Power modules and related methods
Implementations of power modules may include: a substrate having a first side and a second side. The power module may include a plurality of leads coupled to a second side of the substrate and a molding compound over a portion of five or more surfaces of the substrate. The power module may also include an opening extending from a first side of the substrate to an outer edge of the molding compound. The opening may be configured to receive a coupling device and the coupling device may be configured to couple with a heat sink or a package support.
1 . A semiconductor package comprising:
a substrate comprising a first side and a second side;
a plurality of leads coupled between the second side of the substrate and a first surface of a molding compound, the molding compound comprised over a portion of five or more surfaces of the substrate;
a first opening extending entirely through the substrate and from the first side of the substrate to an outer edge of the first surface of the molding compound, the first opening configured to receive a coupling device, the coupling device configured to couple with one of a heat sink or a package support; and
a stand-off unit directly coupled to the first surface of the molding compound;
wherein the second side of the substrate faces towards the first surface of the molding compound; and
wherein the stand-off unit is configured to directly couple to and support the package against the one of the heat sink or the package support.
2 . The package of claim 1 , wherein the stand-off unit is positioned around the first opening and is directly coupled over the substrate.
3 . The package of claim 1 , further comprising a second opening, wherein the first opening and the second opening are evenly spaced within the package.
4 . The package of claim 1 , wherein an outer edge of the stand-off unit lies within a perimeter of the substrate.
5 . The package of claim 1 , wherein the plurality of leads are each an equal distance from two or more leads on a side of a lead frame comprising the plurality of leads.
6 . The package of claim 1 , wherein the stand-off unit is integrally formed with the molding compound.
7 . The package of claim 1 , wherein an entire sidewall of the first opening is orthogonal to the first side of the substrate.
8 . A semiconductor package comprising:
a substrate comprising a first side and a second side;
a plurality of leads coupled between the second side of the substrate and a first surface of a molding compound;
a stand-off unit directly extending from the first surface of the molding compound, wherein a perimeter of the stand-off unit lies entirely within a perimeter of the substrate; and
a first opening extending entirely through the semiconductor package to an outer edge of the first surface of the molding compound, the first opening configured to receive a coupling device, the coupling device configured to couple with one of a heat sink or a package support;
wherein the semiconductor package is configured to comprise a gap between the stand-off unit and the coupling device when the coupling device is coupled with one of the heat sink or the package support.
9 . The package of claim 8 , wherein the stand-off unit is positioned around the first opening on the outer edge of the molding compound, wherein the stand-off unit is configured to directly couple to and support the package against the one of the heat sink or the package support.
10 . The package of claim 8 , further comprising a second opening, wherein the first opening and the second opening are evenly spaced within the package.
11 . The package of claim 10 , further comprising a second stand-off unit around the second opening.
12 . The package of claim 8 , wherein the plurality of leads comprise a 3.81 mm pitch.
13 . The package of claim 8 , wherein the plurality of leads are each an equal distance from two or more leads on a side of a lead frame comprising the plurality of leads.
14 . The package of claim 8 , further comprising one or more die mechanically and electrically coupled to the second side of the substrate.
15 . A semiconductor package comprising:
a substrate comprising a first side and a second side;
a plurality of leads coupled between the second side of the substrate and a first surface of a molding compound;
a first opening extending entirely through the semiconductor package, the first opening configured to receive a coupling device, the coupling device configured to couple with one of a heat sink or a package support; and
a stand-off unit directly coupled over the substrate and extending from the first surface of the molding compound, the first surface of the molding compound parallel to the second side of the substrate;
wherein the stand-off unit is configured to support the package against the one of the heat sink or the package support; and
wherein the first opening extends to an outer end of the stand-off unit opposite an inner end of the stand-off unit directly coupled to the substrate.
16 . The package of claim 15 , wherein the stand-off unit is positioned around the first opening on an outer surface of the molding compound.
17 . The package of claim 15 , further comprising a second opening, wherein the first opening and the second opening are evenly spaced within the package.
18 . The package of claim 15 , wherein the stand-off unit is configured to directly couple to one of the heat sink or the package support.
19 . The package of claim 15 , wherein the plurality of leads are each an equal distance from two or more leads on a side of a lead frame comprising the plurality of leads.
20 . The package of claim 15 , further comprising one or more die mechanically and electrically coupled to the second side of the substrate.