Substrate holding apparatus, substrate processing apparatus, separation method, and article manufacturing method

1 . A substrate holding apparatus comprising:

a holder configured to hold a substrate by applying a holding force to the substrate;

a gas supplier configured to supply a gas between the substrate and the holder; and

a controller configured to control the gas supplier,

wherein an adhesive force between the substrate and the holder decreases over time as the gas is supplied by the gas supplier, the adhesive force being a residual adhesive force remaining after the holder stops application of the holding force holding the substrate, and

wherein in a case of separating the substrate from the holder, the controller is configured to control a supply amount of the gas to be reduced based on information concerning the residual adhesive force between the substrate and the holder.

2 . The apparatus according to claim 1 , wherein the controller is configured to further control the gas supplier based on at least one of a characteristic of the substrate and a characteristic of the holder.

3 . The apparatus according to claim 2 , wherein the characteristic of the substrate includes at least one of an amount of warpage of the substrate, a roughness of a surface of the substrate which comes into contact with the holder, the type of a film formed on the substrate, a material of the substrate, and a thickness of the substrate.

4 . The apparatus according to claim 2 , wherein the characteristic of the holder includes at least one of a flatness of a holding surface holding the substrate, a surface roughness of the holding surface, thicknesses of a plurality of convex portions provided on the holder, and a material of the holder.

5 . The apparatus according to claim 1 , wherein

the gas supplier includes a pipe configured to allow the gas to flow therethrough, and

the pipe is also used to decompress a space between the substrate and the holder to hold the substrate by the holder.

6 . The apparatus according to claim 1 ,

wherein the controller is configured to further control a supply time of the gas.

7 . The apparatus according to claim 1 , wherein

a plurality of openings are formed in a surface of the holder facing the substrate, and

the controller is configured to separately control a supply amount of a gas from a first opening among the plurality of openings and a supply amount of a gas from a second opening among the plurality of openings.

8 . The apparatus according to claim 7 , wherein the plurality of openings include an opening used for gas supply and an opening not used for gas supply.

9 . The apparatus according to claim 1 , further comprising:

a driving mechanism configured to drive the holder in a first direction orthogonal to the holding surface of the holder which holds the substrate; and

a measurement unit configured to measure a position of the holder in the first direction,

wherein the information concerning the residual adhesive force is obtained based on a difference between a target position of the holder in the first direction and a position of the holder in the first direction which is measured by the measurement unit.

10 . The apparatus according to claim 1 , further comprising:

a pipe provided in the gas supplier for allowing the gas to flow therethrough; and

a pressure sensor configured to measure a pressure in the pipe,

wherein the information concerning the residual adhesive force is obtained based on a pressure measured by the pressure sensor.

11 . The apparatus according to claim 1 ,

wherein the controller is configured to set contents of control of supply of the gas for each lot.

12 . A substrate processing apparatus comprising:

a holder configured to hold a substrate by applying a holding force to the substrate; and

a gas supplier configured to supply a gas between the substrate and the holder; and

a controller configured to control the gas supplier,

wherein an adhesive force between the substrate and the holder decreases over time as the gas is supplied by the gas supplier, the adhesive force being a residual adhesive force remaining after the holder stops application of the holding force holding the substrate, and

wherein in a case of separating the substrate from the holder, the controller is configured to control a supply amount of the gas to be reduced based on information concerning the residual adhesive force between the substrate and the holder.

13 . The apparatus according to claim 12 , wherein the controller is configured to further control a supply time of the gas.

14 . The apparatus according to claim 12 , wherein the apparatus is a lithography apparatus configured to form a pattern on a substrate.

15 . A separation method of separating a substrate from a holder holding the substrate by applying a holding force to the substrate, comprising:

acquiring information concerning an adhesive force between the substrate and the holder;

supplying a gas between the substrate and the holder based on the information concerning the adhesive force acquired in the acquiring; and

separating the substrate from the holder after supply of the gas is started in the supplying,

wherein the adhesive force is a force that decreases over time as the gas is supplied, the adhesive force being a residual adhesive force remaining after the holder stops application of the holding force holding the substrate, and

wherein in the supplying, a supply amount of the gas is reduced based on information concerning the residual adhesive force.

16 . An article manufacturing method comprising:

forming a pattern on a substrate held by a holder applying a holding force to the substrate;

acquiring information concerning an adhesive force between the substrate and the holder;

supplying, based on the information concerning the adhesive force acquired in the acquiring, a gas between the holder and the substrate with the pattern formed thereon in the forming;

separating the substrate from the holder after supply of the gas is started in the supplying;

processing the substrate separated in the separating; and

manufacturing an article using the substrate processed in the processing,

wherein the adhesive force is a force that decreases over time as the gas is supplied, the adhesive force being a residual adhesive force remaining after the holder stops application of the holding force holding the substrate, and

wherein in the supplying, a supply amount of the gas is reduced based on information concerning the residual adhesive force.