IP Library Granted Patent US 12712095
Granted Patent B2
US 12712095 · App. 18/331,637 · Granted Aug 18, 2026

Structures with integrated conductors

Inventors: Jesse Michael Martinez (Milwaukie, OR); Michael Adventure Hopkins (Portland, OR); Charles J. Kinzel (Portland, OR); Trevor Antonio Rivera (Portland, OR); Mark William Ronay (Portland, OR); Edward Martin Godshalk (Newberg, OR)
Assignee: Liquid Wire Inc.
H01B5/02H01B1/22H01B3/40H01B3/48H01B7/0027H01B13/0036H01B19/04
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Quick Facts
Patent No.
US 12712095
App. No.
18/331,637
Granted
Aug 18, 2026
Kind
B2
Abstract

Systems, structures, and methods include a structure formed from a plurality of layers of matrix material. A bus is secured between adjacent layers of the plurality of layers of the matrix material. The bus includes a conductive gel configured to propagate an electrical signal through the structure.

Claims (29)

1 . A method of manufacturing a molded article, comprising the steps of:

forming a bus from a first material and a conductor, wherein forming the bus includes depositing the conductor on a sheet made from the first material;

placing the bus in a mold; and

surrounding at least a portion of the bus with a second material within the mold, the second material being a matrix material in an uncured state;

curing the second material to cause the first material to bond with the second material and encapsulate, at least in part, the bus within the second material.

2 . The method of claim 1 , wherein the conductor comprises a conductive gel.

3 . The method of claim 2 , wherein the first material and the second material are substantially similar.

4 . The method of claim 3 , wherein the bus comprises at least one sheet of curable material that is in a partially cured state.

5 . The method of claim 4 , wherein the at least one sheet of curable material is the first material.

6 . The method of claim 5 , wherein the step of curing the matrix material includes curing the at least one sheet of curable material.

7 . The method of claim 1 , wherein the bus is a laminate structure comprising at least a first sheet, a second sheet, and the conductor is disposed between the first and second sheets and forms a trace.

8 . The method of claim 7 , wherein the step of forming the bus includes attaching an electric component to a surface of the bus, and electrically connecting the electric component to the trace.

9 . The method of claim 8 , wherein the laminate structure further comprises a third sheet having a thickness and an aperture extending completely through the thickness, the aperture having the shape of the trace, the third layer interposed between the first and second layers and the conductor substantially filling the aperture such that it is contained by the first, second, and third sheets.

10 . A molded article, comprising:

a bus, comprising:

a first material; and

a conductor;

a second material encapsulating at least a portion of the bus, the second material being a matrix material molded over the bus and bonded with the first material; and

wherein the bus is a laminate structure comprising at least a first sheet, a second sheet, and the conductor is disposed between the first and second sheets.

11 . The molded article of claim 10 , wherein the conductor is disposed on the first material.

12 . The molded article of claim 10 , wherein the conductor comprises a conductive gel.

13 . The molded article of claim 10 , wherein the first material is a cured matrix material.

14 . The molded article of claim 13 , wherein the first material and the second material are substantially similar.

15 . The molded article of claim 14 , wherein the bus comprises at least one sheet of cured matrix material.

16 . The molded article of claim 15 , wherein the at least one sheet of cured matrix material is the first material.

17 . The molded article of claim 15 , wherein an electric component is attached to the bus and electrically connected to the conductor.

18 . The molded article of claim 10 , wherein the laminate structure further comprises a third sheet having a thickness and an aperture extending completely through the thickness, the aperture having the shape of the trace, the third layer interposed between the first and second layers and the conductor substantially filling the aperture such that it is contained by the first, second, and third sheets.

19 . The method of claim 1 , wherein the conductor comprises a fluid phase conductive material.

20 . The molded article of claim 10 , wherein the conductor comprises a fluid phase conductive material.