Semiconductor module, method of manufacturing semiconductor module, and case unit

1 . A semiconductor module comprising:

a semiconductor element;

a laminated substrate including a circuit substrate on which the semiconductor element is mounted;

a case including a plurality of terminal holes, the case housing the semiconductor element;

a plurality of external terminals, each external terminal being inserted into one of two or more terminal holes among the plurality of terminal holes, each of the two or more terminal holes being a terminal hole into which one of the plurality of external terminals is inserted, the plurality of external terminals being electrically connected to the semiconductor element; and

a spacer interposed between the laminated substrate and the case, wherein:

the case and the spacer are bonded to each other by an adhesive,

each external terminal includes a first bonding surface bonded to the spacer by the adhesive,

the case includes, for each two adjacent terminal holes among the plurality of terminal holes, a partition between the two adjacent terminal holes,

an end of the partition is in contact with the adhesive and faces the spacer,

a distance between the first bonding surface and an end of a partition corresponding to the two or more terminal holes is greater than a thickness of each external terminal, the end of the partition corresponding to the two or more terminal holes being in contact with the adhesive and facing the spacer, and

a distance between the spacer and an end of a partition corresponding to a terminal hole other than the two or more terminal holes is equal to or greater than a distance between the spacer and the partition corresponding to the two or more terminal holes, the terminal hole other than the two or more terminal holes being included in the plurality of terminal holes, the end of the partition corresponding to the terminal hole other than the two or more terminal holes being in contact with the adhesive and facing the spacer.

2 . The semiconductor module according to claim 1 , wherein each terminal hole of the plurality of terminal holes is sealed by the adhesive.

3 . The semiconductor module according to claim 1 , wherein:

the case is filled with a potting material covering the semiconductor element, and

a gas barrier property of the adhesive is higher than a gas barrier property of the potting material.

4 . The semiconductor module according to claim 1 , wherein:

the spacer includes a second bonding surface bonded to each external terminal of the plurality of external terminals by the adhesive, and

the second bonding surface includes a recess extending along a direction in which the plurality of terminal holes are arranged.

5 . The semiconductor module according to claim 1 , wherein the partition is closer to the spacer than a center of each of the two adjacent terminal holes in a longitudinal direction of the two adjacent terminal holes.

6 . The semiconductor module according to claim 5 , wherein a relationship of 0.5 mm≤(L−t)≤2.0 mm is satisfied, where the distance between the partition and the first bonding surface is L [mm], and the thickness of each of the plurality of external terminals is t [mm].

7 . The semiconductor module according to claim 1 , wherein:

an external terminal among the plurality of external terminals includes:

a pin extending along any one of the two or more terminal holes; and

a leg positioned between the case and the spacer, the leg being coupled to the pin, and

the leg includes the first bonding surface.

8 . The semiconductor module according to claim 1 , wherein the adhesive is a heat curing adhesive.

9 . A method of manufacturing a semiconductor module, the method comprising:

providing a semiconductor element;

providing a laminated substrate including a circuit substrate on which the semiconductor element is mounted;

preparing a case including a plurality of terminal holes, the case housing the semiconductor element;

inserting each external terminal of a plurality of external terminals into one of two or more terminal holes among the plurality of terminal holes, such that each terminal hole of the two or more terminal holes is a terminal hole into which an external terminal of the plurality of external terminals is inserted, the plurality of external terminals being electrically connected to the semiconductor element;

providing a spacer interposed between the laminated substrate and the case; and

bonding the case and the spacer to each other with an adhesive, wherein:

each external terminal includes a bonding surface bonded to the spacer by the adhesive,

the case includes partitions, such that for each of two adjacent terminal holes among the plurality of terminal holes, a partition among the partitions is provided between the two adjacent terminal holes,

an end of the partition is in contact with the adhesive and faces the spacer,

a distance between the bonding surface and an end of a partition corresponding to the two or more terminal holes is greater than a thickness of each external terminal, the end of the partition corresponding to the two or more terminal holes being in contact with the adhesive and facing the spacer,

a distance between the spacer and an end of a partition corresponding to a terminal hole other than the two or more terminal holes is equal to or greater than a distance between the spacer and the partition corresponding to the two or more terminal holes, the terminal hole other than the two or more terminal holes being included in the plurality of terminal holes, the end of the partition corresponding to the terminal hole other than the two or more terminal holes being in contact with the adhesive and facing the spacer, and

the bonding the case and the spacer includes sealing each terminal hole of the plurality of terminal holes with the adhesive.

10 . A semiconductor module comprising:

a semiconductor element;

a laminated substrate including a circuit substrate on which the semiconductor element is mounted;

a case including a plurality of terminal holes, the case housing the semiconductor element;

a plurality of external terminals, each external terminal among the plurality of external terminals being inserted into one of two or more terminal holes among the plurality of terminal holes, such that each terminal hole of the two or more terminal holes is a terminal hole into which an external terminal of the plurality of external terminals is inserted, the plurality of external terminals being electrically connected to the semiconductor element; and

a spacer interposed between the laminated substrate and the case; wherein:

the spacer is bonded to the case by an adhesive;

each external terminal among the plurality of external terminals includes a bonding surface bonded to the spacer by the adhesive,

the case includes partitions, such that for each of two adjacent terminal holes among the plurality of terminal holes, a partition among the partitions is provided between the two adjacent terminal holes,

an end of the partition is in contact with the adhesive and faces the spacer,

a distance between the bonding surface and an end of a partition corresponding to the two or more terminal holes is greater than a thickness of each external terminal, the end of the partition corresponding to the two or more terminal holes being in contact with the adhesive and facing the spacer,

a distance between the spacer and an end of a partition corresponding to a terminal hole other than the two or more terminal holes is equal to or greater than a distance between the spacer and the partition corresponding to the two or more terminal holes, the terminal hole other than the two or more terminal holes being included in the plurality of terminal holes, the end of the partition corresponding to the terminal hole other than the two or more terminal holes being in contact with the adhesive and facing the spacer, and

each terminal hole of the plurality of terminal holes is sealed by the adhesive.