Bonding surface validation on dicing tape
View Patent ↗The disclosed technology relates to methods for forming and/or validating bonding surfaces of integrated device dies mounted on a dicing tape, and dicing tapes used thereof. In some embodiments, such a method for forming and validating a microelectronic assembly may include mounting a substrate to a dicing tape; singulating the substrate while the substrate is mounted to the dicing tape to form a plurality of dies; and validating a bonding surface of at least one die of the plurality of dies while the at least one die is mounted to the dicing tape. In some embodiments, such a dicing tape may include an anti-static adhesive layer arranged on an anti-static base film.
1 . A method of forming a microelectronic assembly, comprising:
mounting a substrate to an anti-static dicing tape, the anti-static dicing tape comprising an anti-static adhesive layer; and
singulating through the substrate and partially through the anti-static adhesive layer to form a plurality of dies.
2 . The method of claim 1 , further comprising planarizing the substrate before mounting the substrate to the anti-static dicing tape.
3 . The method of claim 1 , further comprising preparing bonding surfaces of the plurality of dies while the plurality of dies are mounted to the anti-static dicing tape, including activating the bonding surfaces of the plurality of dies.
4 . The method of claim 1 , further comprising picking up at least one die from the anti-static dicing tape and directly bonding the at least one die to an element without an intervening adhesive.
5 . The method of claim 1 , wherein the anti-static dicing tape comprises an ultraviolet (UV)-sensitive or pressure-sensitive adhesive layer.
6 . The method of claim 1 , further comprising
validating a bonding surface of at least one die of the plurality of dies while the at least one die is mounted to the anti-static dicing tape.
7 . The method of claim 6 , further comprising electrically grounding the anti-static dicing tape during validation of the bonding surface of the at least one die.
8 . The method of claim 6 , wherein validating the bonding surface of the at least one die comprises measuring a conductive pad recess of the bonding surface of the at least one die by a metrological device.
9 . The method of claim 6 , wherein validating the bonding surface of the at least one die comprises measuring a surface roughness of the bonding surface of the at least one die by a metrological device.
10 . The method of claim 1 , wherein singulating through the substrate comprises partially dicing through a conductive region of the anti-static dicing tape.
11 . The method of claim 1 , wherein the thickness of the anti-static adhesive layer is greater than 10 μm.
12 . A method of forming a microelectronic assembly, comprising:
mounting a substrate to an anti-static dicing tape, the anti-static dicing tape comprising an anti-static adhesive layer;
singulating through the substrate and partially through the anti-static adhesive layer to form a plurality of dies; and
validating a bonding surface of at least one die of the plurality of dies while the at least one die is mounted to the anti-static dicing tape.
13 . The method of claim 12 , wherein singulating through the substrate comprises partially dicing through a conductive region of the anti-static dicing tape.
14 . The method of claim 12 , further comprising electrically grounding the anti-static dicing tape during validation of the bonding surface of the at least one die.
15 . The method of claim 12 , wherein validating the bonding surface of the at least one die comprises measuring a conductive pad recess of the bonding surface of the at least one die by a metrological device.
16 . The method of claim 12 , wherein validating the bonding surface of the at least one die comprises measuring a surface roughness of the bonding surface of the at least one die by a metrological device.
17 . A method of forming a microelectronic assembly, comprising:
mounting a substrate to an anti-static dicing tape, the anti-static dicing tape comprising an anti-static adhesive layer;
singulating through the substrate and partially through the anti-static adhesive layer to form a plurality of dies, wherein singulating through the substrate comprises partially dicing through a conductive region of the anti-static dicing tape.
18 . The method of claim 17 , further comprising validating a bonding surface of at least one die of the plurality of dies while the at least one die is mounted to the anti-static dicing tape.
19 . The method of claim 18 , further comprising electrically grounding the anti-static dicing tape during validation of the bonding surface of the at least one die.