Resin composition

1 . A resin composition, comprising

(A) at least one compound containing a radical polymerizable group having a carbodiimide structure, and

(B) at least one compound containing a radical polymerizable group not having a carbodiimide structure, and

optionally further comprising

(C) at least one thermosetting resin,

wherein the component (A) comprises a compound containing a radical polymerizable group represented by formula (1):

wherein,

each R independently represents a hydrogen atom or a methyl group;

each X 1 independently represents a carbonyl group, a methylene group, a phenylene group, or a phenylene-methylene group;

each X 2 independently represents a saturated divalent hydrocarbon group having 2 to 4 carbon atoms;

each Y independently represents a saturated divalent hydrocarbon group having 2 to 30 carbon atoms optionally having a substituent group, or an unsaturated divalent hydrocarbon group having 2 to 30 carbon atoms optionally having a substituent group;

each Z independently represents a saturated divalent hydrocarbon group having 2 to 300 carbon atoms optionally having a substituent group, or an unsaturated divalent hydrocarbon group having 2 to 300 carbon atoms optionally having a substituent group;

each a independently represents 0, or an integer of 1 or more;

each b independently represents an integer of 1 or more;

each c independently represents an integer of 0 or more; and

d represents an integer of 1 or more, and

wherein the component (B) comprises at least one selected from the group consisting of a modified polyphenylene ether resin, a polyfunctional (meth) acryloyl group-containing compound, a polyfunctional vinylaryl group-containing compound, a polyfunctional allyl group-containing compound, and a maleimide compound.

2 . The resin composition according to claim 1 , wherein a content of the component (A) relative to 100% by mass of nonvolatile components in the resin composition is in a range of 0.05% by mass to 10% by mass.

3 . The resin composition according to claim 1 , wherein the component (C) comprises an epoxy resin.

4 . The resin composition according to claim 3 , wherein the component (C) further comprises an active ester type curing agent.

5 . The resin composition according to claim 3 , wherein the component (C) further comprises a phenol type curing agent.

6 . The resin composition according to claim 1 , further comprising (D) an inorganic filler.

7 . The resin composition according to claim 6 , wherein the component (D) is silica.

8 . The resin composition according to claim 6 , wherein a content of the component (D) relative to 100% by mass of nonvolatile components in the resin composition is 40% by mass or more.

9 . The resin composition according to claim 1 , further comprising a phenoxy resin.

10 . The resin composition according to claim 1 , wherein a dielectric dissipation factor (Df) of a cured product of the resin composition is 0.006 or less when measured at 5.8 GHz and 23° C.

11 . The resin composition according to claim 1 , wherein an elongation at a breaking point of a cured product of the resin composition is 1.2% or more when measured at 23° C.

12 . The resin composition according to claim 1 , wherein the resin composition is for forming an insulating layer to form a conductive layer.

13 . The resin composition according to claim 1 , wherein the resin composition is for forming an insulating layer of a printed wiring board.

14 . A cured product of the resin composition according to claim 1 .

15 . A sheet-like laminate material comprising the resin composition according to claim 1 .

16 . A resin sheet comprising:

a support; and

a resin composition layer formed on the support, the resin composition layer being formed from the resin composition according to claim 1 .

17 . A printed wiring board comprising an insulating layer composed of a cured product of the resin composition according to claim 1 .

18 . A semiconductor device comprising the printed wiring board according to claim 17 .

19 . The resin composition according to claim 1 , wherein, in formula (1), c represents an integer of 1 or more.

20 . The resin composition according to claim 19 , wherein, in formula (1), each Z independently represents a divalent hydrocarbon group having 300 or less carbon atoms and having a structural unit selected from formulae (Z1) to (Z8):

21 . The resin composition according to claim 19 , wherein, in formula (1), each Z independently represents a divalent hydrocarbon group having 300 or less carbon atoms and having a structural unit represented by formula (Z1):

22 . The resin composition according to claim 19 , wherein, in formula (1), each Z independently represents a divalent hydrocarbon group having 300 or less carbon atoms represented by formula (Z1′):

wherein,

n z represents an integer of 1 or more; and

* indicates a bonding site.

23 . The resin composition according to claim 1 , wherein the component (A) comprises a compound represented by formula (S5):

wherein,

b′ represents an average degree of polymerization of a carbodiimide group;

d′ represents an average degree of polymerization of a combined unit of polybutadiene and polycarbodiimide; and

e′ represents an average degree of polymerization of a butadiene unit.