Liquid cooled cold plate for multiple semiconductor chip packages
An apparatus is described. The apparatus includes a cold plate. The cold plate includes an input port to receive cooled fluid. The cold plate includes an ingress manifold to feed the cooled fluid to different regions, where, each of the different regions are to be located above its own respective semiconductor chip package. The cold plate includes an egress manifold to collect warmed fluid from the different regions. The cold plate includes an output port to emit the warmed fluid from the cold plate.
1 . An apparatus, comprising:
a cold plate, the cold plate comprising:
a) an input port to receive fluid;
b) an ingress manifold to feed the fluid to different regions, each of the different regions to be located above its own respective semiconductor chip package;
c) an egress manifold to collect the fluid from the different regions;
d) an output port to emit the fluid from the cold plate; and
e) a release mechanism comprising a lever arm and a cam, the cam to lift an end of the cold plate opposite an axis, in response to rotation of the lever arm, to cause the cold plate to rotate about the axis and peel from a semiconductor chip package that is farthest from the axis.
2 . The apparatus of claim 1 wherein at least one of the different regions comprises finned channels.
3 . The apparatus of claim 1 wherein at least one of the different regions comprises an arrangement of posts.
4 . The apparatus of claim 1 wherein the cold plate further comprises a cooled fluid output port and a warmed fluid input port, the cooled fluid output port and the warmed fluid input port to be coupled to a satellite cold plate that is cooled by additional cooled fluid that is received by the input port.
5 . The apparatus of claim 1 wherein the cold plate has slotted openings to allow the cold plate to mount to different arrangements of mounting hardware.
6 . The apparatus of claim 1 wherein the input port and output port are flanged along an axis that the cold plate is to rotate about.
7 . An apparatus, comprising:
a) a cold plate, the cold plate comprising i), ii), iii), iv) and v) below:
i) an input port to receive fluid, the input port flanged along an axis that the cold plate is to rotate about;
ii) an ingress manifold to feed the fluid to different regions, each of the different regions to be located above its own respective semiconductor chip package;
iii) an egress manifold to collect the fluid from the different regions; and
iv) an output port to emit the fluid from the cold plate, the output port flanged along the axis; and
b) a release mechanism comprising a lever arm and a cam, the cam to lift an end of the cold plate opposite the axis, in response to rotation of the lever arm, to cause the cold plate to rotate about the axis and peel from a semiconductor chip package that is farthest from the axis.
8 . The apparatus of claim 7 wherein at least one of the different regions comprises finned channels.
9 . The apparatus of claim 7 wherein at least one of the different regions comprises an arrangement of posts.
10 . The apparatus of claim 7 wherein the cold plate further comprises a cooled fluid output port and a warmed fluid input port, the cooled fluid output port and the warmed fluid input port to be coupled to a satellite cold plate that is cooled by additional cooled fluid that is received by the input port.
11 . The apparatus of claim 7 wherein the cold plate has slotted openings to allow the cold plate to mount to different arrangements of mounting hardware.
12 . An apparatus, comprising:
a) a cold plate, the cold plate comprising i), ii), iii), iv) and v) below:
i) an input port to receive fluid, the input port flanged along an axis that the cold plate is to rotate about;
ii) an ingress manifold to feed the fluid to different regions, each of the different regions to be located above its own respective semiconductor chip package;
iii) an egress manifold to collect the fluid from the different regions; and
iv) an output port to emit the fluid from the cold plate, the output port flanged along the axis; and
b) a combination screw, the combination screw comprising an inner screw and an outer screw, one of the inner and outer screws to secure the cold plate to mounting hardware, an other of the inner and outer screws to peel the cold plate from at least one of the semiconductor chip packages.
13 . The apparatus of claim 12 wherein at least one of the different regions comprises finned channels.
14 . The apparatus of claim 12 wherein at least one of the different regions comprises an arrangement of posts.
15 . The apparatus of claim 12 wherein the cold plate further comprises a cooled fluid output port and a warmed fluid input port, the cooled fluid output port and the warmed fluid input port to be coupled to a satellite cold plate that is cooled by additional cooled fluid that is received by the input port.
16 . The apparatus of claim 12 wherein the cold plate has slotted openings to allow the cold plate to mount to different arrangements of mounting hardware.