Electronic device

1 . An electronic device, comprising:

a first substrate having a plurality of antenna elements configured to radiate a first electromagnetic wave, the first substrate excluding an active component;

a second substrate having a first surface facing the first substrate and a second surface opposite to the first surface of the second substrate, wherein the first substrate is connected to the first surface of the second substrate through a soldering material, and wherein the soldering material, the first substrate, and the second substrate define an air cavity;

a radiating element configured to radiate a second electromagnetic wave different from the first electromagnetic wave, wherein the radiating element includes:

a waveguide disposed on the second surface of the second substrate; and

a conductive layer disposed on the waveguide and having a plurality of slots partially exposing the waveguide; and

an active device electrically connecting to the first substrate, wherein at least one of the slots of the conductive layer overlaps the active device in a first direction substantially perpendicular to the second surface of the second substrate.

2 . The electronic device of claim 1 , wherein a radiation pattern of the first electromagnetic wave is adjustable, and the plurality of antenna elements have a first scan-angle coverage,

wherein a radiation pattern of the second electromagnetic wave is fixed, and the radiating element has a second scan-angle coverage,

wherein the first scan-angle coverage is wider than the second scan-angle coverage, and

wherein the active device includes an RF IC configured to convert the first electromagnetic wave to the second electromagnetic wave and vice versa.

3 . The electronic device of claim 1 , wherein the waveguide defines a cavity.

4 . The electronic device of claim 3 , wherein the cavity includes an air cavity, the plurality of slots expose the air cavity, and wherein the air cavity is configured to conduct the second electromagnetic wave, and the plurality of slots are configured to receive and/or radiate the second electromagnetic wave.

5 . The electronic device of claim 4 , wherein the waveguide is disposed between the conductive layer and the second substrate.

6 . The electronic device of claim 5 , wherein the plurality of slots are arranged in an array.

7 . The electronic device of claim 1 , wherein a thickness of the active device is less than a thickness of the soldering material measured in the first direction.

8 . The electronic device of claim 7 , wherein a thickness of the radiating element is greater than a thickness of the first substrate, and the thickness of the radiating element is greater than a distance between the first substrate and the second substrate measured in the first direction.

9 . The electronic device of claim 1 ,

wherein the plurality of antenna elements are separated from the radiating element by the first substrate and the second substrate.

10 . The electronic device of claim 2 , the radiating element is configured to radiate the second electromagnetic wave in a substantially fixed direction.

11 . The electronic device of claim 2 , wherein the first scan-angle coverage and the second scan-angle coverage are not overlapped.

12 . The electronic device of claim 2 , wherein the plurality of antenna elements are configured to radiate the first electromagnetic wave to a first device having a first mobility, and the radiating element is configured to radiate the second electromagnetic wave to a second device having a second mobility, and wherein the first mobility is different from the second mobility.

13 . The electronic device of claim 1 , further comprising:

a conductive structure non-overlapping with the radiating element in the first direction,

wherein the conductive structure defines a space.

14 . The electronic device of claim 13 , wherein the conductive structure includes a lead frame.

15 . The electronic device of claim 13 , wherein the space defined by the conductive structure is covered by the first substrate and the conductive layer is disposed under the conductive structure.

16 . The electronic device of claim 3 , wherein an active surface of the active device faces the cavity of the waveguide, and the active device overlaps at least one of the plurality of antenna elements and the cavity of the waveguide in the first direction.

17 . The electronic device of claim 16 , wherein a backside surface of the active device is in contact with a lower surface of the first substrate, and the active surface of the active device is connected with the second substrate through a solder ball.

18 . The electronic device of claim 17 , wherein the soldering material is non-overlapped with the cavity of the waveguide and the slots of the conductive layer in the first direction, and wherein the soldering material is overlapped with the active device and the solder ball in a second direction substantially parallel with the second surface of the second substrate.

19 . The electronic device of claim 1 , wherein the first substrate includes a device mounting region non-overlapping with the radiating element in the first direction, and wherein the device mounting region comprises:

a conductive structure defining a space; and

an electronic component disposed within the space and electrically connected to the first substrate.

20 . The electronic device of claim 19 , wherein the conductive structure includes a lead frame, the space defined by the conductive structure is covered by the first substrate, and the conductive layer is disposed under the conductive structure.