Electromechanical switches on input/output (I/O) components

1 . An apparatus, comprising:

an input/output (I/O) pad;

an input driver coupled to the I/O pad;

an output driver coupled to the I/O pad;

a first microelectromechanical systems (MEMS) switch coupled to the I/O pad and to the input driver; and

a second MEMS switch coupled to the I/O pad and to the output driver;

wherein:

the first MEMS switch is placed in an open position to isolate the input driver from the I/O pad when the output driver is actively driving a signal;

the second MEMS switch is placed in an open position to isolate the output driver from the I/O pad when the input driver is actively driving a signal; and

while the input and output drivers are not actively driving a signal and to isolate both the input and output drivers from the I/O pad:

the first MEMS switch is placed in the same position as the position in which the first MEMS switch is placed, while the output driver is actively driving a signal; and

the second MEMS switch is placed in the same position as the position in which the second MEMS switch is placed, while the input driver is actively driving a signal.

2 . The apparatus of claim 1 , wherein the apparatus comprises a bidirectional I/O component.

3 . The apparatus of claim 2 , wherein operation of the first MEMS switch or the second MEMS switch provides sufficient electrical isolation that the bidirectional I/O component does not include a separate electrostatic discharge (ESD) protection circuit.

4 . The apparatus of claim 1 , wherein the one of the input and output drivers is a receiver driver and the other of the input and output drivers is a transmit driver.

5 . The apparatus of claim 1 , wherein the first MEMS switch or the second MEMS switch is operable to isolate the one of the input and output drivers from the I/O pad when the first MEMS switch or the second MEMS switch is in an open position.

6 . A system, comprising:

an input/output (I/O) component comprising:

an I/O pad coupled to an output driver and an input driver;

a first microelectromechanical systems (MEMS) switch coupled between the I/O pad and the output driver, the first MEMS switch operable to isolate the output driver from the I/O pad and the input driver; and

a second MEMS switch coupled between the I/O pad and the input driver, the second MEMS switch operable to isolate the input driver from the I/O pad and the output driver;

a controller coupled to the I/O component; the controller configured to:

place, to isolate the output driver from the I/O pad and the input driver, the first MEMS switch in an open position, while the input driver is actively driving a signal;

place, to isolate the input driver from the I/O pad and the output driver, the second MEMS switch in an open position, while the output driver is actively driving a signal; and

place, while the input and output drivers are not actively driving a signal and to isolate both the input and output drivers from the I/O pad:

the first MEMS switch in the same position as the position in which the first MEMS switch is placed, while the input driver is actively driving a signal, and

the second MEMS switch in the same position as the position in which the second MEMS switch is placed, while the output driver is actively driving a signal.

7 . The system of claim 6 , wherein:

the output driver is operable to drive a signal to the I/O pad; and

the input driver is operable to drive a signal received from the I/O pad.

8 . The system of claim 6 , wherein the controller is configured to place the first MEMS switch or second MEMS switch in an open or closed position during operation of the system.

9 . The system of claim 6 , wherein the controller is configured to place, to cause the input driver to drive a signal, the second MEMS in a closed position to couple the input driver to the I/O pad.

10 . The system of claim 6 , wherein the input and output drivers are coupled to the I/O pad without being coupled to an electrostatic discharge (ESD) protection circuit.

11 . The system of claim 6 , wherein:

the output driver corresponds to a transmitter; and

the input driver corresponds to a receiver.

12 . A method, comprising:

in association with driving a signal via an output driver of an input/output (I/O) component, closing a first microelectromechanical systems (MEMS) switch coupled between the output driver and an I/O pad of the I/O component; and

while the output driver is actively driving the signal, maintaining a second MEMS switch in an open position, wherein the second MEMS switch is coupled between an input driver of the I/O component and the I/O pad;

placing the first MEMS switch in an open position, while the input driver is actively driving a signal;

placing the second MEMS switch in an open position, while the output driver is actively driving a signal; and

placing, while the input and output drivers are not actively driving a signal:

the first MEMS switch in the same position as the position in which the first MEMS switch is placed, while the input driver is actively driving a signal, and

the second MEMS switch in the same position as the position in which the second MEMS switch is placed, while the output driver is actively driving a signal.

13 . The method of claim 12 , further comprising, in association with driving a signal via the input driver, placing the second MEMS switch in a closed position.

14 . The method of claim 13 , further comprising, while the input driver is actively driving the signal, maintaining the first MEMS switch in an open position to isolate the output driver from the I/O pad.

15 . The method of claim 12 , further comprising dynamically placing the first and the second MEMS switches in an open position and a closed position during operation of a computing device including the I/O component.