Substrate processing method and substrate processing apparatus
The present application relates to a substrate processing apparatus and a substrate processing method for suppressing cracking and chipping of a laminated substrate manufactured by bonding substrates, and more particularly to a technique of applying a filler to a gap formed between edge portions of the substrates constituting the laminated substrate. The method includes: applying the filler to a gap between an edge portion of the first substrate and an edge portion of the second substrate; curing the applied filler; generating, by an infrared imaging device, an image of an edge portion of the laminated substrate to which the filler is applied; and determining a filling state of the filler applied to the gap between the edge portion of the first substrate and the edge portion of the second substrate based on the image.
1 . A substrate processing method of applying a filler to a laminated substrate having a first substrate and a second substrate bonded to each other, comprising:
applying, by an application device, the filler to a gap between an edge portion of the first substrate and an edge portion of the second substrate, the application device being configured to inject the filler into the gap to thereby apply the filler to the gap;
curing the applied filler by a curing device;
generating, by an infrared imaging device, an image of an edge portion of the laminated substrate to which the filler is applied, the infrared imaging device being configured to emit infrared light to the edge portion of the laminated substrate, receive infrared light reflected from the edge portion of the laminated substrate, and generate the image of the edge portion of the laminated substrate; and
determining a filling state of the filler applied to the gap and cured based on the image.
2 . The substrate processing method according to claim 1 , wherein determining the filling state comprises determining the filling state based on a size of the filler in a preset target region on the image.
3 . The substrate processing method according to claim 1 , wherein applying of the filler is terminated based on the filling state.
4 . The substrate processing method according to claim 1 , further comprising additionally applying the filler based on the filling state.
5 . The substrate processing method according to claim 1 , further comprising counting a number of voids generated in the filler on the image, and determining that an abnormality has occurred when the number of voids has reached a predetermined value.
6 . The substrate processing method according to claim 1 , wherein applying of the filler, curing of the filler, and generating of the image is performed while rotating the laminated substrate.
7 . The substrate processing method according to claim 6 , wherein an applying condition for the filler is changed based on the filling state.
8 . The substrate processing method according to claim 7 , wherein the image is generated at each of multiple measurement points of the laminated substrate while the laminated substrate makes one revolution, and
an applying condition for the filler in at least one of the multiple measurement points is changed based on the filling state at each of the multiple measurement points and location information on the measurement points.
9 . The substrate processing method according to claim 7 , wherein the applying condition includes at least one of a total amount of the filler to be applied, a shape of a filler emitting port of an application device configured to apply the filler, a distance between the laminated substrate and the filler emitting port, an amount of the filler to be emitted from the filler emitting port per unit time, and a rotation speed of the laminated substrate.
10 . The substrate processing method according to claim 1 , further comprising changing an applying condition for the filler in a next laminated substrate based on the filling state.
11 . The substrate processing method according to claim 1 , wherein the infrared imaging device is configured to emit infrared light approximately perpendicularly to a bonding surface of the first substrate and the second substrate of the laminated substrate.
12 . The substrate processing method according to claim 1 , wherein
the curing device is disposed downstream of the application device in a rotating direction of the laminated substrate, and
the infrared imaging device is disposed downstream of the curing device in the rotating direction of the laminated substrate.
13 . A substrate processing apparatus for applying a filler to a laminated substrate having a first substrate and a second substrate bonded to each other, comprising:
a filler application module configured to apply the filler to the laminated substrate; and
an operation controller configured to control an operation of the filler application module,
wherein the filler application module includes:
a substrate holder configured to hold the laminated substrate;
an application device configured to inject the filler into a gap between an edge portion of the first substrate and an edge portion of the second substrate to thereby apply the filler to the gap;
a curing device configured to cure the applied filler; and
an infrared imaging device configured to emit infrared light to an edge portion of the laminated substrate, receive infrared light reflected from the edge portion of the laminated substrate, and generate an image of the edge portion of the laminated substrate to which the filler is applied, and
the operation controller is configured to determine a filling state of the filler applied to the gap and cured based on the image.
14 . The substrate processing apparatus according to claim 13 , wherein the operation controller is further configured to instruct the filler application module based on the filling state to cause the application device to terminate application of the filler.
15 . The substrate processing apparatus according to claim 13 , wherein the operation controller is further configured to instruct the filler application module based on the filling state to additionally apply the filler.
16 . The substrate processing apparatus according to claim 13 , wherein the filler application module further includes a rotating mechanism configured to rotate the substrate holder.
17 . The substrate processing apparatus according to claim 16 , wherein the operation controller is configured to change an applying condition for the filler based on the filling state.
18 . The substrate processing apparatus according to claim 13 , wherein
the curing device is disposed downstream of the application device in a rotating direction of the laminated substrate, and
the infrared imaging device is disposed downstream of the curing device in the rotating direction of the laminated substrate.