IP Library Granted Patent US 12709567
Granted Patent B2
US 12709567 · App. 17/656,308 · Granted Aug 18, 2026

Glass-ceramics with plasma resistance and parts for dry etching comprising the same

Inventors: Hyung Bong Lim (Gyeonggi-do, KR); Yong Su Kim (Gangwon-do, KR); Kyung Sik Oh (Incheon, KR); Young Pyo Hong (Gangwon-do, KR); Sung Min Kim (Gyeonggi-do, KR); Joon Hyung Kim (Gyeonggi-do, KR); Si Won Son (Seoul, KR); Yena Kim (Seoul, KR)
Assignee: HASS CO., LTD.
C03C10/00C03B32/02C03C4/20C03C19/00H01J37/32642C03C2204/00H01J2237/334H10P50/242
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Quick Facts
Patent No.
US 12709567
App. No.
17/656,308
Granted
Aug 18, 2026
Kind
B2
Abstract

A crystallized glass includes crystalline and vitreous structures, in which the crystalline structure includes lithium disilicate as a main crystalline phase and at least one crystalline phase among lithium phosphonate (Li 3 PO 4 ), lithium metasilicate (Li 2 SiO 3 ), silica (SiO 2 ), and zirconia (ZrO 2 ) as a sub-crystalline phase, has an excellent processability and an excellent plasma corrosion resistance, thereby being useful as a material for production of parts for various dry etching apparatuses.

Claims (8)

1 . A crystallized glass comprising a crystalline structure and a vitreous structure,

wherein the crystallized glass contains 40% to 80% by weight of the crystalline structure,

wherein the crystalline structure comprises lithium disilicate as a main crystalline phase and at least one crystalline phase of lithium phosphate (Li 3 PO 4 ), lithium metasilicate (Li 2 SiO 3 ), silica (SiO 2 ), or zirconia (ZrO 2 ) as a sub-crystalline phase,

wherein the crystalline structure contains 60% to 95% by weight of the lithium disilicate as the main crystalline phase,

wherein the crystallized glass has a surface roughness of 0.01 μm to 0.1 μm,

wherein the main and sub-crystalline phases have an average grain size of 0.05 μm to 0.5 μm after performing a primary crystallization heat treatment at a temperature in the range of 400° C. to 850° C.,

wherein the main and sub-crystalline phases have an average grain size of 0.5 μm to 5 μm after performing a secondary crystallization heat treatment at a temperature in the range of 800° C. to 950° C. after the primary crystallization heat treatment, and

wherein the crystallized glass has plasma corrosion resistance required for dry etching process.