Ball mounting apparatus with ball attach volume control
An integrated circuit (IC) solder ball mounting apparatus comprises a ball storage unit for storing solder balls, a ball buffer unit configured to receive the solder balls from the ball storage unit in response to one or more pressure-actuated actions, and a gate valve configured to allow the solder balls to transfer to a ball mounting brush configured to place the solder balls onto area array contact structures formed on a wafer containing the integrated circuit.
1 . An integrated circuit solder ball mounting apparatus, comprising:
a ball storage unit for storing solder balls;
a ball buffer unit configured to receive the solder balls from the ball storage unit in response to one or more pressure-actuated actions; and
a gate valve configured to simultaneously release the solder balls from the ball buffer unit,
wherein the ball storage unit is calibrated to hold a first fixed plurality of the solder balls and the ball buffer unit is calibrated to hold a second fixed plurality of the solder balls, the second fixed plurality greater than the first fixed plurality.
2 . The apparatus as recited in claim 1 , further comprising a gas supply unit coupled to the ball storage unit via a gas supply path including a valve configured to allow passage of a gas volume to cause the one or more pressure-actuated actions in response to a fill signal generated by a controller.
3 . The apparatus as recited in claim 2 , wherein the gate valve is operable responsive to a dispense signal, different than the fill signal, generated by the controller to cause opening of a ball dispense path connected to the ball buffer unit for facilitating transfer of the solder balls to a ball mounting brush.
4 . The apparatus as recited in claim 3 , wherein the gate valve is actuated by a controlled flow of a clean dry air (CDA) stream.
5 . The apparatus as recited in claim 1 , wherein the ball buffer unit is configured to direct the solder balls to a ball mounting brush that is configured to place the solder balls onto area array contact structures located on an integrated circuit.
6 . A solder ball transfer device, comprising:
a path from a solder ball source to an intermediate solder ball storage volume;
a gas flow path directly connected to the intermediate solder ball storage volume; and
a solder ball buffer volume connected between the intermediate solder ball storage volume and an outlet valve, the solder ball buffer volume configured to receive solder balls from the intermediate solder ball storage volume via an upward sloping channel in response to one or more solder ball transfer events that include directing a gas flow to the intermediate solder ball storage volume,
wherein the outlet valve is configured to simultaneously release the solder balls from the solder ball buffer volume, and
wherein the intermediate solder ball storage volume, the solder ball buffer volume and the upward sloping channel are formed within a single material block forming the solder ball transfer device.
7 . The solder ball transfer device as recited in claim 6 , wherein the intermediate solder ball storage volume has a bottom higher than a bottom of the solder ball buffer volume.
8 . The solder ball transfer device as recited in claim 6 , wherein the gas flow path includes a gas channel formed within the single material block.
9 . The apparatus as recited in claim 6 , wherein the ball buffer volume is calibrated to store a fixed plurality of the solder balls.
10 . A machine, comprising:
a ball storage unit for storing solder balls, the ball storage unit having a bottom at a first level;
a ball buffer tank configured to receive the solder balls from the ball storage unit in response to a gas flow into the ball storage unit; and
a gate valve at a second level below the first level, the gate valve configured to simultaneously release the solder balls from the ball buffer tank,
wherein the ball storage unit is calibrated to hold a first fixed plurality of the solder balls and the ball buffer tank is calibrated to hold a second fixed plurality of the solder balls, the second fixed plurality greater than the first fixed plurality.
11 . The machine as recited in claim 10 , wherein the gate valve is configured to release the solder balls to a ball mounting brush.
12 . The machine as recited in claim 10 , wherein the ball storage unit and the ball buffer tank are connected by an upward sloping channel.
13 . The machine as recited in claim 12 , wherein the ball storage unit, the ball buffer tank and the upward sloping channel are machined in a single material block.
14 . A machine, comprising:
a ball storage unit for storing a plurality of solder balls, the ball storage unit having a bottom at a first level;
a ball buffer tank configured to receive the plurality of solder balls from the ball storage unit in response to a gas flow into the ball storage unit; and
a gate valve at a second level below the first level, the gate valve configured to simultaneously release the plurality of solder balls from the ball buffer tank,
wherein the ball storage unit and the ball buffer tank are connected by an upward sloping channel, and the ball storage unit, the ball buffer tank and the upward sloping channel being machined in a single material block.
15 . The machine as recited in claim 14 , further comprising a gas supply unit coupled to the ball storage unit via a gas supply path including a valve configured to allow passage of a gas volume to cause the plurality of solder balls to transfer from the ball storage unit to the ball buffer tank.