Method of manufacturing semiconductor devices and corresponding semiconductor device
A semiconductor device includes an electrically conductive clip arranged in a bridge-like position between a semiconductor integrated circuit chip and an electrically conductive pad of a leadframe. The electrically conductive clip is soldered to the semiconductor integrated circuit chip and to the electrically conductive pad via soldering material applied at coupling surfaces facing towards the semiconductor integrated circuit chip and the electrically conductive pad. Prior to soldering, the clip is immobilized in the desired bridge-like position via one of welding (such as laser welding) or gluing at dedicated immobilization areas.
1 . A device, comprising:
a substrate comprising an electrically conductive pad and a die pad;
a semiconductor integrated circuit chip mounted to the die pad of the substrate;
an electrically conductive clip positioned in a bridge-like position between the semiconductor integrated circuit chip and the electrically conductive pad, the electrically conductive clip having coupling surfaces facing towards the semiconductor integrated circuit chip and the electrically conductive pad;
solder material applied at said coupling surfaces of the electrically conductive clip in said bridge-like position, the solder material electrically coupling the electrically conductive clip to the semiconductor integrated circuit chip and to electrically conductive pad; and
a laser weld in addition to said solder material that fixes the electrically conductive clip in said bridge-like position to the electrically conductive pad.
2 . The device of claim 1 , wherein the electrically conductive clip comprises a dedicated immobilization area where the laser weld or glue is applied.
3 . The device of claim 2 , wherein the dedicated immobilization area protrudes from the electrically conductive clip to form a lateral containment wall for said soldering material.
4 . The device of claim 2 , wherein the dedicated immobilization area is planar.
5 . The device of claim 4 , wherein the dedicated immobilization area has one of a round or quadrangular shape.
6 . The device of claim 2 , wherein the dedicated immobilization area is provided in a distal portion of the electrically conductive clip.
7 . The device of claim 6 , wherein the distal portion of the electrically conductive clip is downset relative to a portion of the electrically conductive clip adjacent a top surface of the semiconductor integrated circuit chip.
8 . The device of claim 6 , further comprising a pair of dedicated immobilization areas at opposed ends of said distal portion of the electrically conductive clip.
9 . The device of claim 1 , wherein the semiconductor integrated circuit chip is a power semiconductor integrated circuit, and wherein the electrically conductive clip is sized and dimensioned to carry current produced by the power semiconductor integrated circuit.
10 . A device, comprising:
a substrate comprising an electrically conductive pad and a die pad;
a semiconductor integrated circuit chip mounted to the die pad of the substrate;
an electrically conductive clip positioned in a bridge-like position between the semiconductor integrated circuit chip and the electrically conductive pad, the electrically conductive clip having coupling surfaces facing towards the semiconductor integrated circuit chip and the electrically conductive pad;
wherein the coupling surface of the electrically conductive clip facing towards the electrically conductive pad includes a protruding portion defining a containment wall;
a weld at the containment wall to fix the electrically conductive clip to the electrically conductive pad; and
solder material applied at said coupling surfaces of the electrically conductive clip in said bridge-like position, the solder material electrically coupling the electrically conductive clip to the semiconductor integrated circuit chip and to electrically conductive pad;
wherein the solder material at the electrically conductive pad is contained by the containment wall.
11 . The device of claim 10 , wherein the weld comprises a laser weld.
12 . The device of claim 10 , wherein the semiconductor integrated circuit chip is a power semiconductor integrated circuit, and wherein the electrically conductive clip is sized and dimensioned to carry current produced by the power semiconductor integrated circuit.
13 . A device, comprising:
a substrate comprising an electrically conductive pad and a die pad;
a semiconductor integrated circuit chip mounted to the die pad of the substrate;
an electrically conductive clip positioned in a bridge-like position between the semiconductor integrated circuit chip and the electrically conductive pad, the electrically conductive clip having coupling surfaces facing towards the semiconductor integrated circuit chip and the electrically conductive pad;
wherein the coupling surface of the electrically conductive clip facing towards the electrically conductive pad includes a protruding portion defining a containment wall;
a glue spot at the containment wall to fix the electrically conductive clip to the electrically conductive pad; and
solder material applied at said coupling surfaces of the electrically conductive clip in said bridge-like position, the solder material electrically coupling the electrically conductive clip to the semiconductor integrated circuit chip and to electrically conductive pad;
wherein the solder material at the electrically conductive pad is contained by the containment wall.
14 . The device of claim 13 , wherein the semiconductor integrated circuit chip is a power semiconductor integrated circuit, and wherein the electrically conductive clip is sized and dimensioned to carry current produced by the power semiconductor integrated circuit.
15 . A device, comprising:
a substrate comprising an electrically conductive pad and a die pad;
a semiconductor integrated circuit chip mounted to the die pad of the substrate;
an electrically conductive clip positioned in a bridge-like position between the semiconductor integrated circuit chip and the electrically conductive pad, the electrically conductive clip having coupling surfaces facing towards the semiconductor integrated circuit chip and the electrically conductive pad;
solder material applied at said coupling surfaces of the electrically conductive clip in said bridge-like position, the solder material electrically coupling the electrically conductive clip to the semiconductor integrated circuit chip and to electrically conductive pad; and
an electrically insulating glue in addition to said solder material that fixes the electrically conductive clip in said bridge-like position to at least one of the electrically conductive pad and the semiconductor integrated circuit chip.
16 . The device of claim 15 , wherein the electrically conductive clip comprises a dedicated immobilization area where the electrically insulating glue is applied.
17 . The device of claim 16 , wherein the dedicated immobilization area protrudes from the electrically conductive clip to form a lateral containment wall for said soldering material.
18 . The device of claim 16 , wherein the dedicated immobilization area is planar.
19 . The device of claim 18 , wherein the dedicated immobilization area has one of a round or quadrangular shape.
20 . The device of claim 16 , wherein the dedicated immobilization area is provided in a distal portion of the electrically conductive clip.
21 . The device of claim 20 , wherein the distal portion of the electrically conductive clip is downset relative to a portion of the electrically conductive clip adjacent a top surface of the semiconductor integrated circuit chip.
22 . The device of claim 20 , further comprising a pair of dedicated immobilization areas at opposed ends of said distal portion of the electrically conductive clip.
23 . The device of claim 15 , wherein the semiconductor integrated circuit chip is a power semiconductor integrated circuit, and wherein the electrically conductive clip is sized and dimensioned to carry current produced by the power semiconductor integrated circuit.