Package structure and method of manufacturing the same
At least some embodiments of the present disclosure relate to an electronic structure. The package structure includes a lead frame, an electronic component, and a conductive wire physically and electrically connecting the electronic component to the lead frame. An elevation of a first end of the conductive wire is substantially equal to an elevation of a second end of the conductive wire.
1 . A package structure, comprising:
a lead frame including a first pin, a second pin, a first conductive pad disposed on the first pin, and a second conductive pad disposed on the second pin;
an electronic component; and
a conductive wire physically and electrically connecting the electronic component to the lead frame,
wherein an elevation of a first end of the conductive wire is substantially equal to an elevation of a second end of the conductive wire, and
wherein a first surface area of the first conductive pad is less than a second surface area of the second conductive pad from a top view.
2 . The package structure of claim 1 , wherein a projection of the electronic component is free from overlapping a projection of the lead frame in the top view.
3 . The package structure of claim 2 , further comprising an adhesive layer on a bottom surface of the electronic component and exposed to air.
4 . The package structure of claim 1 , further comprising an encapsulant encapsulating the electronic component, wherein a first bottom surface of the encapsulant is substantially aligned with a bottom surface of the electronic component.
5 . The package structure of claim 4 , wherein the first bottom surface of the encapsulant is substantially aligned with a bottom surface of the lead frame.
6 . The package structure of claim 4 , wherein the first pin of the lead frame has a first curve portion and the second pin of the lead frame has a second curve portion, and wherein an imaginary line between the first curve portion and the second curve portion is between the top surface of the electronic component and a bottom surface of the electronic component.
7 . The package structure of claim 4 , wherein the encapsulant further includes a second bottom surface, and an elevation of the second bottom surface of the encapsulant is different from an elevation of the first bottom surface of the encapsulant.
8 . The package structure of claim 7 , wherein the elevation of the second bottom surface of the encapsulant is higher than the elevation of the first bottom surface of the encapsulant.
9 . The package structure of claim 7 , wherein a profile of a portion of the encapsulant filled between adjacent pins of the lead frame is conformal to the pins of the lead frame and the shape of portion of the encapsulant is curved.
10 . The package structure of claim 7 , wherein the portion of the encapsulant extends beyond a curve portion of a pin of the lead frame.
11 . The package structure of claim 4 , wherein the first pin has a top surface, a bottom surface opposite to the top surface, a first lateral surface connected to the top surface, and a second lateral surface connected between the first lateral surface and the bottom surface, the first lateral surface is a vertical surface and in contact with the encapsulant and the second lateral surface is a curved surface and spaced apart from the encapsulant, and wherein the first lateral surface and the second lateral surface of the first pin face the electronic component.
12 . The package structure of claim 1 , wherein the electronic component includes a cap and a membrane covered by the cap, and wherein an elevation of a top surface of the membrane is higher than the elevation of the first end of the conductive wire.
13 . The package structure of claim 12 , wherein the lead frame has an outermost pin relative to the first pin and the second pin, and wherein the package structure further comprises a second conductive wire electrically connecting a top surface of the cap to a top surface of the outermost pin.
14 . The package structure of claim 1 , wherein the first pin is adjacent to the electronic component and the second pin is far away from the electronic component.
15 . The package structure of claim 14 , wherein the first pin misaligns the second pin from the top view.
16 . The package structure of claim 1 , wherein a first width of the first conductive pad is less than a second surface width of the second conductive pad from the top view.
17 . The package structure of claim 1 , wherein the first conductive pad partially covers a top surface of the first pin.
18 . The package structure of claim 17 , wherein the second conductive pad completely covers a top surface of the second pin.
19 . A package structure, comprising:
an electronic component;
at least one pin disposed around the electronic component, wherein the at least one pin has a top surface, a bottom surface opposite to the top surface, a first lateral surface extending between the top surface and the bottom surface, and a second lateral surface opposite to the first lateral surface, wherein the first lateral surface faces the electronic component; and
an encapsulant encapsulating the at least one pin and the electronic component,
wherein a roughness of the first lateral surface of the at least one pin is greater than a roughness of the second lateral surface of the at least one pin, and
wherein the at least one pin further comprises a third lateral surface connected to the first lateral surface of the at least one pin, and the third lateral surface of the at least one pin includes a curved surface,
wherein the encapsulant has a first lateral surface and a second lateral surface, and the first lateral surface of the encapsulant is a vertical surface and the second lateral surface of the encapsulant is a curved surface, and
wherein the third lateral surface of the at least one pin defines a first recess and the second lateral surface of the encapsulant defines a second recess, and a size of the first recess is greater than a size of the second recess, and wherein the first recess faces the second recess.
20 . The package structure of claim 19 , wherein the first lateral surface of the at least one pin is a vertical surface and the second lateral surface of the at least one pin includes a curved surface.
21 . The package structure of claim 19 , wherein the roughness of the first lateral surface of the at least one pin is greater than a roughness of the third lateral surface of the at least one pin.
22 . The package structure of claim 19 , wherein the encapsulant is in contact with the first lateral surface of the at least one pin and spaced apart from the third lateral surface of the at least one pin.
23 . The package structure of claim 19 , wherein the electronic component includes a cap and a membrane covered by the cap, and wherein an elevation of a top surface of the membrane is higher than an elevation of the top surface of the at least one pin.