Integrated circuit package and medical device including same

Inventors: Randolph E. Crutchfield (Scottsdale, AZ); Jeff M. Wheeler (Gilbert, AZ)

Assignee: Medtronic, Inc.

H10W42/20 A61N1/0504 A61N1/375 H10W20/0698 H10W20/074 H10W20/423 H10W20/43 H10W20/495 H10W42/25 A61N1/0509 A61N1/0531 A61N1/0534 A61N1/0541 A61N1/36038 A61N1/36053 A61N1/36062 A61N1/362 A61N1/3756 A61N1/3956 H10W70/654 H10W70/69

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Quick Facts

Patent No.: US 12707980
App. No.: 17/846,601
Granted: Aug 11, 2026
Kind: B2

External Links

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Abstract

Various embodiments of an integrated circuit package are disclosed. The package includes an integrated circuit having an integrated circuit contact disposed on a first major surface of the integrated circuit; a first passivation layer disposed on the first major surface of the integrated circuit and over the integrated circuit contact; and a redistribution layer disposed on the first passivation layer. The redistribution layer includes a conductive trace and a shield region that define a plane of the redistribution layer. The package further includes a second passivation layer disposed on the redistribution layer, and a patterned conductive layer disposed on the second passivation layer and including a conductive trace. A portion of the shield region of the redistribution layer is disposed between the conductive trace of the patterned conductive layer and the integrated circuit along an axis that is substantially orthogonal to the first major surface of the integrated circuit.

Claims (34)

1 . An integrated circuit package comprising:

an integrated circuit comprising a first major surface, a second major surface, and an integrated circuit contact disposed on the first major surface, wherein the integrated circuit contact provides one or more electrical connections between the integrated circuit and one or more devices external to the integrated circuit;

a first passivation layer disposed on the first major surface of the integrated circuit and over the integrated circuit contact;

a redistribution layer disposed on the first passivation layer, wherein the redistribution layer comprises a conductive trace and a shield region, wherein the conductive trace and the shield region define a plane of the redistribution layer;

a second passivation layer disposed on the redistribution layer; and

a patterned conductive layer disposed on the second passivation layer and comprising a conductive trace, wherein a portion of the shield region of the redistribution layer is disposed between the conductive trace of the patterned conductive layer and the integrated circuit along an axis that is substantially orthogonal to the first major surface of the integrated circuit.

2 . The integrated circuit package of claim 1 , wherein the shield region of the redistribution layer is configured to reduce parasitic capacitance between the integrated circuit and the patterned conductive layer.

3 . The integrated circuit package of claim 1 , wherein the shield region of the redistribution layer is configured to dissipate ionizing radiation incident upon the shield region.

4 . The integrated circuit package of claim 1 , wherein the shield region of the redistribution layer comprises a mesh comprising a plurality of openings.

5 . The integrated circuit package of claim 1 , wherein the integrated circuit comprises a substrate and an active area disposed on the substrate, the active area comprising one or more electronic elements or devices of the integrated circuit, wherein the active area is electrically connected to the integrated circuit contact to provide electrical connection between the electronic elements or devices of the integrated circuit and one or more devices that are external to the integrated circuit.

6 . The integrated circuit package of claim 5 , wherein the integrated circuit contact is electrically connected to the redistribution layer by a conductive via that extends through the first passivation layer.

7 . The integrated circuit package of claim 1 , wherein the shield region is grounded.

8 . The integrated circuit package of claim 1 , wherein the patterned conductive layer further comprises a conductive pad electrically connected to the redistribution layer and the integrated circuit.

9 . A medical device comprising a housing and circuitry disposed within the housing, wherein the circuitry comprises an integrated circuit package comprising:

an integrated circuit comprising a first major surface, a second major surface, and an integrated circuit contact disposed on the first major surface;

a first passivation layer separate from the integrated circuit and disposed on the first major surface of the integrated circuit and over the integrated circuit contact;

a second passivation layer disposed on the redistribution layer; and

10 . The medical device of claim 9 , wherein the shield region of the redistribution layer is grounded to the housing.

11 . The medical device of claim 9 , further comprising an electrode disposed on an outer surface of the housing, wherein the integrated circuit package is electrically connected to the electrode.

12 . The medical device of claim 9 , wherein the shield region of the redistribution layer is configured to reduce parasitic capacitance between the integrated circuit and the patterned conductive layer.

13 . The medical device of claim 9 , wherein the shield region of the redistribution layer comprises a mesh comprising a plurality of openings disposed through the shield region.

14 . The medical device of claim 9 , wherein the integrated circuit comprises a substrate and an active area disposed on the substrate, the active area including one or more electronic elements or devices of the integrated circuit, wherein the active area is electrically connected to the integrated circuit contact to provide electrical connection between the electronic elements or devices of the integrated circuit and one or more devices that are external to the integrated circuit.

15 . An integrated circuit package that incorporates an integrated circuit with a plurality of layers, wherein the integrated circuit comprises a first major surface, a second major surface, and an integrated circuit contact disposed on the first major surface, and further wherein the plurality of layers comprises:

a first passivation layer disposed on the first major surface of the integrated circuit and over the integrated circuit contact;

a second passivation layer disposed on the redistribution layer; and

16 . The integrated circuit package of claim 15 , wherein the integrated circuit contact provides electrical connection between the integrated circuit and one or more devices external to the integrated circuit.

17 . The integrated circuit package of claim 15 , wherein the shield region of the redistribution layer comprises a mesh comprising a plurality of openings.

18 . The integrated circuit package of claim 15 , wherein the integrated circuit comprises a substrate and an active area disposed on the substrate, the active area comprising one or more electronic elements or devices of the integrated circuit, wherein the active area is electrically connected to the integrated circuit contact to provide electrical connection between the electronic elements or devices of the integrated circuit and one or more devices that are external to the integrated circuit.

19 . The integrated circuit package of claim 18 , wherein the integrated circuit contact is electrically connected to the redistribution layer by a conductive via that extends through the first passivation layer.

20 . The integrated circuit package of claim 15 , wherein the shield region is grounded.