Method for fault analysis in wafers
A method for fault analysis in wafers includes determining multiple wafer maps comprising indications of anomalies of the wafers, performing an evaluation based on the determined wafer maps, and performing the fault analysis based on the evaluation performed. Performing the evaluation includes multiple execution of a cluster analysis based on the determined wafer maps using different parameters, and identifying distinct clusters determined by the differently parameterized cluster analyses.
1 . A method for fault analysis in wafers, comprising:
determining wafer maps comprising indications of anomalies of the wafers, the determined wafer maps including wafer maps for different wafers;
combining the determined wafer maps to form a matrix, the determined wafers being combined (i) using dimensional extension, (ii) using a subsequent dimensional reduction, and (iii) using hyperparameters;
evaluating the determined wafer maps by (i) performing multiple executions of a cluster analysis on the matrix of the determined wafer maps, each of the multiple executions using different parameters for the cluster analysis, and (ii) identifying sets of clusters of the determined wafer maps, each respective set of clusters resulting from a respective execution of the multiple executions of the cluster analysis; and
performing the fault analysis based on the sets of clusters.
2 . The method according to claim 1 , wherein:
the different parameters of the multiple executions of the cluster analysis are selected is performed such that the sets of clusters determined from the multiple executions of the cluster analysis are different from one another; and
at least some clusters in the sets of clusters result from more than one of the multiple executions of the cluster analysis.
3 . The method according to claim 1 , wherein:
the sets of clusters determined from the multiple executions of the cluster analysis are different from one another; and
clusters in the sets of clusters that result from more than one of the multiple executions of the cluster analysis are combined.
4 . The method according to claim 1 , wherein:
same data from the determined wafer maps are analyzed by the multiple executions of the cluster analysis.
5 . The method according to claim 1 , wherein:
multiple wafers from a wafer production process are provided as the wafers; and
the sets of clusters are each identified as signatures specific for consistent anomalies in multiple wafers.
6 . The method according to claim 1 , wherein:
each of the determined wafer maps from a metrological detection of the anomalies on a respective wafer during wafer production.
7 . The method according to claim 1 , wherein the respective wafer is as a silicon wafer and/or a metal wafer.
8 . A non-transitory computer-readable medium that stores a computer program comprising instructions that, when executed by a computer, prompt the computer to perform the method according to claim 1 .
9 . A device for data processing, which is configured to perform the method according to claim 1 .