High precision temperature and contaminant control for precise machine tool positioning

1 . A contaminant control system comprising:

a source supplying a gas flow;

a channel fluidly coupled to the source to direct the gas flow;

a pressure sensor disposed within the channel;

a machine tool comprising:

an enclosure comprising:

moving components disposed within the enclosure;

an inlet fluidly coupling the channel and the enclosure; and

at least one outlet to direct the gas flow out of the enclosure; and

a cutting tool disposed outside of the enclosure and operably coupled to the moving components;

a controller operably coupled to the source and the pressure sensor;

a temperature probe operably coupled to the controller, thermally coupled to the moving components, and configured to measure a temperature of the moving components; and

a temperature conditioner fluidly coupled to the channel and operably coupled to the controller, the temperature conditioner configured to condition a temperature of the gas flow based on the temperature of the moving components,

wherein the temperature conditioner is configured to heat the gas flow,

wherein the gas flow prevents at least some contaminants generated by the cutting tool from entering the enclosure.

2 . The contaminant control system of claim 1 , wherein the moving components comprise precision positioning components.

3 . The contaminant control system of claim 2 , wherein the precision positioning components comprise:

a first assembly comprising a first rotatable portion that is rotatable about a first axis; and

a second assembly comprising a second rotatable portion that is rotatable about a second axis that is not coincident with the first axis,

wherein the first and second assemblies are coupled such that rotation of the first rotatable portion causes eccentric rotation of the second rotatable portion about the first axis.

4 . The contaminant control system of claim 2 , wherein the temperature probe is in direct contact with a surface of the precision positioning components.

5 . The contaminant control system of claim 1 , wherein the at least some contaminants consist of at least one of machining chips or grinding swarf.

6 . The contaminant control system of claim 1 , wherein the gas flow creates a pressure within the enclosure about 0.5 inches of water to about 100 inches of water above an ambient pressure.

7 . The contaminant control system of claim 1 , wherein:

the source comprises a source of pressurized gas; and

the contaminant control system further comprises:

a pressure regulator disposed between the source and the channel; and

a first valve disposed between the source and the inlet and operably coupled to the controller.

8 . The contaminant control system of claim 1 , wherein the temperature conditioner is configured to heat the gas flow until a temperature at the at least one outlet reaches an upper set point.

9 . The contaminant control system of claim 8 , wherein the temperature conditioner is further configured to be pulsed so that the temperature of the moving components stays within a temperature band.

10 . The contaminant control system of claim 1 , wherein the temperature probe is a first temperature probe and further comprising:

a second temperature probe configured to measure an ambient temperature; and

a third temperature probe configured to measure a temperature of a coolant supplied to the machine tool.

11 . A method of controlling contaminants in a machine tool, the machine tool comprising:

an enclosure comprising:

moving components disposed within the enclosure;

an inlet fluidly coupling the enclosure to a source supplying a gas flow to direct the gas flow into the enclosure;

a pressure sensor disposed within the enclosure; and

at least one outlet to direct the gas flow out of the enclosure; and

a cutting tool disposed outside of the enclosure and operably coupled to the moving components;

the method of controlling contaminants comprising:

regulating the gas flow through the machine tool using a controller, the controller operably coupled to the pressure sensor and the source supplying the gas flow;

measuring a temperature of the moving components; and

conditioning a temperature of the gas flow based on the temperature of the moving components,

wherein conditioning the temperature of the gas flow comprises heating the gas flow,

wherein the gas flow prevents at least some contaminants generated by the cutting tool from entering the enclosure.

12 . The method of claim 11 , wherein the moving components comprise precision positioning components.

13 . The method of claim 12 , wherein the precision positioning components comprise:

a first assembly comprising a first rotatable portion that is rotatable about a first axis; and

a second assembly comprising a second rotatable portion that is rotatable about a second axis that is not coincident with the first axis,

wherein the first and second assemblies are coupled such that rotation of the first rotatable portion causes eccentric rotation of the second rotatable portion about the first axis.

14 . The method of claim 11 , wherein the at least some contaminants consist of at least one of machining chips or grinding swarf.

15 . The method of claim 11 , wherein controlling the gas flow comprises creating a pressure within the enclosure of about 0.5 inches of water to about 100 inches of water above an ambient pressure.

16 . The method of claim 11 , wherein heating the gas flow comprises:

heating the gas flow until a temperature at the at least one outlet reaches an upper set point.

17 . The method of claim 16 , wherein heating the gas flow further comprises:

pulsing heating of the gas flow so that the temperature of the moving components stays within a temperature band.

18 . The method of claim 11 , further comprising:

measuring an ambient temperature; and

measuring a temperature of a coolant supplied to the machine tool.