Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
A technique that includes: a transfer chamber including a transfer space in which a substrate loaded from a substrate accommodation container is transferred; a gas circulation path connecting both ends of the transfer space; a fan in the gas circulation path for circulating atmosphere in the transfer space and the gas circulation path; a loading port through which the substrate is loaded into the transfer space; a side surface opening provided on at least one side surface putting therebetween a side surface of the transfer chamber provided with the loading port, among a plurality of side surfaces forming the transfer chamber, the side surface opening communicating with the transfer space; a door for closing the side surface opening; and a circulation duct movable integrally with the door and provided to constitute the gas circulation path in a state where the door is closed.
1 . A substrate processing apparatus comprising:
a transfer chamber including a transfer space in which a substrate loaded in from a substrate accommodation container is transferred;
a gas circulation path connecting one end and another end of the transfer space;
a fan provided in the gas circulation path or at an end part of the gas circulation path and configured to circulate an atmosphere in the transfer space and the gas circulation path;
a loading port through which the substrate is loaded into the transfer space from the substrate accommodation container;
a side surface opening provided on at least one side surface of both side surfaces putting therebetween a side surface of the transfer chamber provided with the loading port, among a plurality of side surfaces forming the transfer chamber, the side surface opening communicating with the transfer space;
a door provided to close the side surface opening;
a circulation duct fixed to the door and movable integrally with the door and provided to constitute the gas circulation path in a state where the door is closed;
a buffer space above the transfer space, the buffer space constituting a portion of the gas circulation path and being in fluid communication with the transfer space via the fan;
a sealer provided on at least one of (i) an edge of an upper end opening of the circulation duct or (ii) an edge of an opening of the buffer space that connects to the circulation duct; and
wherein the circulation duct is connected to the buffer space via the sealer in a state where the door is closed.
2 . The substrate processing apparatus according to claim 1 , wherein:
an upper end of the side surface opening and an upper end of the circulation duct are provided so as to extend at least to a height at which an opening of the buffer space connected to the circulation duct is provided.
3 . The substrate processing apparatus according to claim 2 , wherein:
a filter is provided at least one of above and below the fan, and the filter is arranged at a height at which the side surface opening and the circulation duct exist.
4 . The substrate processing apparatus according to claim 3 , wherein:
a side surface of the filter faces the side surface opening.
5 . The substrate processing apparatus according to claim 4 , wherein:
the filter is configured to be attachable/detachable via the side surface opening by being movable in a horizontal direction.
6 . The substrate processing apparatus according to claim 1 , wherein:
a purge gas supply system that supplies a purge gas is connected to the buffer space.
7 . The substrate processing apparatus according to claim 1 , wherein:
the door is configured to be openable/closable in a horizontal direction about a rotation axis arranged in a vertical direction.
8 . The substrate processing apparatus according to claim 1 , wherein:
a side surface facing a side surface of the transfer chamber provided with the loading port, among the plurality of side surfaces forming the transfer chamber, is provided with an unloading port through which the substrate is unloaded out of the transfer space.
9 . The substrate processing apparatus according to claim 1 , wherein:
a lower part of the transfer space is provided with a second buffer space constituting the gas circulation path.
10 . The substrate processing apparatus according to claim 9 , wherein:
at least any of an edge of a lower end opening of the circulation duct or an edge of an opening of the second buffer space connected to the circulation duct is provided with a second sealer, and the circulation duct is connected to an opening of the second buffer space via the second sealer in a state where the door is closed.
11 . The substrate processing apparatus according to claim 1 , wherein:
the door and the circulation duct are provided with a transparent window through which the inside of the transfer space can be visually recognized.
12 . A method for processing a substrate using the substrate processing apparatus of claim 1 , the method comprising:
circulating the atmosphere in the transfer space and the gas circulation path by the fan;
loading, from the loading port into the transfer space, the substrate accommodated in the substrate accommodation container in a state where the atmosphere in the transfer space is circulated by the fan; and
transferring the substrate in the transfer space.
13 . A non-transitory computer-readable recording medium storing a program, the program when executed by a controller for the substrate processing apparatus of claim 1 , causes the substrate processing apparatus to perform a method comprising:
circulating the atmosphere in the transfer space and the gas circulation path by the fan;
loading, from the loading port into the transfer space, the substrate accommodated in the substrate accommodation container in a state where the atmosphere in the transfer space is circulated by the fan; and
transferring the substrate in the transfer space.
14 . A method for manufacturing a semiconductor device, comprising:
performing the method according to claim 12 on the substrate.
15 . The substrate processing apparatus according to claim 5 , wherein the filter is made up of a plurality of filters, each of which is configured to be independently operable in the horizontal direction.
16 . The substrate processing apparatus according to claim 1 , wherein the side surface openings are provided on both sides of the transfer chamber, and the door is provided at each of the side openings.
17 . The substrate processing apparatus according to claim 3 , wherein the fan and the filter are disposed above the transfer space at laterally opposite sides of the transfer chamber.