IP Library Granted Patent US 12713633
Granted Patent B2
US 12713633 · App. 18/557,092 · Granted Aug 18, 2026

Semiconductor circuit

Inventors: Takatoshi Tojo (Hyogo, JP); Minoru Tsukazaki (Hyogo, JP); Naoyuki Tsukamoto (Hyogo, JP); Shizuo Fujita (Hyogo, JP)
Assignee: OTOWA ELECTRIC CO., LTD.
H10D8/60
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Quick Facts
Patent No.
US 12713633
App. No.
18/557,092
Granted
Aug 18, 2026
Kind
B2
Abstract

Provided is a semiconductor circuit capable of protecting a semiconductor device that operates at a low voltage from a harmful pulse. A semiconductor circuit included in the semiconductor device has a semiconductor element 1 including: a first n-type semiconductor layer; a metal layer; and a Schottky barrier between the first n-type semiconductor layer and the metal layer, wherein the semiconductor element 1 is in forward connection between a signal line of the semiconductor device and a ground.

Claims (10)

1 . A semiconductor circuit comprised in a semiconductor device, the semiconductor circuit having a semiconductor element including:

a first n-type semiconductor layer;

a metal layer; and

a Schottky barrier between the first n-type semiconductor layer and the metal layer, wherein

the semiconductor element is in forward connection between a signal line of the semiconductor device and a ground, and

the semiconductor element comprises, between the first n-type semiconductor layer and the metal layer, a second n-type semiconductor layer that is different in composition from the first n-type semiconductor layer and is larger in bandgap than the first n-type semiconductor layer.

2 . The semiconductor circuit according to claim 1 , wherein at least one of the first n-type semiconductor layer and the second n-type semiconductor layer contains one or more doping elements selected from a group consisting of Al, Si, Mg, Zn, In, Ga, Ge, and Sn.

3 . The semiconductor circuit according to claim 1 , wherein the first n-type semiconductor layer is formed of an oxide or a nitride containing at least one selected from a group consisting of Ga, In, Sn, Mg, Zn, Al, and B, or a compound thereof.

4 . The semiconductor circuit according to claim 1 , wherein the metal layer is formed of one or more elements selected from a group consisting of Ti, Ni, Pt, W, Mo, Au, Ta, Cu, Fe, Ag, and Cr, or an alloy thereof.

5 . The semiconductor circuit according to claim 1 , wherein a forward rising voltage of the semiconductor element is a voltage higher than an operating voltage of the semiconductor device.