Interconnect strips

1 . A method for forming integrated circuit (IC) packages comprising:

mounting dies on a strip of interconnects;

applying wire bonds in regions of the strip of interconnects proximate to mold shields;

adjusting the mold shields of the strip of interconnects;

flowing a mold compound on the strip of interconnects to form a strip of IC packages, wherein mold injection pressure causes the mold compound to flow from a first end of the strip of interconnects, across the strip of interconnects and to a second end of the strip of interconnects, and the mold shields impede the flow of the mold compound through regions of the strip of interconnects proximate to the mold shields; and

singulating the strip of IC packages to form the IC packages.

2 . The method of claim 1 , wherein flow of the mold compound is unimpeded at a region proximate to a periphery of the strip of interconnects.

3 . The method of claim 2 , wherein the mold compound is plastic.

4 . The method of claim 2 , wherein the mounting further comprises mounting a plurality of dies corresponding to a respective IC package of the IC packages.

5 . The method of claim 4 , wherein the applying further comprises applying wire bonds to couple the dies corresponding to the respective IC package together.

6 . The method of claim 4 , wherein the wire bonds that couple the dies of the respective IC package together extend in a direction nearly transverse to a direction of the flow of the mold compound.

7 . The method of claim 1 , wherein the strip of interconnects comprises die pads for the dies.

8 . A method for forming integrated circuit (IC) packages comprising:

mounting dies on a strip of interconnects;

applying wire bonds in regions of the strip of interconnects proximate to mold shields;

adjusting the mold shields of the strip of interconnects;

flowing a mold compound on the strip of interconnects to form a strip of IC packages, wherein mold injection pressure causes the mold compound to flow from a first end of the strip of interconnects, across the strip of interconnects and to a second end of the strip of interconnects, and the mold shields impede the flow of the mold compound through regions of the strip of interconnects proximate to the mold shields; and

laser sawing the strip of IC packages to remove the mold shields and form the IC packages.

9 . The method of claim 8 , wherein the laser sawing comprises two passes.

10 . A method for forming integrated circuit (IC) packages comprising:

mounting dies on a strip of interconnects;

applying wire bonds in regions of the strip of interconnects proximate to mold shields;

adjusting the mold shields of the strip of interconnects;

flowing a mold compound on the strip of interconnects to form a strip of IC packages, wherein mold injection pressure causes the mold compound to flow from a first end of the strip of interconnects, across the strip of interconnects and to a second end of the strip of interconnects, and the mold shields impede the flow of the mold compound through regions of the strip of interconnects proximate to the mold shields; and

singulating the strip of IC packages into 7 or more IC packages.

11 . The method of claim 10 , wherein the mold shields are bent to an angle of between 90 degrees and 85 degrees.

12 . The method of claim 11 , wherein the mold compound has a thickness of about 1.016 millimeters (mm) on both sides of the strip of interconnects.

13 . A method for forming integrated circuit (IC) packages comprising:

mounting dies on a strip of interconnects;

applying wire bonds in regions of the strip of interconnects proximate to mold shields;

bending the mold shields from an angle parallel to a backplane of the strip of interconnects in the strip of interconnects to form an acute angle or a right angle;

flowing a mold compound on the strip of interconnects to form a strip of IC packages, wherein mold injection pressure causes the mold compound to flow from a first end of the strip of interconnects, across the strip of interconnects and to a second end of the strip of interconnects, and the mold shields impede the flow of the mold compound through regions of the strip of interconnects proximate to the mold shields; and

singulating the strip of IC packages to form the IC packages.

14 . The method of claim 13 , wherein the mold shields extend beyond the mold compound.

15 . The method of claim 13 , wherein the interconnects of the strip of interconnects are spaced about 1.57 mm apart.

16 . A strip of integrated circuit (IC) packages comprising:

a strip of interconnects comprising mold shields arranged in a center region of the strips of interconnects, the mold shields forming a right angle or an acute angle;

dies mounted on the strips of interconnects;

wire bonds in the center region of the strips of interconnects; and

a mold compound encapsulating the strip of interconnects, wherein the mold shields protrude out of the mold compound.

17 . The strip of IC packages of claim 16 , wherein the mold compound is plastic.

18 . The strip of IC packages of claim 16 , wherein a respective IC package of the strip of IC packages includes multiple dies of the dies.

19 . The strip of IC packages of claim 18 , wherein the wire bonds couple the multiple dies of the respective IC package.

20 . The strip of IC packages of claim 16 , wherein the IC packages are dual in-line IC packages.