IP Library › Granted Patent US 12713525
Granted Patent B2
US 12713525 · App. 18/358,248 · Granted Aug 18, 2026

Printed wiring board

Inventors: Kentaro Wada (Ogaki, JP); Koji Kondo (Ogaki, JP); Kenji Kunieda (Ogaki, JP); Masashi Umetsu (Ogaki, JP); Yuta Okaga (Ogaki, JP)
Assignee: IBIDEN CO., LTD.
H05K1/0296
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Quick Facts
Patent No.
US 12713525
App. No.
18/358,248
Granted
Aug 18, 2026
Kind
B2
Abstract

A printed wiring board includes an insulating layer, a conductor layer formed on the insulating layer, an adhesive layer formed on the conductor layer such that the adhesive layer is covering an upper surface and a side surface of the conductor layer, and a resin insulating layer formed on the insulating layer such that the resin insulating layer is covering the conductor layer formed on the insulating layer. The conductor layer is formed such that the upper surface of the conductor layer has an unevenness having a root mean square roughness Rq of 0.23 μm or less.

Claims (49)

1 . A printed wiring board, comprising:

an insulating layer;

a conductor layer formed on the insulating layer;

an adhesive layer formed on the conductor layer such that the adhesive layer is covering an upper surface and a side surface of the conductor layer; and

a resin insulating layer formed on the insulating layer such that the resin insulating layer is covering the conductor layer formed on the insulating layer,

wherein the conductor layer is formed such that the upper surface of the conductor layer has an unevenness having a root mean square roughness Rq of 0.23 μm or less, and the adhesive layer is formed such that the adhesive layer has an upper surface having an unevenness and that the unevenness of the upper surface of the adhesive layer has a shape following the unevenness of the upper surface of the conductor layer.

2 . The printed wiring board according to claim 1 , wherein the conductor layer is formed such that the root mean square roughness Rq of the unevenness is 0.1 μm or less.

3 . A printed wiring board according to claim 1 , comprising:

an insulating layer;

a conductor layer formed on the insulating layer;

an adhesive layer formed on the conductor layer such that the adhesive layer is covering an upper surface and a side surface of the conductor layer; and

a resin insulating layer formed on the insulating layer such that the resin insulating layer is covering the conductor layer formed on the insulating layer,

wherein the conductor layer is formed such that the upper surface of the conductor layer has an unevenness having a root mean square roughness Rq of 0.23 μm or less, and the adhesive layer is formed such that the adhesive layer has an upper surface having an unevenness and that the unevenness of the upper surface of the adhesive layer has a size that is smaller than a size of the unevenness of the upper surface of the conductor layer.

4 . The printed wiring board according to claim 2 , wherein the adhesive layer is formed such that the unevenness of the upper surface of the adhesive layer has a size that is larger than a size of the unevenness of the upper surface of the conductor layer.

5 . A printed wiring board, comprising:

an insulating layer;

a conductor layer formed on the insulating layer;

an adhesive layer formed on the conductor layer such that the adhesive layer is covering an upper surface and a side surface of the conductor layer; and

a resin insulating layer formed on the insulating layer such that the resin insulating layer is covering the conductor layer formed on the insulating layer,

wherein the conductor layer is formed such that the upper surface of the conductor layer has an unevenness having a root mean square roughness Rq of 0.23 μm or less, and the adhesive layer has a smooth film portion having a uniform thickness and protruding part protruding from the smooth film portion.

6 . The printed wiring board according to claim 5 , wherein the adhesive film is formed such that the protruding part has a maximum height in a range of 10 to 30 times a thickness of the smooth film portion where a height is measured between an upper surface of the smooth film portion and a top part of the protruding part.

7 . The printed wiring board according to claim 5 , wherein the adhesive film is formed such that the smooth film portion has a thickness in a range of 10 nm to 120 nm and that the protruding part has a height in a range of 200 nm to 450 nm between an upper surface of the smooth film portion and a top part of the protruding part.

