IP Library Granted Patent US 12707930
Granted Patent B2
US 12707930 · App. 18/894,512 · Granted Aug 11, 2026

Wafer storage container processing apparatus

Inventors: Junji Ishihara (Kanagawa, JP); Hisaaki Miyasako (Kanagawa, JP); Yukinobu Nishibe (Kanagawa, JP)
Assignee: SHIBAURA MECHATRONICS CORPORATION
H10P72/1924H10P72/1914
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Quick Facts
Patent No.
US 12707930
App. No.
18/894,512
Granted
Aug 11, 2026
Kind
B2
Abstract

According to one embodiment, a wafer storage container processing apparatus that processes a wafer storage container including a body having a storage space connected to an opening and a door detachable from the opening, includes a stage having a disposition surface on which the wafer storage container is disposed; and a gas supply configured to supply an inert gas to the wafer storage container disposed on the stage. The stage disposes the wafer storage container such that the door is disposed on the disposition surface in a state where the door is attached to the body, and the gas supply supplies the inert gas through a gas supply port provided on an intersecting surface of the body that intersects a surface having the opening.

Claims (25)

1 . An apparatus for processing a wafer storage container, the wafer storage container including a body having a storage space connected to an opening, and a door detachable from the opening,

the apparatus comprising:

a stage having a disposition surface on which the wafer storage container is disposed;

a gas supply including a gas supply nozzle that is provided on the stage and configured to supply an inert gas to the wafer storage container disposed on the stage;

a gas collector including:

a recovery tank;

a groove formed in the stage and communicating with a gap formed between the body and the door when the door is attached to the body;

a gas discharge port provided on the intersecting surface of the body; and

a pipe connected between the groove and the recovery tank such that gas flowing through the gap is guided from the groove to the recovery tank through the pipe,

wherein gas present in the storage space and replaced by the inert gas supplied from the gas supply is discharged from the storage space during supply of the inert gas by at least one of leaking through the gap and being discharged through the gas discharge port, and

the recovery tank collects gas leaking through the gap and gas being discharged through the gas discharge port,

wherein the gas supply nozzle is connected to a gas supply port provided on an intersecting surface of the body that intersects a surface having the opening, and

the stage supports the wafer storage container such that the door remains attached to the body and is disposed to face downwards on the disposition surface.

2 . The apparatus for processing the wafer storage container according to claim 1 , wherein the stage includes a locking and unlocking latch configured to lock and unlock the door with respect to the body when the door is disposed on the disposition surface.

3 . The apparatus for processing the wafer storage container according to claim 1 , further comprising:

a cleaning tank provided adjacent to the stage and configured to clean the storage space after supply of the inert gas is stopped and the door is separated from the body.

4 . The apparatus for processing the wafer storage container according to claim 1 , further comprising

a gauge mounted in the recovery tank and configured to measure at least one of the oxygen concentration and the humidity of a mixed gas of gas collected in the recovery tank.

5 . The apparatus for processing the wafer storage container according to claim 4 , further comprising:

a controller connected to the gas supply and the gauge and configured to control the gas supply and the gauge; and

a flow meter configured to measure a flow rate of the gas leaking through the gap,

wherein, the controller controls the gas supply to stop supplying the inert gas from the gas supply when at least one of the oxygen concentration and the humidity measured by the gauge falls below a predetermined value, and

when the flow rate of the gas measured by the flow meter is equal to or greater than a predetermined threshold, the controller outputs information indicating that the gas is leaking through the gap.

6 . The apparatus for processing the wafer storage container according to claim 1 , wherein the body of the wafer storage container includes a plurality of shelves disposed parallel to each other, each having a planar shape and on which a plurality of wafers are respectively disposed, and

the stage supports the wafer storage container such that the door is disposed to face downwardly with the plurality of shelves extending vertically.