Lithography system and method including thermal management

1 . A method of performing lithography, wherein the method includes:

providing a mask to a mask holder of a lithography tool;

providing a target substrate to a wafer stage of the lithography tool;

delivering a radiation beam from a source of the lithography tool, wherein the delivered radiation beam is reflected off of the mask;

providing the reflected radiation beam to the target substrate; and

during the delivering the radiation beam, performing a thermal control management, wherein the thermal control management includes:

receiving a temperature associated with the mask holder from a first temperature measurement device,

receiving a temperature associated with the mask from a second temperature measurement device,

modifying an output of a thermal regulation component based on the received temperatures, wherein the modifying the output includes determining a gas flow.

2 . The method of claim 1 , wherein the

the first temperature measurement device is a thermal couple; and

the second temperature measurement device is an infrared (IR) sensor.

3 . The method of claim 1 , wherein the modifying the output of the thermal regulation component includes determining a temperature of the gas flow temperature of below 22° C.

4 . The method of claim 3 , wherein the modifying the output of the thermal regulation component further includes providing a coolant to the mask holder.

5 . The method of claim 1 , wherein the first temperature measurement device is positioned on the mask holder and receiving the temperature associated with the mask holder includes receiving a first temperature associated with a first region of the mask holder and a second temperature associated with a second region of the mask holder.

6 . The method of claim 1 , wherein the second temperature measurement device is an infrared (IR) sensor, and the first temperature measurement device is positioned on the mask holder.

7 . The method of claim 1 , wherein the performing the thermal control management further includes:

receiving a pattern density of the mask; and

determining an initial output of the thermal regulation component based on the pattern density.

8 . The method of claim 1 , wherein the radiation is extreme ultraviolet radiation wavelength.

9 . The method of claim 1 , wherein the thermal control management also includes providing instruction to a heat exchanger in a reticle chuck used in the lithography process.

10 . The method of claim 9 , wherein the providing the instruction to the heat exchanger includes providing instructions to a first component having a coolant in a first portion of the reticle chuck and providing instructions to a second component having a coolant in a second portion of the reticle chuck, wherein the first component and the second component are separately controllable.

11 . A method of performing lithography, wherein the method includes:

providing a mask and a target substrate to a lithography tool;

delivering a radiation beam to the mask, wherein the delivered radiation beam is reflected off of the mask;

providing the reflected radiation beam to the target substrate; and

during the delivering the radiation beam, performing a thermal control management, wherein the thermal control management includes:

receiving a temperature associated with an environment of the mask, wherein the temperature associated with the environment of the mask is received from a direct sensing component;

receiving a temperature associated with the mask, wherein the temperature associated with the mask is received from an indirect sensing component; and

modifying an output of a thermal regulation component based on both of the received temperatures, wherein the modifying the output includes determining a gas flow.

12 . The method of claim 11 , wherein the direct sensing component is a thermal couple and the indirect sensing component is an infrared (IR) sensor.

13 . The method of claim 11 , further comprising: receiving design data associated with a pattern on the mask; and using the design data to determine the modifying the output of the thermal regulation component.

14 . The method of claim 11 , where the modifying the output of the thermal regulation component further includes providing a coolant to a mask holder included in the environment of the mask, wherein the coolant is at least one of a liquid or a gas.

15 . The method of claim 1 , wherein the determining the gas flow is providing instruction to a first gas jet to provide the gas flow.

16 . The method of claim 15 , wherein the gas flow is below approximately 22° C.

17 . The method of claim 15 , wherein the determining the gas flow includes providing instruction to a second gas jet to provide another gas flow.

18 . The method of claim 17 , wherein the gas flow from the first gas jet is at least 3° C. colder than the gas flow from the second gas jet.