IP Library Granted Patent US 12713571
Granted Patent B2
US 12713571 · App. 18/653,663 · Granted Aug 18, 2026

Two part external shield for electromagnetic interference reduction

Inventors: Jack Totten (Dunbar, GB); William Halliday (Edinburgh, GB)
Assignee: STMICROELECTRONICS INTERNATIONAL N.V.
H05K9/0049G01S7/4813H05K9/0032H05K9/0064
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Quick Facts
Patent No.
US 12713571
App. No.
18/653,663
Granted
Aug 18, 2026
Kind
B2
Abstract

A two-part external metal shield for electromagnetic interference reduction that reduces vulnerability of a shielded sensor is provided. An example electromagnetic shield for a sensor includes: a first portion defining a first part of an interfacing profile and one or more tabs; a second portion defining a second part of an interfacing profile; where the first portion and the second portion combine to form a cavity into which the sensor is received, where the one or more tabs extends into the cavity along a first axis, and where the first part of the interfacing profile is secured to the second part of the interfacing profile along a second axis perpendicular to the first axis.

Claims (36)

1 . An electronic device comprising:

a sensor substrate;

a sensor;

an electromagnetic shield defining a cavity within which the sensor is received;

a sensor cap attached to the sensor substrate;

wherein the electromagnetic shield comprises a first portion and a second portion, wherein the first portion comprises one or more tabs extending into the cavity, wherein the first portion comprises a first part of an interfacing profile, the second portion comprises a second part of the interfacing profile, and wherein the first portion is secured to the second portion in response to the first part of the interfacing profile engaging with the second part of the interfacing profile, and

at least one connecting tab defined on the sensor substrate, wherein at least one recess defined within the sensor cap provides access to the at least one connecting tab, and wherein the one or more tabs of the electromagnetic shield engages the at least one connecting tab within the at least one recess.

2 . The electronic device of claim 1 , wherein the sensor cap is attached to the sensor substrate using an adhesive, wherein the sensor substrate comprises at least one dam at least partially surrounding the at least one connecting tab, between the adhesive and the at least one connecting tab.

3 . The electronic device of claim 1 , wherein the first portion is installed onto the sensor along a first axis, substantially parallel to a plane defined by the sensor substrate.

4 . The electronic device of claim 3 , wherein the second portion is installed onto the sensor along a second axis, orthogonal to the plane defined by the sensor substrate.

5 . The electronic device of claim 4 , wherein the second portion of the electromagnetic shield comprises a securing tab extending into the cavity defined by the electromagnetic shield, wherein the securing tab is received into a recess in a top surface of the sensor cap.

6 . The electronic device of claim 5 , wherein the securing tab is secured within the cavity in the recess in the top surface of the sensor cap with a conductive adhesive.

7 . The electronic device of claim 1 , wherein the first portion and the second portion are formed of electrically conductive material, and wherein the second portion is in electrical communication with the at least one connecting tab through the first portion.

8 . The electronic device of claim 1 , wherein a clearance between the electromagnetic shield and the sensor is around one hundred microns or less.

9 . A electromagnetic shield for a sensor comprising:

a first portion defining a first part of an interfacing profile and one or more tabs; and

a second portion defining a second part of the interfacing profile;

wherein the first portion and the second portion combine to form a cavity into which the sensor is received, wherein the one or more tabs extends into the cavity along a first axis, and wherein the first part of the interfacing profile is secured to the second part of the interfacing profile along a second axis perpendicular to the first axis,

wherein the first portion defines a first aperture for a receiving element of a time-of-flight sensor, and wherein the second portion defines a second aperture for a transmitting element of the time-of-flight sensor.

10 . The electromagnetic shield of claim 9 , wherein the second portion further defines a securing portion extending into the cavity along the second axis.

11 . The electromagnetic shield of claim 10 , wherein the first portion and the second portion are formed of conductive material, and wherein the first portion is in electrical communication with the second portion through the interfacing profile.

12 . The electromagnetic shield of claim 11 , wherein the first portion and the second portion are formed of metal.

13 . An electronic device comprising:

a sensor substrate;

a sensor disposed on a first side of the sensor substrate; and

an electromagnetic shield covering over at least a portion of the first side of the sensor substrate, the electromagnetic shield defining a cavity within which the sensor is received;

wherein the electromagnetic shield comprises a first portion and a second portion, wherein the second portion comprises a securing tab extending into the cavity, wherein the securing tab extends into the cavity toward the first side of the sensor substrate, orthogonal to a plane of the sensor substrate, wherein the first portion comprises a first part of an interfacing profile, the second portion comprises a second part of the interfacing profile, and wherein the first portion is secured to the second portion in response to the first part of the interfacing profile engaging with the second part of the interfacing profile.

14 . The electronic device of claim 13 , wherein the sensor comprises:

a sensor cap attached to the sensor substrate; and

at least one connecting tab defined on the sensor substrate, wherein at least one recess defined within the sensor cap provides access to the at least one connecting tab, and wherein one or more tabs of the electromagnetic shield engages the at least one connecting tab within the at least one recess.

15 . The electronic device of claim 14 , wherein the sensor cap is attached to the sensor substrate using an adhesive, wherein the sensor substrate comprises at least one dam at least partially surrounding the at least one connecting tab, between the adhesive and the at least one connecting tab.

16 . The electronic device of claim 14 , wherein the first portion is installed onto the sensor along a first axis, substantially parallel to a plane defined by the sensor substrate.

17 . The electronic device of claim 16 , wherein the second portion is installed onto the sensor along a second axis, orthogonal to the plane defined by the sensor substrate.

18 . The electronic device of claim 17 , wherein the securing tab is received into a recess in a top surface of the sensor cap.

19 . The electronic device of claim 18 , wherein the securing tab is secured within the cavity in the recess in the top surface of the sensor cap with a conductive adhesive.

20 . The electronic device of claim 14 , wherein the first portion and the second portion are formed of electrically conductive material, and wherein the second portion is in electrical communication with the at least one connecting tab through the first portion.