Acoustic wave clock distribution
Clock distribution in an integrated circuit component can comprise the generation of bulk acoustic waves by acoustic transmitters and propagation of the bulk acoustic waves across the substrate where they are received by piezoelectric elements acting as acoustic receivers. Clock distribution can also comprise the generation of surface acoustic waves by acoustic transmitters located on the same substrate surface as the piezoelectric elements. An acoustic transmitter comprises a layer of piezoelectric material that generates an acoustic wave in response to the piezoelectric layer being activated by a clock source signal applied to the acoustic transmitter. The piezoelectric elements convert the acoustic waves into an electrical signal which can be used as a local clock signal for devices and components in the vicinity of the piezoelectric elements or from which such a local clock signal can be derived.
1 . An apparatus, comprising:
a substrate comprising a semiconductor;
a first piezoelectric layer comprising a first piezoelectric material, the first piezoelectric layer located on a first surface of the substrate, a first region of the substrate comprising a first portion of a second surface of the substrate, the second surface of the substrate opposite the first surface of the substrate, a second region of the substrate comprising a second portion of the second surface of the substrate, a third region of the substrate comprising a third portion of the second surface of the substrate, both the first region and the second region being n-type or p-type, the third region being n-type if the first region and the second region are p-type, the third region being p-type if the first region and the second region are n-type; and
a second piezoelectric layer comprising a second piezoelectric material, the second piezoelectric layer located on the third region of the second surface of the substrate and extending from the first portion of the substrate to the second portion of the substrate.
2 . The apparatus of claim 1 , further comprising a layer comprising oxygen positioned between the second piezoelectric layer and the second surface of the substrate.
3 . The apparatus of claim 1 , wherein the first region of the substrate, the second region of the substrate, and the third region of the substrate are located on a fin that extends upwards from the second surface of the substrate.
4 . The apparatus of claim 1 , wherein the first piezoelectric layer and/or the second piezoelectric layer comprises:
aluminum and nitrogen;
scandium, aluminum, and nitrogen; or
barium, titanium, and oxygen.
5 . The apparatus of claim 1 , wherein the first piezoelectric layer and/or the second piezoelectric layer comprises:
carbon, hydrogen, and fluorine; or
polyvinylidene fluoride.
6 . The apparatus of claim 1 , wherein the first piezoelectric layer and/or the second piezoelectric layer comprises:
lead, titanium, and oxygen; or
lithium, niobium, and oxygen.
7 . The apparatus of claim 1 , wherein the first piezoelectric layer and/or the second piezoelectric layer comprises:
lead, zirconium, titanium, and oxygen; or
lead, magnesium, niobium, oxygen, and titanium.
8 . The apparatus of claim 1 , wherein the first piezoelectric layer is located between a first metal layer and a second metal layer.
9 . The apparatus of claim 1 , wherein the apparatus is an integrated circuit component.
10 . The apparatus of claim 9 , wherein the integrated circuit component is attached to a printed circuit board and one or more additional integrated circuit components are attached to the printed circuit board.
11 . An apparatus, comprising:
a substrate comprising a semiconductor;
a first piezoelectric layer comprising a first piezoelectric material, the first piezoelectric layer located on a surface of the substrate, a first region of the substrate comprising a first portion of the surface of the substrate, a second region of the substrate comprising a second portion of the surface of the substrate, a third region of the substrate comprising a third portion of the surface of the substrate, both the first region and the second region being n-type or p-type, the third region being n-type if the first region and the second region are p-type, the third region being p-type if the first region and the second region are n-type; and
a second piezoelectric layer comprising a second piezoelectric material, the second piezoelectric layer positioned adjacent to the third region of the surface of the substrate and extending from the first portion of the substrate to the second portion of the substrate.
12 . The apparatus of claim 11 , further comprising a layer comprising oxygen positioned between the second piezoelectric layer and the surface of the substrate.
13 . The apparatus of claim 11 , wherein the first region of the substrate, the second region of the substrate, and the third region of the substrate are located on a fin that extends upwards from the surface of the substrate.
14 . The apparatus of claim 11 , wherein the first piezoelectric layer and/or the second piezoelectric layer comprises:
aluminum and nitrogen;
scandium, aluminum, and nitrogen; or
barium, titanium, and oxygen.
15 . The apparatus of claim 11 , wherein the first piezoelectric layer and/or the second piezoelectric layer comprises:
hafnium and oxygen; or
beryllium and oxygen.
16 . The apparatus of claim 11 , wherein the first piezoelectric layer and/or the second piezoelectric layer comprises:
lead, titanium, and oxygen; or
lithium, niobium, and oxygen.
17 . The apparatus of claim 11 , wherein the first piezoelectric layer and/or the second piezoelectric layer comprises:
lead, zirconium, titanium, and oxygen; or
lead, magnesium, niobium, oxygen, and titanium.
18 . The apparatus of claim 11 , wherein the first piezoelectric layer is located between a first metal layer and a second metal layer.
19 . The apparatus of claim 11 , wherein the apparatus is an integrated circuit component.
20 . The apparatus of claim 19 , wherein the integrated circuit component is attached to a printed circuit board and one or more additional integrated circuit components are attached to the printed circuit board.