Semiconductor package with a scratch protection layer and method of fabrication
A semiconductor package includes: a carrier having a first side and an opposing second side; a semiconductor die arranged on the first side of the carrier; a heat conductor part arranged on the second side of the carrier; an encapsulation body encapsulating the semiconductor die, wherein the heat conductor part is exposed from the encapsulation body, and wherein the heat conductor part has a different material composition than the encapsulation body; and a scratch protection layer covering the heat conductor part, wherein the scratch protection layer has a hardness which is at least five times higher than a hardness of the heat conductor part.
1 . A semiconductor package, comprising:
a carrier comprising a first side and an opposing second side;
a semiconductor die arranged on the first side of the carrier;
a heat conductor part arranged on the second side of the carrier;
an encapsulation body encapsulating the semiconductor die, wherein the heat conductor part is exposed from the encapsulation body, and wherein the heat conductor part has a different material composition than the encapsulation body; and
a scratch protection layer covering the heat conductor part, wherein the scratch protection layer has a hardness which is at least five times higher than a hardness of the heat conductor part.
2 . The semiconductor package of claim 1 , wherein the scratch protection layer has a relatively higher inorganic material content than the heat conductor part.
3 . The semiconductor package of claim 1 , wherein the scratch protection layer comprises organic-inorganic hybrid polymers.
4 . The semiconductor package of claim 3 , wherein the organic-inorganic hybrid polymers comprise one or more silanes.
5 . The semiconductor package of claim 1 , wherein the heat conductor part comprises a silicone pad.
6 . The semiconductor package of claim 1 , wherein the scratch protection layer has a thickness in a range of 0.2 μm to 20 μm.
7 . The semiconductor package of claim 1 , wherein the heat conductor part protrudes from an external surface of the encapsulation body.
8 . The semiconductor package of claim 1 , wherein the heat conductor part comprises filler particles configured to increase the thermal conductivity of the heat conductor part.
9 . A method for fabricating a semiconductor package, the method comprising:
providing a carrier with a first side and an opposing second side;
arranging a semiconductor die on the first side of the carrier;
arranging a heat conductor part on the second side of the carrier;
encapsulating the semiconductor die with an encapsulation body such that the heat conductor part is exposed from the encapsulation body, wherein the heat conductor part has a different material composition than the encapsulation body; and
covering the heat conductor part with a scratch protection layer, wherein the scratch protection layer has a hardness which is at least five times higher than a hardness of the heat conductor part.
10 . The method of claim 9 , wherein the covering comprises depositing an organic-inorganic hybrid polymer precursor on the heat conductor part.
11 . The method of claim 10 , wherein the depositing comprises spray coating, dipping, printing or jetting the organic-inorganic hybrid polymer precursor onto the heat conductor part.
12 . The method of claim 10 , further comprising:
curing the organic-inorganic hybrid polymer precursor to form the scratch protection layer.
13 . The method of claim 9 , wherein the scratch protection layer has a relatively higher inorganic material content than the heat conductor part.
14 . The method of claim 9 , wherein the covering comprises aging the heat conductor part to form the scratch protection layer.
15 . The method of claim 14 , wherein the heat conductor part is aged by a heat application process or by a plasma application process.