Electronic device comprising heat dissipation structure
The present disclosure relates to an electronic device comprising a heat dissipation structure. The electronic device may comprise: a bracket comprising a first area, a second area partitioned from the first area, and a heat dissipation area extendedly formed from a portion of the first area up to a portion of the second area; a circuit board comprising a heating source and disposed in the first area; a battery disposed in the second area; a vapor chamber disposed in the heat dissipation area and, in order to provide a transfer path for heat generated from the heating source, comprises a first part disposed so as to face the heating source, and a second part disposed so as to face the battery; and a filling member coated between the second area and the battery in order to transfer the heat dissipated from the vapor chamber to the battery, wherein the vapor chamber has a buffer area formed at an edge area thereof in order to receive the filling member.
1 . An electronic device comprising:
a display;
a bracket including a first area, a second area partitioned from the first area, and a receiving area formed from a portion of the first area to a portion of the second area, at least a portion of the receiving area being in form of an opening;
a circuit board including a heat source and disposed in the first area;
a battery disposed in the second area;
a vapor chamber disposed in the receiving area and configured to provide a transfer path of heat generated from the heat source to the battery, wherein the vapor chamber comprises:
a first surface including a first portion disposed to face the heat source and a second portion disposed to face the battery, and
a second surface opposite to the first surface, disposed to face the display; and
a filling member applied between the second portion of the vapor chamber and the battery.
2 . The electronic device of claim 1 , further comprising:
an adhesive member disposed between the second area and the battery,
wherein the adhesive member is disposed to surround at least a portion of the receiving area.
3 . The electronic device of claim 2 , wherein the adhesive member and the receiving area are disposed to be spaced apart from each other by a predetermined width.
4 . The electronic device of claim 3 , wherein the filling member is disposed to be spaced apart from the adhesive member.
5 . The electronic device of claim 1 ,
wherein the vapor chamber includes a buffer area formed in an edge area to accommodate the filling member, and
wherein the filling member has a side in contact with the battery and another side in contact with the second portion of the vapor chamber.
6 . The electronic device of claim 1 , wherein at least a portion of the bracket is disposed between the heat source and the first portion.
7 . The electronic device of claim 1 , wherein the bracket includes a barrier rib for partitioning the first area and the second area.
8 . The electronic device of claim 7 ,
wherein the battery is disposed to be spaced apart from the barrier rib, and
wherein the filling member is disposed between the barrier rib and the battery.
9 . The electronic device of claim 1 , further comprising an auxiliary filling member disposed between the heat source and the first area.
10 . The electronic device of claim 1 , wherein the filling member is formed in a liquid or semi-solid state.
11 . The electronic device of claim 2 , wherein a thermal conductivity of the filling member is larger than a thermal conductivity of the adhesive member.
12 . The electronic device of claim 1 , wherein the receiving area corresponding to the first area is formed of a concave portion, and the receiving area corresponding to the second area is formed of the opening.
13 . A method for manufacturing an electronic device including a heat dissipation structure, the method comprising:
preparing a bracket including a first area, a second area partitioned from the first area, and a receiving area formed from a portion of the first area to a portion of the second area, wherein a circuit board including a heat source is disposed in the first area, and wherein a vapor chamber is disposed in the receiving area and includes a first portion disposed to face the heat source and a second portion disposed adjacent to the first portion to provide a transfer path of heat generated from the heat source;
applying a filling member to the second portion; and
disposing a battery on the filling member,
wherein the vapor chamber includes a buffer area formed in an edge area to accommodate the filling member pressed by the battery.
14 . The method of claim 13 , further comprising:
disposing an adhesive member to surround the receiving area.
15 . The method of claim 14 , wherein the disposing of the adhesive member includes disposing the adhesive member to be spaced apart from the receiving area by a predetermined distance.