Substrate structure, module, method for manufacturing the substrate structure, and method for manufacturing the module

1 . A substrate structure comprising:

a substrate having a first surface;

a first electrode disposed on the first surface;

a bump connected to the first electrode; and

a protective member covering the first surface, covering a portion of the bump, and directly contacting the bump; wherein

the protective member has an opening, and the bump includes a portion exposed through the opening,

the bump includes a first portion connected to the first electrode, and a second portion being farther from the first electrode than the first portion and connected to the first portion,

the bump has a constriction at a boundary between the first portion and the second portion, and

diameter of the second portion is smaller than a maximum diameter of the first portion.

2 . A substrate structure comprising:

a substrate having a first surface;

a first electrode disposed on the first surface;

a bump connected to the first electrode; and

a protective member covering the first surface and covering a portion of the bump; wherein

the protective member has an opening, and the bump includes a portion exposed through the opening,

the bump includes a first portion covering connected to the first electrode, and a second portion being farther from the first electrode than the first portion and connected to the first portion,

the bump has a constriction at a boundary between the first portion and the second portion,

a diameter of an upper end of the opening is equal to or smaller than a maximum diameter of the first portion, and

the protective member covers a portion of the second portion.

3 . The substrate structure according to claim 1 , wherein there is a gap between the second portion and an internal surface of the opening.

4 . The substrate structure according to claim 1 , wherein the protective member includes a protective layer covering a connection portion between the first electrode and the first portion, and a resin seal covering the first portion and the protective layer and being comprised of a material different in composition from the protective layer.

5 . The substrate structure according to claim 1 , wherein in the direction perpendicular to the first surface, a height of the bump with reference to the first surface is equal to a height of the protective member with reference to the first surface.

6 . The substrate structure according to claim 1 , wherein in the direction perpendicular to the first surface, a height of the second portion with reference to the constriction is lower than a height of the first portion with reference to a surface of the first electrode facing away from the substrate.

7 . The substrate structure according to claim 1 , wherein a plurality of steps are provided on an internal surface of the opening.

8 . The substrate structure according to claim 1 , wherein a Cu—Sn alloy layer is interposed at an interface between the first electrode and the bump or the first electrode includes a Cu—Sn alloy layer.

9 . The substrate structure according to claim 1 , wherein in the direction perpendicular to the first surface, a height of the bump with reference to the first surface is higher than a height of the protective member with reference to the first surface, and a surface of the bump farthest from the first surface is flat.

10 . The substrate structure according to claim 1 , wherein a particulate filler is mixed in the bump.

11 . The substrate structure according to claim 1 , wherein the protective member includes a protective layer disposed on the first surface and spaced from both the first electrode and the bump, and a resin seal covering the first portion and the protective layer and being comprised of a material different in composition from the protective layer.

12 . The substrate structure according to claim 11 , wherein the bump covers a side surface of the first electrode.

13 . A module comprising:

a substrate structure according to claim 1 ; and

a first component mounted on the first surface,

the first component being at least partially covered with the protective member.

14 . A module comprising:

a substrate structure comprising:

a first surface;

a first electrode disposed on the first surface;

a bump connected to the first electrode; and

a protective member covering the first surface and covering a portion of the bump; wherein

the protective member has an opening, and the bump includes a portion exposed through the opening,

the bump includes a first portion connected to the first electrode, and a second portion being farther from the first electrode than the first portion and connected to the first portion,

the bump has a constriction at a boundary between the first portion and the second portion, and

when viewed in a direction perpendicular to the first surface, a maximum diameter of the second portion is smaller than a maximum diameter of the first portion; and

a first component mounted on the first surface, the first component being at least partially covered with the protective member,

wherein in a direction perpendicular to the first surface, a height of the first component with reference to the first surface, a height of the bump with reference to the first surface, and a height of the protective member with reference to the first surface are equal.

15 . The module according to claim 13 , wherein the substrate has a second surface facing away from the first surface, a second component is mounted on the second surface, and the second surface and the second component are covered with a second resin seal.

16 . A method for manufacturing a substrate structure for obtaining a substrate structure according to claim 1 , the method comprising:

preparing a product, wherein in the product, the substrate and the first electrode are combined and the first portion is connected to the first electrode;

forming a protective member to cover the first portion;

grinding an upper surface of the protective member;

forming an opening in the protective member by laser processing to expose the first portion through the opening; and

connecting a second portion to the first portion.

17 . The method for manufacturing a substrate structure according to claim 16 , further comprising grinding an upper surface of the protective member and the second portion together to obtain a structure, wherein in the structure, the upper surface of the protective member and an upper surface of the second portion are flush.

18 . A method for manufacturing a module for obtaining a module according to claim 13 , comprising:

preparing a product, wherein in the product, the substrate and the first electrode are combined and the first portion is connected to the first electrode;

mounting the first component on the first surface;

forming a protective member to cover the first portion and the first component;

grinding an upper surface of the protective member to expose the first component;

forming an opening in the protective member by laser processing to expose the first portion through the opening; and

connecting a second portion to the first portion.

19 . The method for manufacturing a module according to claim 18 , further comprising grinding an upper surface of the protective member, the first component, and the second portion together to obtain a structure, wherein in the structure, the upper surface of the protective member, an upper surface of the first component, and an upper surface of the second portion are flush.

20 . The substrate structure according to claim 3 , wherein the first portion is entirely covered with the protective member.