Three-dimensional ferroelectric memory device
A ferroelectric memory device includes a substrate, a gate structure disposed over the substrate. The gate structure includes a plurality of gate electrode layers spaced apart from each other along a first direction substantially perpendicular to a surface of the substrate. The ferroelectric memory device includes a first electrode pillar and a second electrode pillar that extend along the first direction and are disposed to be spaced apart from each other in a second direction substantially parallel to the surface of the substrate inside a hole penetrating the gate structure, and a device isolation structure disposed to cross the first and second electrode pillars and to separate the gate structure over the substrate. The gate structure further includes a plurality of ferroelectric layers and a plurality of channel layers which are disposed to correspond to the plurality of gate electrode layers.
1 . A ferroelectric memory device comprising:
a substrate;
a gate structure disposed over the substrate and including a plurality of gate electrode layers spaced apart from each other along a first direction substantially perpendicular to a surface of the substrate;
a first electrode pillar and a second electrode pillar that extend along the first direction and are disposed to be spaced apart from each other in a second direction substantially parallel to the surface of the substrate inside a hole penetrating the gate structure; and
a device isolation structure disposed over the substrate,
wherein the gate structure further includes a plurality of ferroelectric layers and a plurality of channel layers that are disposed to correspond to the plurality of gate electrode layers, and
wherein the device isolation structure extending across the hole and dividing the gate structure into a first gate part and a second gate part that are electrically insulated from each other.
2 . The ferroelectric memory device of claim 1 , wherein each of the first and second electrode pillars is electrically connected to the plurality of channel layers.
3 . The ferroelectric memory device of claim 1 , wherein a portion of an outer circumferential surface of the first electrode pillar and a portion of an outer circumferential surface of the second electrode pillar are disposed to contact each of the plurality of channel layers.
4 . The ferroelectric memory device of claim 1 , wherein among the plurality of gate electrode layers, the plurality of ferroelectric layers, and the plurality of channel layers, one gate electrode layer, one ferroelectric layer, and one channel layer corresponding to each other are sequentially disposed on a plane parallel to the surface of the substrate.
5 . The ferroelectric memory device of claim 1 ,
wherein the plurality of channel layers are disposed along a circumference of the hole,
wherein each of the plurality of ferroelectric layers is disposed to surround each of the plurality of channel layers, and
wherein each of the plurality of gate electrode layers is disposed to surround each of the plurality of ferroelectric layers.
6 . The ferroelectric memory device of claim 5 , further comprising a plurality of interfacial dielectric layers, each of the plurality of interfacial dielectric layers being disposed respectively between each of the plurality of ferroelectric layers and each of the plurality of channel layers.
7 . The ferroelectric memory device of claim 6 , further comprising a plurality of floating electrode layers, each of the plurality of floating electrode layers being disposed respectively between each of the plurality of ferroelectric layers and each of the plurality of interfacial dielectric layers.
8 . The ferroelectric memory device of claim 1 , wherein the gate structure further includes interlayer insulation layers disposed between the plurality of gate electrode layers, the plurality of ferroelectric layers, and the plurality of channel layers along the first direction.
9 . The ferroelectric memory device of claim 1 ,
wherein the gate structure includes the first gate part and the second gate part that are separated by the device isolation structure, and
wherein the plurality of gate electrode layers of the first gate part are electrically insulated from the plurality of gate electrode layers of the second gate part.
10 . The ferroelectric memory device of claim 9 , wherein the plurality of channel layers of the first gate part and the plurality of channel layers of the second gate part electrically share the first and second electrode pillars.
11 . The ferroelectric memory device of claim 1 , wherein the device isolation structure is disposed to extend in the second direction substantially parallel to the surface of the substrate.
12 . The ferroelectric memory device of claim 1 , further comprising a hole filling material layer that fills the hole over the substrate.
13 . A ferroelectric memory device comprising:
a substrate;
a gate structure disposed over the substrate and including a plurality of gate electrode layers spaced apart from each other along a first direction substantially perpendicular to a surface of the substrate;
a plurality of holes penetrating the gate structure over the substrate, the plurality of holes arranged along a second direction substantially parallel to the surface of the substrate;
first and second electrode pillars disposed to extend along the first direction inside the plurality of holes; and
a device isolation structure disposed over the substrate, the device isolation structure extending across the plurality of holes and dividing the gate structure into a first gate part and a second gate part that are electrically insulated from each other,
wherein the gate structure further includes a plurality of ferroelectric layers and a plurality of channel layers, which are disposed to correspond to the plurality of gate electrode layers, and
wherein the first and second electrode pillars are disposed to be electrically connected to the plurality of channel layers.
14 . The ferroelectric memory device of claim 13 , wherein a portion of an outer circumferential surface of the first electrode pillar and a portion of an outer circumferential surface of the second electrode pillar are disposed to contact each of the plurality of channel layers.
15 . The ferroelectric memory device of claim 13 , wherein among the plurality of gate electrode layers, the plurality of ferroelectric layers, and the plurality of channel layers, one gate electrode layer, one ferroelectric layer, and one channel layer corresponding to each other are sequentially disposed on a plane parallel to the surface of the substrate.
16 . The ferroelectric memory device of claim 13 ,
wherein each of the plurality of channel layers is disposed along a circumference of each of the plurality of holes,
wherein each of the plurality of ferroelectric layers is disposed to surround each of the plurality of channel layers, and
wherein each of the plurality of gate electrode layers is disposed to surround each of the plurality of ferroelectric layers.
17 . The ferroelectric memory device of claim 13 ,
wherein the gate structure includes the first gate part and the second gate part that are separated by the device isolation structure, and
wherein the plurality of gate electrode layers of the first gate part are electrically insulated from the plurality of gate electrode layers of the second gate part.
18 . The ferroelectric memory device of claim 17 , wherein the first and second gate parts electrically share the first and second electrode pillars.
19 . The ferroelectric memory device of claim 13 , wherein the device isolation structure is disposed inside the plurality of holes to cross the first and second electrode pillars.
20 . The ferroelectric memory device of claim 13 , further comprising a gate isolation structure disposed between the plurality of holes and extending in the second direction.