Substrate treating apparatus and substrate treating method

1 . A substrate treating apparatus comprising:

a chamber having an entrance for taking in and taking out a substrate at a side wall and having an opposite sidewall including a transparent material;

a support chuck provided inside of the chamber and supporting the substrate;

a first camera module for imaging the substrate configured to be taken in by a transfer robot through the entrance,

wherein the first camera module is installed outside of the chamber and positioned to face the opposite sidewall of the chamber and is configured for imaging the entrance of the chamber through the transparent material of the opposite sidewall; and

a controller configured to control a position of the transfer robot based on image data from the first camera module, wherein the controller comprises:

a first controller calculating a position data of the transfer robot; and

a second controller controlling the transfer robot based on the position data of the transfer robot from the first controller,

wherein the first camera module generates a first image data by imaging the substrate which is being passed through the entrance from outside the entrance, and

the first controller receives the first image data in real time from the first camera module to generate a first position data of the transfer robot so the substrate passes through the entrance,

wherein the entrance includes a first apex to a fourth apex adjacent to each other defining a passage for the substrate,

the substrate includes a first end point, and a second end point positioned opposite to the first end point,

the first controller identifies the first apex to the fourth apex of the entrance and the first end point and the second end point of the substrate from the first image data,

the first controller generates the first position data of the transfer robot so the first end point and the second end point of the substrate are positioned within the passage defined by the first apex to the fourth apex of the entrance, and

the second controller controls the position of the transfer robot by receiving the first position data from the first controller in real time.

2 . The substrate treating apparatus of claim 1 , further comprising a second camera module installed above the chamber for imaging the support chuck.

3 . The substrate treating apparatus of claim 2 , wherein the second camera module generates a second image data by imaging the substrate which is being transferred onto a top part of the support chuck inside the chamber, and

the first controller generates a second position data of the transfer robot by receiving the second image data from the second camera module in real time.

4 . The substrate treating apparatus of claim 3 , wherein the first controller identifies a center point of the support chuck and a center point of the substrate based on the second image data,

the first controller calculates the second position data of the transfer robot so the center point of the support chuck and the center point of the substrate are matched, and

the second controller controls the transfer robot by receiving the position data of the transfer robot from the first controller.

5 . The substrate treating apparatus of claim 4 , wherein the second position data is calculated based on:

a first distance between the center point of the support chuck and the center point of the substrate in a first direction, wherein the first direction is a transfer direction of the substrate, and

a second distance between the center point of the support chuck and the center point of the substrate in a second direction, wherein the second direction is a direction perpendicular to the transfer direction of the substrate.

6 . The substrate treating apparatus of claim 2 , wherein the first camera module and the second camera module are configured for at least one of the following:

illumination, or

providing a laser.

7 . The substrate treating apparatus of claim 2 , wherein the second camera module is configured for simultaneously imaging the entrance of the chamber and the support chuck.

8 . The substrate treating apparatus of claim 1 , wherein

the first controller calculates a first height information between the first end point and a line segment connecting the first apex and the second apex and a second height information between the second end point and the line segment, and

the first controller generates the first position data by determining whether the first height information and the second height information correspond to a target value.

9 . The substrate treating apparatus of claim 1 , wherein

the first controller calculates a first width information between the first end point and a line segment connecting the first apex to the fourth apex and a second width information between the second end point and a line segment connecting the second apex and the third apex, and

the first controller generates the first position data by determining whether the first width information and the second width information correspond to a target value.

10 . The substrate treating apparatus of claim 1 , wherein the chamber is made from a conductive material.

11 . The substrate treating apparatus of claim 1 , wherein the chamber includes an exhaust hole disposed through a bottom wall.

12 . The substrate treating apparatus of claim 1 , wherein the support chuck adsorbs the substrate using electrostatic force.