Semiconductor device
A semiconductor device includes a package substrate, a package component and at least one adhesive pattern. The package component has a thermal interface material (TIM) layer thereon. The adhesive pattern has a first surface facing the package substrate and a second surface opposite to the first surface, and the second surface of the at least one adhesive pattern is substantially coplanar with a surface of the TIM layer.
1 . A semiconductor device, comprising:
a package substrate;
a package component, bonded to the package substrate;
a lid, comprising a first portion adhered to the package substrate through an adhesive layer and a second portion connecting to the first portion and covering the package component; and
a plurality of first adhesive patterns, wherein the first adhesive patterns are adhered to and disposed between the package substrate and the second portion of the lid, the first adhesive patterns are disposed at a first side of the package component, and at least two of the first adhesive patterns are physically separated from each other and substantially aligned with each other in a first direction along which the first side is extended.
2 . The semiconductor device of claim 1 , wherein a material of the first adhesive patterns is substantially the same as a material of the adhesive layer.
3 . The semiconductor device of claim 1 , wherein a material of the first adhesive patterns comprises epoxy-based material, silicone-based material, a metal-based material or a combination thereof.
4 . The semiconductor device of claim 1 , wherein one of the first adhesive patterns has a portion in direct contact with the lid, and a width of the portion increases as the top portion becomes closer to the lid.
5 . The semiconductor device of claim 1 , further comprising a thermal interface material (TIM) layer between the package component and the second portion of the lid.
6 . The semiconductor device of claim 5 , wherein a height of the first adhesive patterns is substantially the same as a thickness of the TIM layer and the package component.
7 . The semiconductor device of claim 1 , wherein a total length of the first adhesive patterns is substantially the same as a length of the first side of the package component in the first direction.
8 . The semiconductor device of claim 1 , further comprising a plurality of second adhesive patterns disposed at a second side opposite to the first side of the package component and physically separated from one another.
9 . The semiconductor device of claim 1 , further comprising at least one passive device disposed between the first adhesive patterns and the package component.
10 . The semiconductor device of claim 1 , wherein the adhesive layer comprises a vent.
11 . The semiconductor device of claim 1 , wherein the adhesive layer is continuously disposed at the first side, a second side opposite to the first side and a third side different from the first and second sides.
12 . A semiconductor device, comprising:
a package substrate;
a package component having a thermal interface material (TIM) layer thereon, and having a first side and a second side physically connecting to the first side;
a lid, adhered to the package substrate through an adhesive layer;
a plurality of first adhesive patterns, disposed at the first side of the package component, and disposed between the adhesive layer and the package component, wherein a distance between one of the first adhesive patterns and the first side of the package component is substantially equal to a distance between another of the first adhesive patterns and the first side of the package component; and
at least one second adhesive pattern, disposed at the second side of the package component, and disposed between the adhesive layer and the package component.
13 . The semiconductor device of claim 12 , wherein the at least one second adhesive pattern comprises a plurality of second adhesive patterns.
14 . The semiconductor device of claim 12 , further comprising at least one third adhesive pattern disposed at a third side opposite to the first side of the package component and at least one fourth adhesive pattern disposed at a fourth side opposite to the second side of the package component.
15 . The semiconductor device of claim 12 , wherein at least one of the first adhesive patterns and the at least one second adhesive pattern are physically separated.
16 . A semiconductor device, comprising:
a package substrate;
a package component, bonded to the package substrate;
a lid, adhered to the package substrate through an adhesive layer; and
a plurality of first adhesive patterns, wherein the first adhesive patterns are arranged along a first side of the package component, and at least two of the first adhesive patterns are physically separated from each other and substantially aligned with each other in a first direction along which the first side is extended.
17 . The semiconductor device of claim 16 , wherein a distance between one of the first adhesive patterns and the first side of the package component is substantially equal to a distance between another of the first adhesive patterns and the first side of the package component.
18 . The semiconductor device of claim 16 , further comprising an underfill between the package substrate and the package component, wherein the underfill is disposed between the package component and the first adhesive patterns and physically separated from the first adhesive patterns.
19 . The semiconductor device of claim 16 , further comprising an underfill between the package substrate and the package component, wherein the first adhesive patterns are disposed on and in direct contact with the underfill.
20 . The semiconductor device of claim 16 , wherein the first adhesive patterns cover an edge of the underfill on a sidewall of the package component.