Method of manufacturing semiconductor device, method of managing parts, and recording medium
There is provided a technique that includes executing a process recipe for processing a substrate; and executing a correction recipe for checking a characteristic value of a supply valve installed at a process gas supply line, wherein the act of executing the correction recipe comprises: supplying an inert gas into the process gas supply line for a certain period of time in a state where an adjusting valve that is installed at an exhaust portion of a process furnace and adjusts an internal pressure of the process furnace is fully opened; detecting a pressure value in a supply pipe provided with the supply valve while supplying the inert gas into the process gas supply line in the state where the adjusting valve is fully opened; and calculating the characteristic value of the supply valve based on the detected pressure value.
1 . A substrate processing apparatus comprising:
a process chamber in which a substrate is processed;
a supply valve configured to supply a process gas into the process chamber;
a sensor configured to detect a pressure value in a slupply pipe provided with the supply valve;
a boat configured to hold the substrate; and
a controller configured to be capable of executing a process, before processing the substrate by supplying the process gas into the process chamber according to a process recipe, the process comprising:
(a) loading the boat into the process chamber in a state where the boat does not hold the substrate;
(b) supplying an inert gas into the process chamber for a predetermined period of time by opening the supply valve;
(c) detecting the pressure value in the supply pipe by the sensor while supplying the inert gas;
(d) calculating a characteristic value of the supply valve based on the detected pressure value;
(e) determining whether the calculated characteristic value falls within a predetermined range; and
(f) in response to determining that the calculated characteristic value falls within the predetermined range, unloading the boat from the process chamber.
2 . The substrate processing apparatus of claim 1 , further comprising an adjusting valve installed at an exhaust portion of the process chamber and configured to adjust a pressure of the process chamber,
wherein the controller is configured to be capable of executing the act of (b) in a state where the adjusting valve is opened.
3 . The substrate processing apparatus of claim 1 , wherein the controller is configured to be capable of setting at least one selected from the group of pressure, temperature, flow rate, and processing time in the act of (b) to be the same as a process condition in the act of processing the substrate.
4 . The substrate processing apparatus of claim 1 , wherein the process further comprises (g) purging the process chamber by opening the supply valve before the act of (b), and
wherein the controller is configured to set at least one selected from the group of pressure, temperature, flow rate, and processing time in the act of (b) and the act of (g) to be the same as each other.
5 . The substrate processing apparatus of claim 1 , further comprising a heater provided at the supply valve,
wherein, in the act of (b), the controller is configured to be capable of heating the inert gas by the heater.
6 . The substrate processing apparatus of claim 5 , wherein the controller is configured to be capable of executing the act of (d) and the act of (b) in parallel.
7 . The substrate processing apparatus of claim 5 , wherein the act of (b) comprises maintaining a temperature of the supply valve when the characteristic value of the supply valve is previously calculated.
8 . The substrate processing apparatus of claim 5 , wherein the act of (d) is executed after maintenance operation of the heater.
9 . The substrate processing apparatus of claim 1 , further comprising an adjusting valve installed at an exhaust portion of the process chamber and configured to adjust a pressure of the process chamber,
wherein the controller is configured to be capable of executing the act of (b) or the act of (c) in a state where the adjusting valve is fully opened.
10 . The substrate processing apparatus of claim 1 , wherein the controller is configured to be capable of executing the act of (d) before the process recipe is executed.
11 . The substrate processing apparatus of claim 10 , wherein the controller is configured to be capable of executing the act of (d) each time the process recipe is executed one or more times.
12 . The substrate processing apparatus of claim 10 , wherein the act of (d) is executed after a process condition of the process recipe is changed.
13 . The substrate processing apparatus of claim 10 , wherein a condition in the act of (b) is the same as at least one selected from the group of pressure, temperature, and processing time of the process recipe.
14 . The substrate processing apparatus of claim 1 , wherein the controller is configured to be capable of executing a correction recipe to execute calculating of the characteristic value of the supply valve, and
wherein the correction recipe is configured to be executable in a state where the substrate is not placed in the process chamber.
15 . The substrate processing apparatus of claim 1 , wherein the controller is configured to be capable of executing a correction recipe to execute calculating of the characteristic value of the supply valve, and
wherein the correction recipe includes the act of (b), the act of (c), and the act of (d).
16 . A method of adjusting parts comprising a process, before processing a substrate by supplying a process gas into a process chamber according to a process recipe, the process comprising:
(a) loading a boat into the process chamber in a state where the boat does not hold the substrate;
(b) supplying an inert gas into the process chamber for a predetermined period of time by opening a supply valve;
(c) detecting a pressure value in the supply pipe by a sensor while supplying the inert gas;
(d) calculating a characteristic value of the supply valve based on the detected pressure value;
(e) determining whether the calculated characteristic value falls within a predetermined range; and
(f) in response to determining that the calculated characteristic value deviates from falls within the predetermined range, unloading the boat from the process chamber.
17 . The method of claim 16 , further comprising processing the substrate by supplying the process gas into the process chamber using the parts adjusted by the act of (b) to the act of (d).
18 . The method of claim 16 , further comprising processing the substrate including a semiconductor device by supplying the process gas into the process chamber using the parts adjusted by the act of (b) to the act of (d).
19 . A non-transitory computer-readable recording medium storing a program that causes, by a computer, a substrate processing apparatus to execute a process, before processing a substrate by supplying a process gas into a process chamber according to a process recipe, the process comprising:
(a) loading a boat into the process chamber in a state where the boat does not hold the substrate;
(b) supplying an inert gas into the process chamber for a predetermined period of time by opening a supply valve;
(c) detecting a pressure value in the supply pipe by a sensor while supplying the inert gas;
(d) calculating a characteristic value of the supply valve based on the detected pressure value;
(e) determining whether the calculated characteristic value falls within a predetermined range; and
(f) in response to determining that the calculated characteristic value falls within the predetermined range, unloading the boat from the process chamber.