Inverter having seal member between power semi-conductor and inverter mount
An electric drive unit having a motor assembly with a stator, a rotor, which is rotatably received in the stator, and an inverter that includes an inverter mount, a plurality of heat-sinked power semiconductors, and a plurality of seal members. The inverter mount has a base that defines a plurality of terminal apertures. Each heat-sinked power semiconductor includes a power semiconductor, which has a body and a plurality of terminals that extend from the body, and a heat sink that is fixedly and thermally coupled to the body of the power semiconductor. The terminals of each of the power semiconductors are received through a corresponding one of the seal members and through a set of the terminal apertures. Each seal member forms a seal between the power semiconductor and the inverter mount that inhibits fluid flow through the terminal apertures.
1 . An electric drive unit comprising:
a motor assembly having a stator, a rotor and an inverter, the stator having a plurality of windings, the rotor being rotatably disposed within the stator, the inverter having an inverter mount, a plurality of heat-sinked power semiconductors, and a plurality of seal members, the inverter mount having a base that defines a plurality of semiconductor terminal apertures, each of the heat-sinked power semiconductors having a power semiconductor and a heat sink, the power semiconductor having a body and a plurality of terminals that extend from the body, the heat sink being fixedly and thermally coupled to the body of the power semiconductor,
wherein the terminals of each of the power semiconductors are received through a corresponding one of the seal members and through an associated set of the semiconductor terminal apertures, the seal members forming seals between the power semiconductor and the inverter mount that inhibits fluid flow through the semiconductor terminal apertures, and
wherein each of the seal members is disposed on side of the inverter mount that is opposite the bodies of the power semiconductors.
2 . The electric drive unit of claim 1 , wherein each of the seal members is a discrete component.
3 . The electric drive unit of claim 1 , wherein a plurality of the seal members are fixedly coupled to one another.
4 . The electric drive unit of claim 3 , wherein all of the seal members are fixedly coupled to one another.
5 . The electric drive unit of claim 1 , wherein the seal members are overmolded onto the inverter mount.
6 . The electric drive unit of claim 1 , wherein each of the seal members is disposed between the inverter mount and the body of an associated one of the power semiconductors.
7 . The electric drive unit of claim 6 , wherein the inverter mount defines a plurality of semiconductor recesses, wherein each set of terminal apertures intersects an associated one of the semiconductor recesses, and wherein each seal member is received in a corresponding one of the semiconductor recesses.
8 . An electric drive unit comprising:
a motor assembly having a stator, a rotor and an inverter, the stator having a plurality of windings, the rotor being rotatably disposed within the stator, the inverter having an inverter mount, a plurality of heat-sinked power semiconductors, and a plurality of seal members, the inverter mount having a base that defines a plurality of semiconductor terminal apertures, each of the heat-sinked power semiconductors having a power semiconductor and a heat sink, the power semiconductor having a body and a plurality of terminals that extend from the body, the heat sink being fixedly and thermally coupled to the body of the power semiconductor,
wherein the terminals of each of the power semiconductors are received through a corresponding one of the seal members and through an associated set of the semiconductor terminal apertures, the seal members forming seals between the power semiconductor and the inverter mount that inhibits fluid flow through the semiconductor terminal apertures,
wherein each of the seal members is disposed between the inverter mount and the body of an associated one of the power semiconductors, and
wherein the inverter mount defines a plurality of semiconductor recesses, wherein each set of terminal apertures intersects an associated one of the semiconductor recesses, and wherein each seal member is received in a corresponding one of the semiconductor recesses.