upper portion of the second vertical gear at right angles, the second horizontal gear being configured to rotate in the second horizontal direction; and

a first support body connected to an upper portion of the second horizontal gear, and

wherein the fifth brush further comprises:

a fourth horizontal gear engaged with a lower portion of the third vertical gear and a lower portion of the fourth vertical gear at right angles, the fourth horizontal gear being configured to rotate in the first horizontal direction; and

a second support body connected to a lower portion of the fourth horizontal gear.

17 . The wafer cleaning device of claim 16 , wherein the second brush further comprises a first vertical axel passing through centers of the first support body, the second horizontal gear, and the first horizontal gear, the first vertical axel being provided on a central surface of the second body, and

wherein the fifth brush further comprises a second vertical axel passing through centers of the second support body, the fourth horizontal gear, and the third horizontal gear, the second vertical axel being provided on a central surface of the fifth body.

18 . The wafer cleaning device of claim 16 , wherein the first vertical gear, the second vertical gear, the first horizontal gear, and the second horizontal gear have substantially the same diameter, and

wherein the third vertical gear, the fourth vertical gear, the third horizontal gear, and the fourth horizontal gear have substantially the same diameter.

19 . The wafer cleaning device of claim 16 , wherein a diameter of the first vertical gear is substantially the same as a diameter of the second vertical gear,

wherein a diameter of the first horizontal gear is substantially the same as a diameter of the second horizontal gear, and

wherein the diameter of the first horizontal gear or the diameter of the second horizontal gear is greater than the diameter of the first vertical gear or the diameter of the second vertical gear.

20 . The wafer cleaning device of claim 16 , wherein a diameter of the first vertical gear is substantially the same as the second vertical gear,

wherein a diameter of the first horizontal gear is substantially the same as a diameter of the second horizontal gear, and

wherein the diameter of the first horizontal gear or the diameter of the second horizontal gear is less than the diameter of the first vertical gear or the diameter of the second vertical gear.