Biasable electrostatic chuck

1 . A substrate support assembly, comprising:

an electrostatic chuck body defining a substrate support surface that defines a substrate seat, wherein the electrostatic chuck body defines a backside gas lumen that extends through a surface of the substrate seat;

a bias electrode coupled with the electrostatic chuck body, the bias electrode comprising a plurality of conductive mesas that protrude upward across the substrate seat and comprise top surfaces that are exposed through the electrostatic chuck body;

a support stem coupled with the electrostatic chuck body;

at least one chucking electrode embedded within the electrostatic chuck body, wherein the at least one chucking electrode is distinct from the bias electrode; and

at least one heater embedded within the electrostatic chuck body.

2 . The substrate support assembly of claim 1 , wherein:

the bias electrode comprises a conductive mesh disposed atop the surface of the substrate seat.

3 . The substrate support assembly of claim 1 , further comprising:

an edge ring coupled with a peripheral edge of the electrostatic chuck body, wherein an edge of the bias electrode comprises a conductive element that contacts the edge ring;

a cooling plate disposed beneath the electrostatic chuck body, the cooling plate being coupled with a bottom surface of the edge ring; and

an electrical connection between the edge ring and the cooling plate.

4 . The substrate support assembly of claim 1 , wherein:

the plurality of conductive mesas comprise a wear resistant, electrically conductive coating.

5 . The substrate support assembly of claim 1 , wherein:

the electrostatic chuck body operates as a Johnsen-Rahbek chuck; and

the electrostatic chuck body defines a plurality of additional mesas that protrude from the surface of the substrate seat.

6 . The substrate support assembly of claim 1 , further comprising:

a power source that is electrically coupled with the bias electrode.

7 . The substrate support assembly of claim 1 , wherein:

the at least one heater comprises one or more upper heaters and one or more lower heaters.

8 . The substrate support assembly of claim 7 , wherein:

the one or more upper heaters comprise a plurality of pixel heaters;

the plurality of pixel heaters comprise multiple heaters at different angular positions relative to a center of the substrate seat and multiple heaters at different radial positions relative to the center of the substrate seat; and

the one or more lower heaters comprise a plurality of zonal heaters.

9 . The substrate support assembly of claim 8 , wherein:

the plurality of zonal heaters comprise one or more heaters selected from a group consisting of:

a plurality of wedge-shaped heaters;

a plurality of arc-shaped heaters;

a central circular heater; and

one or more annular heaters that are concentric with the central circular heater.

10 . The substrate support assembly of claim 1 , wherein:

the bias electrode is embedded within the electrostatic chuck body and the plurality of conductive mesas protrude through the surface of the substrate seat.

11 . A substrate support assembly, comprising:

an electrostatic chuck body defining a substrate support surface that defines a substrate seat, wherein the electrostatic chuck body defines a backside gas lumen that extends through a surface of the substrate seat;

a bias electrode comprising a conductive mesh disposed atop the surface of the substrate seat, the bias electrode comprising a plurality of conductive mesas that protrude upward from the conductive mesh;

a support stem coupled with the electrostatic chuck body;

at least one chucking electrode embedded within the electrostatic chuck body; and

at least one heater embedded within the electrostatic chuck body.

12 . The substrate support assembly of claim 11 , further comprising:

an edge ring coupled with a peripheral edge of the electrostatic chuck body, wherein an edge of the bias electrode comprises a conductive element that contacts the edge ring;

a cooling plate disposed beneath the electrostatic chuck body, the cooling plate being coupled with a bottom surface of the edge ring; and

an electrical connection between the edge ring and the cooling plate.

13 . The substrate support assembly of claim 11 , wherein:

the electrostatic chuck body operates as a coulombic chuck; and

the surface of the substrate seat is substantially flat where none of the plurality of conductive mesas are present.

14 . The substrate support assembly of claim 11 , wherein:

the conductive mesh comprises an inner ring, an outer ring, and a plurality of spokes that connect the inner ring and the outer ring.

15 . The substrate support assembly of claim 14 , wherein:

the conductive mesh further comprises an intermediate ring disposed between the inner ring and the outer ring; and

the intermediate ring is coupled with the plurality of spokes.

16 . The substrate support assembly of claim 11 , wherein:

at least 75% of a surface area of the surface of the substrate seat is free of mesas.

17 . A substrate support assembly, comprising:

an electrostatic chuck body defining a substrate support surface that defines a substrate seat, wherein the electrostatic chuck body defines a backside gas lumen that extends through a surface of the substrate seat;

a bias electrode coupled with the electrostatic chuck body, the bias electrode comprising a plurality of conductive mesas that protrude upward across the substrate seat;

an edge ring coupled with a peripheral edge of the electrostatic chuck body, wherein an edge of the bias electrode comprises a conductive element that contacts the edge ring;

a cooling plate disposed beneath the electrostatic chuck body, the cooling plate being coupled with a bottom surface of the edge ring; and

an electrical connection between the edge ring and the cooling plate;

a support stem coupled with the electrostatic chuck body;

at least one chucking electrode embedded within the electrostatic chuck body; and

at least one heater embedded within the electrostatic chuck body.

18 . The substrate support assembly of claim 17 , further comprising:

an additional plurality of mesas having a first diameter, wherein the plurality of conductive mesas have a second diameter that is larger than the first diameter.

19 . The substrate support assembly of claim 18 , wherein:

the substrate support assembly comprises a greater number of the additional plurality of mesas than the plurality of conductive mesas.

20 . The substrate support assembly of claim 18 , wherein:

the additional plurality of mesas comprise a same material as the plurality of conductive mesas.