Semiconductor device
A semiconductor device includes an etch stop layer, an insulating layer on the etch stop layer, and a contact structure passing through the etch stop layer and the insulating layer, the contact structure including a first conductive layer, a second conductive layer having a side surface and a lower surface facing the first conductive layer, a third conductive layer on an upper surface of the second conductive layer, and a natural oxide film between the first conductive layer and the second conductive layer and between the second conductive layer and the third conductive layer, the first to third conductive layers including metal or metal nitride, and the natural oxide film including metal oxide.
1 . A semiconductor device comprising:
an etch stop layer;
an insulating layer on the etch stop layer; and
a contact structure passing through the etch stop layer and the insulating layer,
the contact structure including
a first conductive layer,
a second conductive layer having a side surface and a lower surface facing the first conductive layer,
a third conductive layer on an upper surface of the second conductive layer, and
a natural oxide film between the first conductive layer and the second conductive layer and between the second conductive layer and the third conductive layer,
the first to third conductive layers including metal or metal nitride, and
the natural oxide film including metal oxide.
2 . The semiconductor device of claim 1 , wherein the second conductive layer includes a same material as that of the first conductive layer.
3 . The semiconductor device of claim 2 , wherein the third conductive layer includes the same material as that of the first conductive layer.
4 . The semiconductor device of claim 2 , wherein the third conductive layer includes a material different from that of the first conductive layer.
5 . The semiconductor device of claim 1 , wherein
the first to third conductive layers include titanium nitride, and
the natural oxide film includes titanium oxide.
6 . The semiconductor device of claim 1 , wherein the second conductive layer overlaps the etch stop layer in a horizontal direction.
7 . The semiconductor device of claim 1 , wherein the second conductive layer overlaps the etch stop layer and the insulating layer in a horizontal direction.
8 . The semiconductor device of claim 1 , wherein the second conductive layer overlaps the insulating layer in a horizontal direction.
9 . The semiconductor device of claim 1 , wherein the natural oxide film further includes a portion between the first conductive layer and the third conductive layer.
10 . The semiconductor device of claim 1 , wherein an upper surface of the third conductive layer is on a same level as that of an upper surface of the first conductive layer.
11 . The semiconductor device of claim 1 , further comprising;
a wiring below the etch stop layer,
wherein the first conductive layer extends below an upper portion of the wiring.
12 . The semiconductor device of claim 1 , wherein a height of the second conductive layer is greater than or equal to 25% to less than or equal to 200% of a width of the first conductive layer.
13 . The semiconductor device of claim 1 , wherein a width of the natural oxide film is greater than or equal to 5 Å to less than or equal to 200 Å.
14 . The semiconductor device of claim 1 , wherein upper and lower surfaces of the natural oxide film are curved to be convex downward.
15 . A semiconductor device comprising:
a substrate;
a lower structure on the substrate;
an etch stop layer on the lower structure;
an insulating layer on the etch stop layer;
a contact structure passing through the etch stop layer and the insulating layer; and
an information storage structure including a lower electrode, a magnetic tunnel junction pattern, and an upper electrode sequentially stacked on the contact structure, and
the contact structure including a first conductive layer, a second conductive layer in an opening passing through the first conductive layer, a third conductive layer on the second conductive layer in the opening, and a natural oxide film surrounding the second conductive layer.
16 . The semiconductor device of claim 15 , wherein
the first to third conductive layers include metal or metal nitride, and
the natural oxide film includes metal oxide.
17 . The semiconductor device of claim 15 , wherein the second conductive layer and the natural oxide layer overlap the magnetic tunnel junction pattern in a vertical direction.
18 . The semiconductor device of claim 15 , wherein a distance between a lower surface of the magnetic tunnel junction pattern and a lower surface of the second conductive layer is greater than a distance between the lower surface of the magnetic tunnel junction pattern and a lower surface of the third conductive layer.
19 . A semiconductor device comprising:
a wiring;
an insulating layer on the wiring; and
a contact structure passing through the insulating layer,
the contact structure including
a first conductive layer,
a second conductive layer in an opening passing through the first conductive layer,
a third conductive layer on the second conductive layer in the opening, and
a natural oxide film surrounding the second conductive layer, the first to third conductive layers including metal or metal nitride,
the natural oxide layer including metal oxide, and
the wiring being in contact with the first conductive layer and electrically connected to the second and third conductive layers.
20 . The semiconductor device of claim 19 , wherein
the wiring includes tungsten, and
the first to third conductive layers include titanium nitride.