Camera module packaging structure and electronic device having the same
A camera module packaging structure with simplified process, and an electronic device carrying it, includes a FPC, an ACF, an embedded printed circuit board, a no-flow underfill, and a chip-scale package camera module. The present application uses a no-flow underfill, which can omit steps of applying the flux and removing the flux, thus the process is simplified. By setting the ACF in the present application, a stable structure having vertical conduction characteristic and horizontal insulation characteristic is formed between the chip-scale packaged camera module and the flexible circuit board.
1 . A camera module packaging structure comprising:
a flexible printed circuit;
an anisotropic conductive film;
an embedded printed circuit board electrically connected to the flexible printed circuit through the anisotropic conductive film;
a no-flow underfill comprising a flux and an underfill; and
a chip-scale package camera module arranged on a side of the embedded printed circuit board away from the flexible printed circuit, wherein the chip-scale package camera module comprises a ball grid array on a surface facing the embedded printed circuit board, the chip-scale package camera module and the embedded printed circuit board are connected to each other through the no-flow underfill and the ball grid array,
wherein the chip-scale package camera module comprises a substrate, a photosensitive chip, an infrared filter, and a packaging portion; the substrate comprises a first surface and a second surface opposite to the first surface, the photosensitive chip is arranged on the first surface, the packaging portion is arranged on the first surface and covers the photosensitive chip, and the infrared filter is arranged on the packaging portion and opposite to the photosensitive chip;
the second surface of the substrate is provided with the ball grid array.
2 . An electronic device comprising:
a camera module packaging structure comprising:
a flexible printed circuit;
an anisotropic conductive film;
an embedded printed circuit board electrically connected to the flexible printed circuit through the anisotropic conductive film;
a no-flow underfill comprising a flux and an underfill; and
a chip-scale package camera module arranged on a side of the embedded printed circuit board away from the flexible printed circuit, wherein the chip-scale package camera module comprises a ball grid array on a surface facing the embedded printed circuit board, the chip-scale package camera module and the embedded printed circuit board are connected to each other through the no-flow underfill and the ball grid array;
wherein the chip-scale package camera module comprises a substrate, a photosensitive chip, an infrared filter, and a packaging portion; the substrate comprises a first surface and a second surface opposite to the first surface, the photosensitive chip is arranged on the first surface, the packaging portion is arranged on the first surface and covers the photosensitive chip, and the infrared filter is arranged on the packaging portion and opposite to the photosensitive chip;
wherein the second surface of the substrate is provided with the ball grid array.