Semiconductor package film and manufacturing method thereof

1 . A semiconductor package film comprising:

a base film having sprocket holes arranged in a first direction in an edge area at a periphery of a main area, the edge area being adjacent to the main area in a second direction intersecting the first direction;

a circuit line disposed in the main area; and

a support member disposed on the base film, the support member being adjacent to the sprocket holes in the edge area, wherein

the support member includes:

a support extending in the first direction; and

protective walls connected to the support,

the protective walls are spaced apart from each other with the sprocket holes disposed between the protective walls, and

the support member does not surround edges of the sprocket holes adjacent to the main area.

2 . The semiconductor package film of claim 1 , wherein

the protective walls are arranged in the first direction, and

each of the protective walls extends in the second direction from the support.

3 . The semiconductor package film of claim 2 , wherein the sprocket holes are disposed between the support and the main area.

4 . The semiconductor package film of claim 1 , wherein each of the sprocket holes is partially surrounded by two protective walls among the protective walls and a portion of the support.

5 . The semiconductor package film of claim 1 , wherein a width between protective walls adjacent to each other among the protective walls in the first direction is greater than a width of one of the sprocket holes in the first direction.

6 . The semiconductor package film of claim 1 , further comprising:

a reinforcing film attached to a lower surface of the base film,

wherein the sprocket holes penetrate the base film and the reinforcing film.

7 . The semiconductor package film of claim 6 , wherein the reinforcing film includes a synthetic resin material.

8 . The semiconductor package film of claim 1 , wherein the support and the protective walls include copper.

9 . A semiconductor package film having first and second edge areas and a main area which is disposed between the first and second edge areas, the semiconductor package film comprising:

a base film having first sprocket holes arranged in a first direction in the first edge area and second sprocket holes arranged in the first direction in the second edge area, the first and second edge areas being spaced apart from each other in a second direction intersecting the first direction;

a first support member disposed on the base film, the first support member being adjacent to the first sprocket holes in the first edge area; and

a second support member disposed on the base film, the second support member being adjacent to the second sprocket holes in the second edge area, wherein

the first support member includes a first support extending in the first direction and first protective walls connected to the first support, the first protective walls being spaced apart from each other with the first sprocket holes disposed between the first protective walls, wherein the first support member does not surround edges of the first sprocket holes adjacent to the main area, and

the second support member includes a second support extending in the first direction and second protective walls connected to the second support, the second protective walls being spaced apart from each other with the second sprocket holes disposed between the second protective walls, wherein the second support member does not surround edges of the second sprocket holes adjacent to the main area.

10 . The semiconductor package film of claim 1 , wherein a width between protective walls adjacent to each other among the protective walls in the first direction is substantially equal to a width of one of the sprocket holes in the first direction.