Circuit board and manufacturing method
A circuit board having a circuit pattern on a base plate and an additional metal layer laid and bonded on the circuit pattern, wherein the additional metal layer comprises an attachment plane portion configured to fix a semiconductor chip using solder, and an engagement uneven portion provided adjacent to the attachment plane portion, wherein the attachment plane portion is a face having unevenness smaller than the engagement uneven portion.
1 . A circuit board comprising:
a base plate, a circuit pattern and an additional metal layer layered in this order, the additional metal layer layered and bonded on a partial area of the circuit pattern, wherein
the additional metal layer comprises:
an attachment plane portion provided on a surface of the additional metal layer and configured to fix an electronic component using solder; and
an engagement uneven portion provided adjacent to the attachment plane portion on the surface of the additional metal layer to be engaged with a tool uneven portion of a tool for vibration transmission to bond the additional metal layer on the circuit pattern with ultrasonic vibration, wherein
the attachment plane portion is a face having unevenness smaller than the engagement uneven portion.
2 . The circuit board according to claim 1 , wherein
the attachment plane portion is a flat surface.
3 . The circuit board according to claim 1 , wherein
the attachment plane portion is an uneven face having unevenness smaller than the engagement uneven portion.
4 . The circuit board according to claim 1 , wherein
the engagement uneven portion is provided on a whole or part of a circumference surrounding the attachment plane portion.
5 . The circuit board according to claim 1 , wherein
the engagement uneven portion is provided intermittently or successively with engagement recessed portions and engagement projected portions.
6 . The circuit board according to claim 5 , wherein
in the engagement recessed portions and the engagement projected portions intermittently provided, engagement recessed portions and engagement projected portions adjacent to each other are aligned or positionally displaced.
7 . The circuit board according to claim 1 , wherein
the engagement uneven portion is provided with engagement projected portions projecting from the attachment plane portion.
8 . The circuit board according to claim 7 , wherein
the engagement projected portions are bulged from the attachment plane portion by plastically deforming the additional metal layer.
9 . The circuit board according to claim 7 , wherein
the engagement projected portion has a recess or a flat face on a top.
10 . The circuit board according to claim 1 , wherein
the engagement uneven portion is indentation of the tool uneven portion.
11 . The circuit board according to claim 1 , wherein
the engagement uneven portion has tilted side faces.
12 . A manufacturing method for the circuit board according to claim 1 , comprising:
layering the additional metal layer on a partial area of the circuit pattern; and
pressing a tool onto a surface of the additional metal layer to apply ultrasonic vibration, the tool having a retracted portion and a tool uneven portion corresponding to the attachment plane portion and the engagement uneven portion, thereby bonding the additional metal layer on the circuit pattern due to transmission of the ultrasonic vibration while leaving the attachment plane portion on the surface of the additional metal layer in an area according to the retracted portion and forming the engagement uneven portion on the surface of the additional metal layer according to the tool uneven portion.
13 . The manufacturing method of the circuit board according to claim 12 , wherein
interposing a friction reducing material between the retracted portion and the surface of the additional metal layer at the time of the ultrasonic vibration, to press the retracted portion onto the surface of the additional metal layer through the friction reducing material.
14 . The manufacturing method of the circuit board according to claim 12 , wherein
the retracted portion has a reduction uneven portion to reduce friction against the surface of the additional metal layer, and
the reduction uneven portion is pressed onto the surface of the additional metal layer.
15 . The manufacturing method of the circuit board according to claim 12 , wherein
pressing load of the tool pressed onto the surface of the additional metal layer is in a degree to bulge the engagement projected portions of the engagement uneven portion from the attachment plane portion by plastically deforming the additional metal layer.
16 . The manufacturing method according to claim 15 , wherein
the pressing load of the tool is in a degree to form the recess or a flat face on the top of the engagement projected portion of the engagement uneven portion.
17 . A circuit board comprising:
a base plate, a circuit pattern and an additional metal layer layered in this order, the additional metal layer layered and bonded on a partial area of the circuit pattern, wherein
the additional metal layer comprises:
an attachment plane portion provided on a surface of the additional metal layer; and
an engagement uneven portion provided adjacent to the attachment plane portion on the surface of the additional metal layer to be engaged with a tool uneven portion of a tool for vibration transmission to bond the additional metal layer on the circuit pattern with ultrasonic vibration, wherein
the attachment plane portion is a face having unevenness smaller than the engagement uneven portion.