Multilayer ceramic capacitor and mounting structure for multilayer ceramic capacitor
A multilayer ceramic capacitor includes a multilayer body including internal electrode layers and dielectric layers that are alternately laminated, main surfaces opposite to each other in a lamination direction, end surfaces opposite to each other in a length direction that intersects with the lamination direction, and side surfaces opposite to each other in a width direction that intersects with the lamination direction and the length direction, and external electrodes on the end surfaces. Each of the external electrodes includes a thickest portion at a position off-center in the width direction toward either one of the side surfaces, and the thickest portion is thicker in the length direction than a remainder of the external electrode.
1 . A multilayer ceramic capacitor comprising:
a multilayer body including a plurality of internal electrode layers and a plurality of dielectric layers that are alternately laminated, the multilayer body including surfaces opposite to each other in a lamination direction defining main surfaces, surfaces opposite to each other in a length direction that intersects with the lamination direction defining end surfaces, and surfaces opposite to each other in a width direction that intersects with the lamination direction and the length direction defining side surfaces, and external electrodes on the end surfaces of the multilayer body, respectively;
each of the external electrodes including a thickest portion at a position off-center in the width direction toward either one of the side surfaces, the thickest portion being thicker in the length direction than a remainder of the external electrode.
2 . The multilayer ceramic capacitor according to claim 1 , wherein
the external electrodes include:
a first external electrode on a first end surface that is one of the end surfaces; and
a second external electrode on a second end surface that is an other of the end surfaces;
the thickest portion includes:
a first thickest portion on the first external electrode; and
a second thickest portion on the second external electrode; and
the first thickest portion and the second thickest portion are off-center toward a same one of the main surfaces.
3 . The multilayer ceramic capacitor according to claim 2 , wherein the first thickest portion and the second thickest portion are off-center toward one of the main surfaces that faces a circuit board on which the multilayer ceramic capacitor is to be mounted.
4 . The multilayer ceramic capacitor according to claim 2 , wherein
the side surfaces include a first side surface adjacent to one end in the width direction, and a second side surface adjacent to an other end in the width direction;
the first thickest portion is off-center toward the first side surface; and
the second thickest portion is off-center toward the second side surface.
5 . The multilayer ceramic capacitor according to claim 2 , wherein
the side surfaces include a first side surface adjacent to one end in the width direction, and a second side surface adjacent to an other end in the width direction;
the first thickest portion and the second thickest portion are off-center toward a same one of the first side surface and the second side surface.
6 . The multilayer ceramic capacitor according to claim 2 , wherein the same one of the main surfaces that the first thickest portion and the second thickest portion are off-center toward is a mounting surface to mount the multilayer ceramic capacitor on a board.
7 . The multilayer ceramic capacitor according to claim 2 , wherein the same one of the main surfaces that the first thickest portion and the second thickest portion are off-center toward is not a mounting surface to mount the multilayer ceramic capacitor on a board.
8 . The multilayer ceramic capacitor according to claim 1 , wherein the multilayer ceramic capacitor has a dimension T 1 in the lamination direction and a dimension W 1 in the width direction, and W 1 /2≥T 1 is satisfied.
9 . The multilayer ceramic capacitor according to claim 1 , wherein the thickest portion protrudes by about 10 μm or more in the length direction.
10 . The multilayer ceramic capacitor according to claim 1 , wherein the thickest portion defines a convexity protruding from the remainder of the external electrode.
11 . A mounting structure to mount the multilayer ceramic capacitor according to claim 1 on a circuit board, wherein
one of the main surfaces that is closer to the thickest portion of the multilayer ceramic capacitor faces the circuit board.
12 . The mounting structure according to claim 11 , wherein
the external electrodes include:
a first external electrode on a first end surface that is one of the end surfaces; and
a second external electrode on a second end surface that is an other of the end surfaces;
the thickest portion includes:
a first thickest portion on the first external electrode; and
a second thickest portion on the second external electrode; and
the first thickest portion and the second thickest portion are off-center toward a same one of the main surfaces.
13 . The mounting structure according to claim 12 , wherein the first thickest portion and the second thickest portion are off-center toward one of the main surfaces that faces a circuit board on which the multilayer ceramic capacitor is to be mounted.
14 . The mounting structure according to claim 12 , wherein
the side surfaces include a first side surface adjacent to one end in the width direction, and a second side surface adjacent to an other end in the width direction;
the first thickest portion is off-center toward the first side surface; and
the second thickest portion is off-center toward the second side surface.
15 . The mounting structure according to claim 12 , wherein
the side surfaces include a first side surface adjacent to one end in the width direction, and a second side surface adjacent to an other end in the width direction;
the first thickest portion and the second thickest portion are off-center toward a same one of the first side surface and the second side surface.
16 . The mounting structure according to claim 12 , wherein the same one of the main surfaces that the first thickest portion and the second thickest portion are off-center toward is a mounting surface to mount the multilayer ceramic capacitor on a board.
17 . The mounting structure according to claim 12 , wherein the same one of the main surfaces that the first thickest portion and the second thickest portion are off-center toward is not a mounting surface to mount the multilayer ceramic capacitor on a board.
18 . The mounting structure according to claim 11 , wherein the multilayer ceramic capacitor has a dimension T 1 in the lamination direction and a dimension W 1 in the width direction, and W 1 /2≥T 1 is satisfied.
19 . The mounting structure according to claim 11 , wherein the thickest portion protrudes by about 10 μm or more in the length direction.
20 . The mounting structure according to claim 11 , wherein the thickest portion defines a convexity protruding from the remainder of the external electrode.