Manufacturing method of semiconductor package including cutting heat dissipation sheet into a plurality of heat dissipation films

1 . A manufacturing method of a semiconductor package, comprising:

providing an encapsulated semiconductor package on a substrate;

cutting a heat dissipation sheet into a plurality of heat dissipation films;

attaching the plurality of heat dissipation films on the encapsulated semiconductor package, wherein the plurality of heat dissipation films are arranged in an array manner with a gap between adjacent two of the plurality of heat dissipation films and jointly cover an upper surface of the encapsulated semiconductor package; and

providing a cover lid on the substrate, wherein the cover lid is in contact with the plurality of heat dissipation films.

2 . The manufacturing method of the semiconductor package as claimed in claim 1 , wherein providing the encapsulated semiconductor package on the substrate further comprises:

mounting the encapsulated semiconductor package on the substrate through a plurality of electrical connectors.

3 . The manufacturing method of the semiconductor package as claimed in claim 1 , wherein providing the encapsulated semiconductor package on the substrate further comprises:

providing at least one semiconductor device on a redistribution structure;

providing an encapsulating material on the redistribution structure, wherein the encapsulating material encapsulates the at least one semiconductor device.

4 . The manufacturing method of the semiconductor package as claimed in claim 3 , wherein providing the encapsulated semiconductor package on the substrate further comprises:

performing a planarization process on the encapsulating material, such that a top surface of the encapsulating material is coplanar with a top surface of the at least one semiconductor device, wherein the plurality of heat dissipation films are in contact with the top surface of the at least one semiconductor device.

5 . The manufacturing method of the semiconductor package as claimed in claim 3 , wherein the at least one semiconductor device comprises a plurality of semiconductor devices arranged in a side by side manner and two of the plurality of the heat dissipation films jointly cover one of the plurality of the semiconductor devices.

6 . The manufacturing method of the semiconductor package as claimed in claim 1 , wherein sizes of the plurality of heat dissipation films, from a top view, are the same.

7 . The manufacturing method of the semiconductor package as claimed in claim 1 , wherein attaching the plurality of heat dissipation films on the encapsulated semiconductor package further comprises:

attaching at least one first heat dissipation film on a first portion of the encapsulated semiconductor package; and

attaching at least one second heat dissipation film on a second portion of the encapsulated semiconductor package.

8 . The manufacturing method of the semiconductor package as claimed in claim 7 , wherein the at least one first heat dissipation film and the at least one second heat dissipation film are disposed in a side-by-side manner.

9 . The manufacturing method of the semiconductor package as claimed in claim 7 , wherein a thickness of the at least one first heat dissipation film is different from that of the at least one second heat dissipation film.

10 . The manufacturing method of the semiconductor package as claimed in claim 7 , wherein a viscosity of the at least one first heat dissipation film is different from that of the at least one second heat dissipation film.

11 . A manufacturing method of a semiconductor package, comprising:

providing a semiconductor package on a substrate;

cutting a heat dissipation sheet into a plurality of heat dissipation films;

attaching the plurality of heat dissipation films on the semiconductor package, wherein each of the heat dissipation films comprises thermally conductive material mixed with electrically insulating material, and the plurality of heat dissipation films are arranged in an array manner with a gap between adjacent two of the plurality of heat dissipation films and jointly cover an upper surface of the encapsulated semiconductor package; and

providing a cover lid on the substrate, wherein the cover lid is in contact with the plurality of heat dissipation films.

12 . The manufacturing method of the semiconductor package as claimed in claim 11 , wherein providing the semiconductor package on the substrate further comprises:

providing at least one semiconductor device on an interposer; and

providing an encapsulating material on the interposer, wherein the encapsulating material encapsulates the at least one semiconductor device.

13 . The manufacturing method of the semiconductor package as claimed in claim 12 , wherein providing the encapsulated semiconductor package on the substrate further comprises:

performing a planarization process on the encapsulating material, such that a top surface of the encapsulating material is coplanar with a top surface of the at least one semiconductor device.

14 . The manufacturing method of the semiconductor package as claimed in claim 12 , wherein the plurality of heat dissipation films are in contact with the top surface of the encapsulating material and the top surface of the at least one semiconductor device.

15 . The manufacturing method of the semiconductor package as claimed in claim 11 , a profile of one of the plurality of heat dissipation films from a top view is aligned with a profile of a contact surface of the one of the plurality of heat dissipation films for contacting the semiconductor package.

16 . A manufacturing method of a semiconductor package, comprising:

Providing an encapsulated semiconductor package on a substrate;

cutting a heat dissipation sheet into a plurality of heat dissipation films, wherein sizes of the plurality of heat dissipation films, from a top view, are the same;

attaching the plurality of heat dissipation films on the encapsulated semiconductor package, wherein the plurality of heat dissipation films are arranged in an array manner with a gap between adjacent two of the plurality of heat dissipation films and jointly cover an upper surface of the encapsulated semiconductor package; and

attaching a cover lid on the substrate and in contact with the plurality of heat dissipation films.

17 . The manufacturing method of the semiconductor package as claimed in claim 16 , wherein the plurality of heat dissipation films are attached to the upper surface of the semiconductor package using a pick and place tool.

18 . The manufacturing method of the semiconductor package as claimed in claim 16 , wherein cutting the heat dissipation sheet into the plurality of heat dissipation films comprises:

cutting a first heat dissipation sheet into a plurality of first heat dissipation films; and

cutting a second heat dissipation sheet into a plurality of second heat dissipation films.

19 . The manufacturing method of the semiconductor package as claimed in claim 18 , wherein attaching the plurality of heat dissipation films on the semiconductor package further comprises:

attaching the plurality of first heat dissipation films on a first portion of the semiconductor package; and

attaching the plurality of second heat dissipation films on a second portion of the semiconductor package, wherein a thickness or a viscosity of each of the plurality of first heat dissipation films is different from that of each of the plurality of second heat dissipation films.

20 . The manufacturing method of the semiconductor package as claimed in claim 19 , wherein the first portion is a peripheral portion of the semiconductor package and the second portion is a central portion of the semiconductor package surrounded by the first portion.