Data storage device with light emitted memory
The present disclosure configures a system component, such as a memory sub-system controller, to control light emitted memory (LEM) devices. The controller receives, from a host, a request to perform one or more memory operations on a set of data. The controller transmits, via one or more optical waveguides, a command to the set of LEM devices to process the set of data based on the one or more memory operations.
1 . A system comprising:
a set of memory components of a memory sub-system, the set of memory components comprising a set of light emitting memory (LEM) devices, the set of LEM devices comprising light emitting diodes (LEDs), and each LEM device of the set of LEM devices comprising an integrated waveguide configured for light transmission; and
a processing device operatively coupled to the set of memory components via one or more electrical connections and one or more optical waveguides, the one or more optical waveguides being optically coupled to the integrated waveguide of each LEM device to enable optical communication for exchanging data to be read from or stored to the set of LEM devices, the set of LEM devices comprising a first LEM device and a second LEM device, the first LEM device being optically coupled to the second LEM device via the one or more waveguides, the processing device being programmed to perform operations comprising:
receiving, from a host, a request to perform one or more memory operations on a set of data; and
transmitting, via the one or more optical waveguides, a command to the set of LEM devices to perform the one or more operations on the set of data.
2 . The system of claim 1 , wherein the request to perform the one or more memory operations on the set of data comprises a request to read the set of data, the operations comprising:
retrieving, from the set of LEM devices, the set of data; and
providing the set of data retrieved from the set of LEM devices to the host.
3 . The system of claim 1 , wherein the request to perform the one or more memory operations on the set of data comprises a request to program the set of data, the operations comprising:
transmitting an instruction to the set of LEM devices to store the set of data.
4 . The system of claim 1 , wherein the set of LEM devices comprise resistive random access memory (RRAM).
5 . The system of claim 4 , wherein the set of LEM devices process the set of data electrically and optically in parallel.
6 . The system of claim 5 , wherein the set of LEM devices comprise a plurality of perovskite consisting of cesium lead bromide (CsPbBr3) devices.
7 . The system of claim 6 , wherein the RRAM electrically writes, erases, or reads the set of data in a first of the plurality of CsPbBr3 devices.
8 . The system of claim 7 , wherein a second of the plurality of CsPbBr3 devices optically transmits information indicating whether data is written or erased using light emission color and a light-emitting electrochemical cell.
9 . The system of claim 1 , wherein the one or more waveguides comprise a silicon/dielectric waveguide.
10 . The system of claim 9 , wherein the set of LEM devices and the one or more waveguides are bonded using a chip-to-wafer hybrid bonding process to a printed circuit board (PCB) via a silicon photonics interposer.
11 . The system of claim 1 , comprising one or more fiber arrays coupled between the host and the processing device, the one or more fiber arrays comprising the one or more optical waveguides.
12 . The system of claim 11 , wherein the set of LEM devices are placed on top of a printed circuit board (PCB) and are coupled to the processing device and each other via the one or more optical waveguides that are integrated into the PCB.
13 . The system of claim 11 , wherein a printed circuit board (PCB) comprises silicon (Si) with one or more etched cavities, wherein the set of LEM devices are placed within the one or more etched cavities.
14 . The system of claim 13 , wherein the one or more optical waveguides are coupled to the set of LEM devices via a top portion of the set of LEM devices, the top portion of the set of LEM devices being on an opposite end of the set of LEM devices from a bottom portion of the set of LEM devices that is placed within the one or more etched cavities of the PCB.
15 . The system of claim 13 , wherein the one or more etched cavities are formed using at least one of photolithography, an etching process, or thin film deposition processes comprising at least one of: sputtering, chemical vapor deposition, or thermal oxidation.
16 . A method comprising:
receiving, from a host, a request to perform one or more memory operations on a set of data; and
transmitting, via one or more optical waveguides, a command to a set of light emitting memory (LEM) devices to perform the one or more memory operations on the set of data, the set of LEM devices comprising light emitting diodes (LEDs), each LEM device of the set of LEM devices comprising an integrated waveguide configured for light transmission, the one or more optical waveguides being optically coupled to the integrated waveguide of each LEM device to enable optical communication for exchanging data to be read from or stored to the set of LEM devices, the set of LEM devices comprising a first LEM device and a second LEM device, the first LEM device being optically coupled to the second LEM device via the one or more optical waveguides.
17 . The method of claim 16 , wherein the one or more waveguides comprise a silicon/dielectric waveguide.
18 . A method of manufacturing a memory sub-system, the method comprising:
placing a processing device on a first portion of a printed circuit board (PCB) comprising the memory sub-system;
placing a set of memory components comprising a set of light emitting memory (LEM) devices on a second portion of the PCB, the set of LEM devices comprising light emitting diodes (LEDs), each LEM device of the set of LEM devices comprising an integrated waveguide configured for light transmission, the set of LEM devices comprising a first LEM device and a second LEM device;
placing one or more fiber arrays comprising one or more optical waveguides on a third portion of the PCB;
placing one or more electrical conductors on a fourth portion of the PCB; and
coupling the processing device to the set of memory components comprising the LEM devices via the one or more fiber arrays and the one or more electrical conductors, the one or more optical waveguides being optically coupled to the integrated waveguide of each LEM device to enable optical communication for exchanging data to be read from or stored to the set of LEM devices, and the first LEM device being optically coupled to the second LEM device via the one or more optical waveguides.
19 . The method of claim 18 , wherein the one or more waveguides comprise a silicon/dielectric waveguide.
20 . The method of claim 19 , wherein the set of LEM devices and the one or more waveguides are bonded using a chip-to-wafer hybrid bonding process to a printed circuit board (PCB) via a silicon photonics interposer.