Field device and method for compact arrangement of electronic assemblies of an electronic circuit
A field device for process automation in industrial or private environments, comprising an electronic circuit for controlling the field device, wherein the electronic circuit includes a first, a second and a third circuit board. The first circuit board is connected to and attached to the second circuit board and/or to the third circuit board by way of an electrical connector, wherein the second circuit board is located above the third circuit board.
1 . A field device for process automation in industrial or private environments, comprising:
an electronic circuit configured to control the field device,
wherein the electronic circuit includes a first circuit board, a second circuit board, and a third circuit board,
wherein the first circuit board and the second circuit board are arranged without gaps and perpendicular to each other,
wherein the first circuit board is connected to and attached to the third circuit board by way of an electrical connector, and
wherein the first circuit board is located above the second circuit board, and the second circuit board is located above the third circuit board.
2 . The field device according to claim 1 ,
wherein the second circuit board and the third circuit board are arranged parallel to each other.
3 . The field device according to claim 1 ,
wherein the first circuit board is attached to the second circuit board and/or the third circuit board solely by way of the electrical connector.
4 . The field device according to claim 1 ,
wherein the first circuit board includes a radio module.
5 . The field device according to claim 1 ,
wherein the second circuit board includes a power supply, and/or
wherein the third circuit board includes a main processor.
6 . The field device according to claim 1 , further comprising:
at least a fourth circuit board arranged below and parallel to the third circuit board.
7 . The field device according to claim 6 ,
wherein the fourth circuit board includes sensor technology of the field device.
8 . The field device according to claim 1 ,
wherein the second circuit board and the third circuit board are electrically connected to each other via a cable connection.
9 . The field device according to claim 2 ,
wherein the first circuit board and the second circuit board and/or the first circuit board and the third circuit board are electrically connected to each other exclusively via the electrical connector.
10 . The field device according to claim 1 ,
wherein the field device is a level meter, a point level sensor, a flow meter, or a pressure meter.
11 . The field device according to claim 1 ,
wherein the field device is a stand-alone wireless field device.
12 . The field device according to claim 2 ,
wherein the first circuit board is attached to the third circuit board solely by way of the electrical connector.
13 . A method of compactly arranging electronic assemblies of an electronic circuit of a field device having at least a first circuit board, a second circuit board, and a third circuit board, comprising:
electrically connecting the second circuit board to the third circuit board by way of a cable connection;
arranging the second circuit board parallel to the third circuit board;
arranging the first circuit board above the second circuit board, and the second circuit board above the third circuit board; and
electrically connecting the first circuit board to the third circuit board by way of an electrical connector,
wherein the first circuit board and the second circuit board are arranged without gaps and perpendicular to each other.