IP Library Granted Patent US 12707939
Granted Patent B2
US 12707939 · App. 18/650,491 · Granted Aug 11, 2026

Substrate holder systems

Inventors: Chenfei Hu (Milpitas, CA); Chao Liu (San Jose, CA); Chien-Min Liao (San Jose, CA); Marc David Shull (Los Gatos, CA); Michael Kutney (Santa Cruz, CA); Thomas K. Cho (Los Altos, CA); Christopher Laurent Beaudry (San Jose, CA)
Assignee: Applied Materials, Inc.
H10P72/7624H10P72/7616
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Quick Facts
Patent No.
US 12707939
App. No.
18/650,491
Granted
Aug 11, 2026
Kind
B2
Abstract

Embodiments described herein relate to substrate holder systems. An apparatus includes a substrate holder having a surface to receive a substrate. The surface has a texture that causes an optical beam incident on the surface to scatter in at least one direction away from an optical detector to be located above the substrate holder.

Claims (33)

1 . An apparatus comprising:

a substrate holder of a metrology system, the substrate holder having a surface to receive a substrate, wherein the surface comprises:

a structural element defined by a pattern of shapes; and

a porous material element disposed on the structural element;

wherein the structural element and the porous material element define a texture that causes an optical beam to be scattered in at least one direction away from an optical detector located above the substrate holder.

2 . The apparatus of claim 1 , wherein the substrate holder comprises a chuck.

3 . The apparatus of claim 1 , further comprising:

the substrate secured to the substrate holder; and

a patterning film disposed on the substrate.

4 . The apparatus of claim 1 , wherein at least one of the structural element or the porous material element comprises nickel.

5 . The apparatus of claim 1 , wherein the structural element is defined by a needle pattern.

6 . The apparatus of claim 1 , wherein the structural element is defined by a honeycomb pattern.

7 . The apparatus of claim 1 , wherein the structural element is defined by a periodical pattern.

8 . The apparatus of claim 1 , wherein the surface further comprises a passivation layer.

9 . The apparatus of claim 8 , wherein the passivation layer comprises nickel fluoride.

10 . A metrology system comprising:

a substrate holder having a surface to receive a substrate, wherein the surface comprises structural element defined by a pattern of shapes, and a porous material element disposed on the structural element; and

an optical detector located above the substrate holder;

wherein the structural element and the porous material element define a texture that causes an optical beam to be scattered in at least one direction away from the optical detector.

11 . The metrology system of claim 10 , wherein the substrate holder comprises a chuck.

12 . The metrology system of claim 10 , further comprising:

the substrate secured to the substrate holder; and

a patterning film disposed on the substrate.

13 . The metrology system of claim 10 , wherein the structural element is defined by one of: a needle pattern, a honeycomb pattern, or a periodical pattern.

14 . The metrology system of claim 10 , wherein the surface further comprises a passivation layer.

15 . The metrology system of claim 14 , wherein at least one of the structural element or the porous material element comprises nickel, and wherein the passivation layer comprises nickel fluoride.

16 . A method comprising:

obtaining a base material; and

forming, from the base material, a substrate holder of a metrology system, wherein the substrate holder comprises a surface comprising a structural element defined by a pattern of shapes, and a porous material element disposed on the structural element, and wherein the structural element and the porous material element define a texture that causes an optical beam to be scattered in at least one direction away from an optical detector located above the substrate holder.

17 . The method of claim 16 , wherein forming the substrate holder from the base material comprises forming at least a portion of the substrate holder using additive manufacturing.

18 . The method of claim 16 , wherein forming the substrate holder further comprises passivating the surface to form a passivation layer.

19 . The method of claim 18 , wherein passivating the surface of the substrate holder to form the passivation layer comprises using direct fluorination to fluorinate the surface.

20 . The method of claim 18 , wherein passivating the surface of the substrate holder to form the passivation layer comprises oxidizing the surface to form an oxide layer, and fluorinating the oxide layer.