Two phase shower immersion cooling system for data center: soaking pockets

1 . A cooling system, comprising:

a coolant chamber;

wherein a circuit board is disposed within the coolant chamber;

wherein a heat generating component is disposed on a first side of the circuit board;

wherein a pocket structure is formed on the first side of the circuit board;

wherein a soaking pocket is formed between the pocket structure and the circuit board;

wherein an opening is formed on the pocket structure;

wherein a space between the pocket structure and the circuit board contains a liquid coolant, and the liquid coolant flows out of the soaking pocket through the opening;

wherein a heating surface associated with the heat generating component is soaked in the liquid coolant within the soaking pocket.

2 . The cooling system of claim 1 ,

wherein within the soaking pocket, a first liquid coolant flow is formed from a top to a bottom of the soaking pocket, and a second liquid coolant flow is formed from the bottom to the top of the soaking pocket.

3 . The cooling system of claim 2 ,

wherein the second liquid coolant flow flows through the heating surface.

4 . The cooling system of claim 1 , wherein the pocket structure comprises:

a wall;

wherein the soaking pocket is formed between the wall and the circuit board.

5 . The cooling system of claim 4 , comprising

a partition, disposed between the wall and the circuit board;

wherein a first coolant channel is formed between the wall and the partition;

wherein a second coolant channel is formed between the partition and the circuit board.

6 . The cooling system of claim 5 ,

wherein a first liquid coolant flow flows downward through the first coolant channel, and a second liquid coolant flow flows upward through the second coolant channel.

7 . The cooling system of claim 4 , comprising

a rotating element, disposed between the wall and the circuit board.

8 . The cooling system of claim 7 ,

wherein a first liquid coolant flow is formed between the rotating element and the wall;

wherein a second liquid coolant flow is formed between the rotating element and the circuit board.

9 . The cooling system of claim 1 , wherein the pocket structure comprises:

a casing comprising a wall and a bottom portion;

wherein the casing and the circuit board form a pocket;

wherein the pocket filled with the liquid coolant forms the soaking pocket;

wherein the heat generating component is soaked in the liquid coolant within the soaking pocket.

10 . The cooling system of claim 9 ,

wherein a hole is formed within the bottom portion;

wherein the liquid coolant within the soaking pocket flows toward a bottom of the coolant chamber via the hole formed within the bottom portion during the operation of the cooling system.

11 . The cooling system of claim 1 ,

wherein a liquid coolant flow is formed from top to bottom within the coolant chamber.

12 . The cooling system of claim 1 , comprising:

a heatsink disposed on the heat generating component on the circuit board;

wherein the heatsink comprises a tilting fin;

wherein the tilting fin tilts upward and the soaking pocket is formed because of the tilting fin;

wherein the pocket structure comprises the tilting fin.

13 . The cooling system of claim 1 , wherein the pocket structure comprises:

a plurality of tilting fins;

wherein the plurality of tilting fins tilt upward in the coolant chamber;

wherein a plurality of soaking pockets is formed between the plurality of tilting fins and the circuit board.

14 . The cooling system of claim 13 ,

wherein a plurality of holes are formed on the plurality of tilting fins;

wherein the liquid coolant flows downward through the plurality of holes formed within the plurality of tilting fins due to gravity.

15 . The cooling system of claim 14 ,

wherein a first size of a first hole formed on a first tilting fin is larger than a second size of a second hole formed on a second tilting fin;

wherein the first tilting fin is disposed higher than the second tilting fin.

16 . The cooling system of claim 14 ,

wherein the plurality of holes are formed on the plurality of tilting fins in an interleaving fashion.

17 . The cooling system of claim 13 ,

wherein gaps are distributed between the plurality of tilting fins;

wherein the liquid coolant flows downward through the gaps formed within the plurality of tilting fins due to gravity.

18 . The cooling system of claim 1 , comprising:

a vibrator, disposed in the soaking pocket, configured to generate a liquid coolant disturbance.

19 . The cooling system of claim 1 ,

wherein a plurality of soaking pockets is formed on the first side of the circuit board;

wherein the liquid coolant is injected into the coolant chamber from a top of the coolant chamber to fill the plurality of soaking pockets.

20 . The cooling system of claim 1 ,

wherein the circuit board is vertically disposed within the coolant chamber.

21 . The cooling system of claim 1 ,

wherein the coolant chamber is disposed within a chassis in a server rack.