Modular heat mitigation system with mmWave suppression for active electronically steered antennas
A mmWave phased array antenna that has particular application to be used in a 5G radio. The antenna includes an enclosure and a RGB structure provided in the enclosure, where the RGB structure includes a plurality of layers having dielectric layers and conductive layers. The antenna also includes a plurality of radiating elements formed on one side of the RGB structure and a plurality of beamforming ICs formed on an opposite side of the RGB structure from the radiating elements, where gaps are defined between the beamforming ICs. A modular heatsink unit is removably coupled to the enclosure, and includes a heatsink, a plurality of pedestals thermally coupled thereto, where each pedestal is thermally coupled to one of the beamforming ICs, and a plurality of propagation suppressing elements, where a separate propagation suppressing element is provided in each gap between the beamforming ICs.
1 . An antenna comprising:
an enclosure;
a printed circuit board (PCB) structure provided in the enclosure, said PCB structure including a plurality of layers having dielectric layers and conductive layers;
a plurality of radiating elements formed on one side of the PCB structure;
a plurality of beamforming integrated circuits (ICs) formed on an opposite side of the PCB structure from the radiating elements, where gaps are defined between the beamforming ICs; and
a modular heatsink unit removably coupled to the enclosure, said heatsink unit including a heatsink and a plurality of pedestals thermally coupled thereto, where each pedestal is thermally coupled to one of the beamforming ICs.
2 . The antenna according to claim 1 wherein the modular heatsink unit includes a plurality of propagation suppressing elements, where a separate propagation suppressing element is provided in each gap between the beamforming ICs.
3 . The antenna according to claim 2 wherein the propagation suppressing elements are foam elements.
4 . The antenna according to claim 1 wherein the heatsink is metal.
5 . The antenna according to claim 4 wherein the heatsink is a flat slab.
6 . The antenna according to claim 1 wherein the radiating elements are patch antenna radiating elements.
7 . The antenna according to claim 1 wherein the radiating elements are horn antenna radiating elements.
8 . The antenna according to claim 1 wherein the antenna is a phased array antenna.
9 . The antenna according to claim 8 wherein the antenna is part of a 5G radio.
10 . A phased array antenna comprising:
an enclosure;
a printed circuit board (PCB) structure provided in the enclosure, said PCB structure including a plurality of layers having dielectric layers and conductive layers;
a plurality of patch antenna radiating elements formed on one side of the PCB structure;
a plurality of beamforming integrated circuits (ICs) formed on an opposite side of the PCB structure from the radiating elements, where gaps are defined between the beamforming ICs; and
a modular heatsink unit removably coupled to the enclosure, said heatsink unit including a heatsink, a plurality of pedestals thermally coupled thereto, where each pedestal is thermally coupled to one of the beamforming ICs, and a plurality of propagation suppressing elements, and where a separate propagation suppressing element is provided in each gap between the beamforming ICs.
11 . The antenna according to claim 10 wherein the propagation suppressing elements are foam elements.
12 . The antenna according to claim 10 wherein the heatsink is metal.
13 . The antenna according to claim 10 wherein the heatsink is a flat slab.
14 . The antenna according to claim 10 wherein the antenna is part of a 5G radio.
15 . A phased array antenna comprising:
an enclosure;
a printed circuit board (PCB) structure provided in the enclosure, said PCB structure including a plurality of layers having dielectric layers and conductive layers;
a plurality of horn antenna radiating elements formed on one side of the PCB structure;
a plurality of beamforming integrated circuits (ICs) formed on an opposite side of the PCB structure from the radiating elements, where gaps are defined between the beamforming ICs; and
a modular heatsink unit removably coupled to the enclosure, said heatsink unit including a heatsink, a plurality of pedestals thermally coupled thereto, where each pedestal is thermally coupled to one of the beamforming ICs, and a plurality of propagation suppressing elements, where a separate propagation suppressing element is provided in each gap between the beamforming ICs.
16 . The antenna according to claim 15 wherein the propagation suppressing elements are foam elements.
17 . The antenna according to claim 15 wherein the heatsink is metal.
18 . The antenna according to claim 17 wherein the heatsink is a flat slab.
19 . The antenna according to claim 15 wherein the antenna is part of a 5G radio.