Polishing composition, method for producing polishing composition, and polishing method
Provided is a polishing composition with excellent machining capacity, and good cleaning property after polishing. A polishing composition containing abrasive grains, water, and a hydrophobic dispersing medium, wherein the hydrophobic dispersing medium contains at least one selected from the group consisting of normal paraffin hydrocarbons, isoparaffin hydrocarbons, naphthenic hydrocarbons, and terpene hydrocarbons, and has a flash point of 30° C. or more and 100° C. or less, or a vapor pressure at 20° C. of 0.004 kPa or more and 2 kPa or less.
1 . A polishing composition comprising abrasive grains, water, and a hydrophobic dispersing medium,
wherein the hydrophobic dispersing medium comprises at least two organic solvents selected from the group consisting of normal paraffin hydrocarbons, isoparaffin hydrocarbons, naphthenic hydrocarbons, and terpene hydrocarbons, and has a FPI flash point of 30° C. or more and 100° C. or less,
wherein the hydrophobic dispersing medium comprises:
an organic solvent having a flash point of more than 45° C. and 65° C. or less, or an organic solvent having a flash point of more than 65° C. and less than 100° C.; and
an organic solvent having a flash point of 100° C. or more and 180° C. or less.
2 . The polishing composition according to claim 1 , wherein the hydrophobic dispersing medium has a mixed vapor pressure at 20° C. of 0.004 kPa or more and 2 kPa or less.
3 . The polishing composition according to claim 1 , wherein the hydrophobic dispersing medium has a FPI flash point of 50° C. or more and 80° C. or less.
4 . The polishing composition according to claim 1 , wherein the hydrophobic dispersing medium has a FPI flash point of 64° C. or more and 74° C. or less.
5 . The polishing composition according to claim 1 , wherein the hydrophobic dispersing medium is contained at 15 mass % or more and 40 mass % or less relative to the total mass of the polishing composition.
6 . The polishing composition according to claim 1 , further comprising a surfactant.
7 . The polishing composition according to claim 1 , wherein the abrasive grain is aluminum oxide.
8 . The polishing composition according to claim 7 , wherein the aluminum oxide has an α-conversion rate of 50% or more.
9 . The polishing composition according to claim 1 , wherein a volume average particle size of the abrasive grains is 0.05 μm or more and 10 μm or less.
10 . The polishing composition according to claim 1 , wherein the abrasive grains are contained at 5 mass % or more and 30 mass % or less relative to the total mass of the polishing composition.
11 . The polishing composition according to claim 1 , wherein the polishing composition is used for finish polishing of a resin material having a pencil hardness of F or lower.
12 . A polishing method, comprising polishing an object to be polished using the polishing composition according to claim 1 .
13 . The polishing method according to claim 12 , wherein the object to be polished comprises at least one selected from the group consisting of resin materials, alloy materials, and glass materials.
14 . A polishing method, comprising polishing a coated surface with a wool buff and/or a sponge buff, using the polishing composition according to claim 1 .
15 . A polishing composition comprising abrasive grains, water, and a hydrophobic dispersing medium,
wherein the hydrophobic dispersing medium comprises at least two organic solvents selected from the group consisting of normal paraffin hydrocarbons, isoparaffin hydrocarbons, naphthenic hydrocarbons, and terpene hydrocarbons, and has a mixed vapor pressure at 20° C. of 0.004 kPa or more and 2 kPa or less,
wherein the hydrophobic dispersing medium comprises:
an organic solvent having a vapor pressure at 20° C. of 0.01 kPa or more and 0.1 kPa or less; and
an organic solvent having a vapor pressure at 20° C. of 0.001 kPa or less.
16 . A method for producing a polishing composition, comprising:
a step of providing a hydrophobic dispersing medium comprising at least two organic solvents selected from the group consisting of normal paraffin hydrocarbons, isoparaffin hydrocarbons, naphthenic hydrocarbons, and terpene hydrocarbons, and
wherein the hydrophobic dispersing medium has a mixed vapor pressure at 20° C. of 0.004 kPa or more and 2 kPa or less, and comprises:
an organic solvent having an organic solvent having a vapor pressure at 20° C. of 0.01 kPa or more and 0.1 kPa or less; and
an organic solvent having a vapor pressure at 20° C. of 0.001 kPa or less; and/or
wherein the hydrophobic dispersing medium has a FPI flash point of 30° C. or more and 100° C. or less, and comprises:
an organic solvent having a flash point of more than 45° C. and 65° C. or less, or an organic solvent having a flash point of more than 65° C. and less than 100° C.; and
an organic solvent having a flash point of 100° C. or more and 180° C. or less; and
a step of mixing the hydrophobic dispersing medium, water, and abrasive grains.
17 . A polishing method, comprising polishing an object to be polished using the polishing composition obtained by the production method of claim 16 .
18 . A polishing method, comprising polishing a coated surface with a wool buff and/or a sponge buff, using the polishing composition obtained by production method of claim 16 .