8 . The printed wiring board according to claim 5 , wherein the adhesive film is formed such that a ratio of an area of the smooth film portion exposed from the protruding part to an area of the adhesive layer is in a range of 0.1 to 0.5.

9 . A printed wiring board, comprising:

an insulating layer;

a conductor layer formed on the insulating layer;

an adhesive layer formed on the conductor layer such that the adhesive layer is covering an upper surface and a side surface of the conductor layer; and

a resin insulating layer formed on the insulating layer such that the resin insulating layer is covering the conductor layer formed on the insulating layer,

wherein the conductor layer is formed such that the upper surface of the conductor layer has an unevenness having a root mean square roughness Rq of 0.23 μm or less, and the adhesive film is formed such that the adhesive layer is not covering part of the insulating layer exposed from the conductor layer.

10 . The printed wiring board according to claim 5 , wherein the adhesive film is formed such that the smooth film portion on the upper surface of the conductor layer is formed substantially along a shape of the upper surface of the conductor layer.

11 . A printed wiring board, comprising:

an insulating layer;

a conductor layer formed on the insulating layer;

an adhesive layer formed on the conductor layer such that the adhesive layer is covering an upper surface and a side surface of the conductor layer; and

a resin insulating layer formed on the insulating layer such that the resin insulating layer is covering the conductor layer formed on the insulating layer,

wherein the conductor layer is formed such that the upper surface of the conductor layer has an unevenness having a root mean square roughness Rq of 0.23 μm or less, and the adhesive layer comprises an organic material.

12 . The printed wiring board according to claim 5 , wherein the adhesive film is formed such that the protruding part has a plurality of protrusions and that the plurality of protrusions is forming unevenness on an upper surface of the protruding part.

13 . The printed wiring board according to claim 5 , wherein the adhesive film is formed such that the protruding part has a plurality of protrusions and that a number of the protrusions per 1 mm 2 is in a range of 5 to 15.

14 . The printed wiring board according to claim 2 , wherein the adhesive layer has a smooth film portion having a uniform thickness and protruding part protruding from the smooth film portion.

15 . The printed wiring board according to claim 14 , wherein the adhesive film is formed such that the protruding part has a maximum height in a range of 10 to 30 times a thickness of the smooth film portion where a height is measured between an upper surface of the smooth film portion and a top part of the protruding part.

16 . The printed wiring board according to claim 14 , wherein the adhesive film is formed such that the smooth film portion has a thickness in a range of 10 nm to 120 nm and that the protruding part has a height in a range of 200 nm to 450 nm between an upper surface of the smooth film portion and a top part of the protruding part.

17 . The printed wiring board according to claim 14 , wherein the adhesive film is formed such that a ratio of an area of the smooth film portion exposed from the protruding part to an area of the adhesive layer is in a range of 0.1 to 0.5.

18 . The printed wiring board according to claim 2 , wherein the adhesive layer comprises an organic material.

19 . The printed wiring board according to claim 14 , wherein the adhesive film is formed such that the protruding part has a plurality of protrusions and that a number of the protrusions per 1 mm 2 is in a range of 5 to 15.

20 . The printed wiring board according to claim 9 , wherein the conductor layer is formed such that the root mean square roughness Rq of the first unevenness is 0.1 μm or less.

21 . The printed wiring board according to claim 9 , wherein the adhesive layer is formed such that the adhesive layer has an upper surface having an unevenness and that the unevenness of the upper surface of the adhesive layer has a shape following the unevenness of the upper surface of the conductor layer.

22 . The printed wiring board according to claim 9 , wherein the adhesive layer is formed such that the adhesive layer has an upper surface having an unevenness and that the unevenness of the upper surface of the adhesive layer has a size that is smaller than a size of the unevenness of the upper surface of the conductor layer.

23 . The printed wiring board according to claim 9 , wherein the adhesive layer has a smooth film portion having a uniform thickness and protruding part protruding from the smooth film portion.

24 . The printed wiring board according to claim 9 , wherein the adhesive layer comprises an organic material.