IP Library Granted Patent US 12708919
Granted Patent B2
US 12708919 · App. 18/366,252 · Granted Aug 18, 2026

Substrate processing apparatus

Inventor: Jun Komori (Kyoto, JP)
Assignee: SCREEN HOLDINGS CO., LTD.
B05B13/04B05B12/002B05D1/02
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Quick Facts
Patent No.
US 12708919
App. No.
18/366,252
Granted
Aug 18, 2026
Kind
B2
Abstract

A substrate processing apparatus includes a nozzle that supplies a processing liquid to a substrate, a mover that moves the nozzle between a supply position above a substrate and a waiting position outward of the substrate, a nozzle container that is located at the waiting position and contains the nozzle, a first exhaust flow path that guides a gas in a processing space in which a processing liquid is supplied to a substrate to an exhaust device, and a second exhaust flow path that guides a gas in the nozzle container to the first exhaust flow path.

Claims (20)

1 . A substrate processing apparatus comprising:

a nozzle that supplies a processing liquid to a substrate;

a mover that moves the nozzle between a supply position above the substrate and a waiting position outward of the substrate;

a nozzle container that is located at the waiting position and contains the nozzle;

a first exhaust flow path that guides a gas in a processing space in which a processing liquid is supplied to the substrate to an exhaust device; and

a second exhaust flow path that guides a gas in the nozzle container to the first exhaust flow path.

2 . The substrate processing apparatus according to claim 1 , further comprising a flow-rate regulator that regulates a flow rate of a gas flowing through the second exhaust flow path.

3 . The substrate processing apparatus according to claim 2 , wherein

the flow-rate regulator further includes an operation unit to be operated by a user in order to regulate the flow rate of the gas in the second exhaust flow path, and

the operation unit is provided to be directed toward a maintenance space formed to be adjacent to a casing including the nozzle container and the processing space.

4 . The substrate processing apparatus according to claim 1 , wherein

the nozzle container includes

an opening that causes an inner space of the nozzle container and the second exhaust flow path to communicate with each other, and

a flow-path forming member that is provided in the nozzle container and covers the opening.

5 . The substrate processing apparatus according to claim 4 , wherein

the opening is formed in a sidewall of the nozzle container,

the flow-path forming member is provided to partition the inner space of the nozzle container into a third exhaust flow path and another space, and

the third exhaust flow path has an exhaust port connected to the opening and an intake port that opens downwardly.

6 . The substrate processing apparatus according to claim 5 , wherein

a lower end of the flow-path forming member is located farther downwardly than a lower end of the nozzle contained in the nozzle container.